Service Manuals, User Guides, Schematic Diagrams or docs for : AMD 32587A_sc3200_d3_d33_diff

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AMD GeodeTM SC3200 Processor
Silicon Revision D3 to D3.3
Differences

1.0       Scope
The purpose of this document is to describe the differences   2.1.2     Pb-Free Package Improvement
between silicon revision D3 and D3.3 of the AMD GeodeTM       The Pb-free package requires a higher soldering tempera-
SC3200 processor. Hence, providing the system designer        ture. A small change was made on the top metal layer to
with the necessary information to migrate from revision D3    reduce the increased stress on the die due to the increased
to D3.3. Each difference notes if there are any hardware or   soldering temperature. This change is not a functional
software implications specifically related to upgrading a     change.
revision D3 designed motherboard to revision D3.3 silicon.
                                                              

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