Service Manuals, User Guides, Schematic Diagrams or docs for : Compal Compal_LA-5812P
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A B C D E
MODEL NAME: NAP10
1
PCB NAME: LA-5812P MB 1
COMPAL P/N:
2 Schematics Document 2
Phantom Calpella
Arrandale ULV BGA + Ibex PCH
DISCRETE VGA N11P-GS1 (Switchable Graphics)
3 3
2010-04-19
Rev: 1.0
4 4
Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2009/07/25 Deciphered Date 2010/07/25 Title
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Cover Sheet
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS Custom LA-5812P 1.0
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Date: Monday, May 10, 2010 Sheet 1 of 55
A B C D E
A B C D E
Clock Generator
Compal Confidential IDT: 9LRS3199AKLFT
Model Name NAP10 SILEGO: SLG8SP587
133/120/100/96/14.318MHZ to PCH
File Name : LA5812P Fan Control
page 37
27MHZ to N11P
page 4
1 1
100MHz PCI-E 2.0x16 5GT/s PER LANE
PEG(DIS) Intel Memory BUS(DDRIII)
Nvidia N11P-GS1 133MHz Dual Channel 204pin DDRIII-SO-DIMM X2
HDMI(DIS) LVDS(DIS) Arrandale BANK 0, 1, 2, 3 page 11,12
1.5V DDRIII 800
page21, 22,23,24,25,26,27
DP(DIS) 6.4G/8.5G/10.6G
100M/133M/166M(CFD)
Processor
BGA1288
page 5,6,7,8,9,10
USB conn x2 Bluetooth CMOS MINI Card x2
FDI x8 DMI x4 USB port 2 Left
(UMA) USB Port 1 (sub board)
Conn Camera WWAN USB port 4
HDMI HDMI Conn. DP Conn. DP LVDS Conn. LVDS USB port 8 USB port 9 WLAN USB port 5
100MHz 100MHz USB port 0 (sub board)
SW 30
page page 30 page 31
SW
page 31 page 29
SW
page 28 2.7GT/s 1GB/s x4
page 35 page 35 page 29 page 32
2 USBx14 3.3V 48MHz 2
LVDS(UMA)
Intel 3.3V 24MHz
DP(UMA) HD Audio
Aline FX/ELC
Ibex Peak-M Silion LABS
HDMI(UMA) SATA x 6 (GEN1 1.5GT/S ,GEN2 3GT/S) C8051F347 page38
PCI-Express x 8 (ABD PCIE1 2.5GT/S CKD PCIE1/2 2.5/5GT/S) 100MHz PCH SFF HDA Codec
page 13,14,15,16,17
18,19,20 ALC665
port 5 port 2,4 port 1 SPI IO Board
Right light
3 IN 1 Conn. Card Reader MINI Card x2 LAN(GbE) port 0 LED board
page34
JMicron WLAN, WWAN Atheros AR8132 SATA HDD APA2031
1394 Conn. JMB380 10/100 M page33 SPI ROM x1 Left light
page 32 Conn. Audio AMP
page34 page34 page 13
page 37 LED board
IO Board
RJ45 LPC BUS Power light
3 3
Power key board
page 33
33MHz
Phone Jack x3 Int. Speaker
IO Board IO Board LOGO light
ENE KB926 LOGO board
page 36
NAP10 Sub-board
RTC CKT. LS-5811P LS-5815P Function light
FUN/B RIGHT LED/B Function board
page 40
page page Touch Pad Int.KBD
page 39 page 36
Power On/Off CKT. LS-5812P LS-5816P
LED/B LEFT LED/B
page 38 page 38 page EC ROM
page 36
LS-5813P
DC/DC Interface CKT. PWR/B
page 38
4 4
page 40
LS-5817P
USB/B
Power Circuit DC/DC page
Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2009/07/25 Deciphered Date 2010/07/25 Title
page Block Diagrams
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
B 1.0
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
LA-5812P
Date: Monday, May 10, 2010 Sheet 2 of 55
A B C D E
5 4 3 2 1
( O MEANS ON X MEANS OFF )
Voltage Rails
+5VS
B+ +5VALW +1.5V
+3VS
+3VALW
+0.75VS
VL
power +1.05VS
plane +1.05VS_VTT
D
+VCC_CORE D
+VCC_GFXCORE
+1.5V_CPU_VDDQ
+1.8VS
+3VS_DELAY
State
+1.8VSDGPU
+1.05VSDGPU
+1.5VSDGPU
+VGA_CORE
S0
O O O O
I2C / SMBUS ADDRESSING
S1
O O O O
DEVICE HEX ADDRESS
S3
O O O X EC_SMB_CK1 Battery 16 00010110
EC_SMB_DA1
C C
S5 S4/AC
O O X X EC_SMB_CK2 CPU THERMAL SENSOR (EMC1412A-1-ACZL) F8 11111000
EC_SMB_DA2
S5 S4/ Battery only CPU(PCH)INTERNAL THERMAL SENSOR 96 10010110
O X X X
CPU(PCH)INTERNAL THERMAL SENSOR 98 10011000
S5 S4/AC & Battery GPU THERMAL SENSOR (ADM1032ARMZ) 9A 10011010
don't exist X X X X (PCH_SML1BCLK)
(PCH_SML1DATA) GPU INTERNAL THERMAL SENSOR 9E 10011110
WWAN
WLAN
PCH_SMBCLK CLOCK GENERATOR (EXT.) D2 11010010
Symbol Note : PCH_SMBDATA
DDR Memory
Free Fall sensor 38 00111000
: means Digital Ground
B B
: means Analog Ground
@ : means just reserve , no build
CONN@ : means ME part.
