Service Manuals, User Guides, Schematic Diagrams or docs for : Agilent 5953-4435 The Handling and Bonding of Beam Lead Devices Made Easy - Application Note c20131209 [7]

<< Back | Home

Most service manuals and schematics are PDF files, so You will need Adobre Acrobat Reader to view : Acrobat Download Some of the files are DjVu format. Readers and resources available here : DjVu Resources
For the compressed files, most common are zip and rar. Please, extract files with Your favorite compression software ( WinZip, WinRAR ... ) before viewing. If a document has multiple parts, You should download all, before extracting.
Good luck. Repair on Your own risk. Make sure You know what You are doing.




Image preview - the first page of the document
5953-4435 The Handling and Bonding of Beam Lead Devices Made Easy - Application Note c20131209 [7]


>> Download 5953-4435 The Handling and Bonding of Beam Lead Devices Made Easy - Application Note c20131209 [7] documenatation <<

Text preview - extract from the document
                                                                      The Handling and
                                                                      Bonding of Beam Lead
                                                                      Devices Made Easy
                                                                      Application Note

Introduction                                                                                           710 (28)
                                                                                                       670 (27)
Beam lead devices are particularly suited for hybrid integrated                                                       225 (9)               225 (9)
                                                                               225 (9)                 250 (10)
circuits where low parasitics and small size are prime                         200 (8)                  200 (8)       200 (8)               175 (7)
requirements. Available as single units or monolithic quads,
the beam lead devices have made high packing density and
superior performance easily achievable in hybrid circuits.                                                                      130 (5)
There are single beam lead devices in four different                                                                            100 (4)

outlines--05 and 10 for Schottky diodes, 06 and 07 for PIN
diodes. A picture of the HPND-4001 PIN diode in outline
07 appears in Figure 1. As typical of the single beam lead                                                                      12 (0.48)
                                                                                                                                 8 (0.32)
devices, this beam lead PIN diode consists of a silicon chip
with coplanar plated gold tabs (beam leads measuring barely
5 mils wide and 0.5 mil thick) 9 mils beyond the edge. The
detailed dimensions of outline 07 shown in figure 2 illustrate
the small size of the beam lead package, which results in             Dimensions in 



◦ Jabse Service Manual Search 2024 ◦ Jabse PravopisonTap.bg ◦ Other service manual resources online : FixyaeServiceinfo