45@ : means install after SMT.
A A
Security Classification Compal Secret Data Compal Electronics, Inc.
Issued Date 2009/07/25 Deciphered Date 2010/07/25 Title
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Notes List
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
Size Document Number Rev
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS Custom LA-5812P 1.0
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Date: Monday, May 10, 2010 Sheet 3 of 55
5 4 3 2 1
5 4 3 2 1
+3VS +3VS_CK505
L1
1 2 +1.05VS
BLM18AG601SN1D_0603~D
10U_0805_10V4Z~D
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1 1 1
1
47P_0402_50V8J~D
1
C1
C2
C3
C3
C1186
@R8
@ R8
@ +3VS 4.7K_0402_5%~D
2 2 2
2
L15
2
D H_STP_CPU# 1 2 D
1 2 @ R1 10K_0402_5%~D CLKREF
BLM18AG601SN1D_0603~D REF_O/CPU_SEL
1
CLKREF PIN 30 CPU0 CPU1
+3VS_+1.5VS_VDD R10
1 1(0.7~1.5v) 100MHz 100MHz 10K_0402_5%~D
L38
+1.5VS 1 2 @C9
@C9 0 (DEFULT) 133MHz 133MHz
2
BLM18AG601SN1D_0603~D 10P_0402_50V8J~D
2
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1 1 1
10U_0805_10V4Z~D
1 EMI
C4
C5
C6
C6
47P_0402_50V8J~D
1
C371
C1187
2 2 2 @
2
2
+CLK_VDD_IO CAN BE RANGE FROM 1.05V TO 3V
+3VS_CK505 +1.05VS_CK505 +3VS_CK505 +1.05VS_CK505
+1.05VS_CK505 U1
+3VS_+1.5VS_VDD
1 32 MEM_SMBCLK
VDD_DOT SCL MEM_SMBCLK 11,12,35
+1.05VS 1 2 0_0404_4P2R_5% 2 31 MEM_SMBDATA
VSS_DOT SDA MEM_SMBDATA 11,12,35
L2 CLK_BUF_DOT96 1 4 L_CLK_BUF_DOT96 3 30 CLKREF 2 1 R662 CLK_PCH_14M
14 CLK_BUF_DOT96 DOT_96 REF_0/CPU_SEL CLK_PCH_14M 14
10U_0805_10V4Z~D
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
C BLM18AG601SN1D_0603~D CLK_BUF_DOT96# 2 3 L_CLK_BUF_DOT96# 4 29 33_0402_5%~D C
14 CLK_BUF_DOT96# DOT_96# VDD_REF
47P_0402_50V8J~D
1 1 1 1 RP13 5 28 CLK_XTAL_IN
VDD_27 XTAL_IN
C1188
6 27 CLK_XTAL_OUT
27MHZ XTAL_OUT
C7
C7
C8
C10
@ 7 26
27MHZ_SS VSS_REF CLK_PWRGD
8 VSS_27 CKPWRGD/PD# 25
2 2 2 2
0_0404_4P2R_5% 9 24 0_0404_4P2R_5%
CLK_BUF_CKSSCD L_CLK_BUF_CKSSCD VSS_SATA VDD_CPU R_CLK_BUF_BCLK
14 CLK_BUF_CKSSCD 1 4 10 SRC_1/SATA CPU_0 23 1 4 CLK_BUF_BCLK CLK_BUF_BCLK 14
14 CLK_BUF_CKSSCD# CLK_BUF_CKSSCD# 2 3 L_CLK_BUF_CKSSCD# 11 22 R_CLK_BUF_BCLK# 2 3 CLK_BUF_BCLK#
SRC_1#/SATA# CPU_0# CLK_BUF_BCLK# 14
RP14 12 21 RP12
CLK_BUF_EXP CLK_BUF_EXP_R VSS_SRC VSS_CPU
14 CLK_BUF_EXP 1 4 13 SRC_2 CPU_1 20
14 CLK_BUF_EXP# CLK_BUF_EXP# 2 3 CLK_BUF_EXP_R# 14 19
RP15 SRC_2# CPU_1#
15 VDD_SRC_IO VDD_CPU_IO 18
0_0404_4P2R_5% H_STP_CPU# 16 17 +3VS_+1.5VS_VDD
CPU_STOP# VDD_SRC
TGND
Integrated 33ohm Resistor
ICS9LVS3185_QFN32_5X5
33
+3VS
1
R4
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