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HEWLETT PACKARD
OPERATING AND SERVICE MANUAL
8671A
SYNTHESIZER
(Including Options 002, 003 and 005)
SERIAL NUMBERS
This manual applies directly to instruments with
serial numbers prefixed 1704A.
With the changes described in Section VII, this
manual also applies to instruments with serial
numbers prefixed 170IA, 1702A, and 1703A.
For additional important information about serial
numbers, see INSTR'UMENT COVERED BY
MANUAL in Section I.
COPYRIGHT AND DISCLAIMER NOTICE
Copyright - Agilent Technologies, Inc. Reproduced with the permission of Agilent
Technologies Inc. Agilent Technologies, Inc. makes no warranty of any kind with regard
to this material including, but not limited to, the implied warranties of merchantability
and fitness for a particular purpose. Agilent Technologies, Inc. is not liable for errors
contained herein or for incidental or consequential damages in connection with the
furnishing, performance, or use of this material or data.
SYNTHESIZER
instrum& containing improvements made after the printing o? the manual.
To ufic this supplement:
Make all ERRATA corrections
Make all appropriate Serial "umber related changes indicated in the tables below.
1 through 10
1 through 6
ERRATA
Pa@ 1.4, Paragraph 1.42:
Add: If the instrument rack mounting slides are to be mounted in a standard &LA. rack, then B" adapter
(HP part number 1494.0023) is needed. The slides without the adapter ca" be directly mounted in
the Hewlett-Packard system enclosures.
CPage 4-14, PROCEDURE, step 4:
Change i" the last sentence 0.17 Vrms to 0.017 Vrms.
) Page 4-23, Paragraph 4.23, DESCRIPTION:
Change in the first sentence, 100 MHz OUT to 10 MHz OUT.
Page 5.9, PROCEDURE, Step 7 (Table of A3AlA2L4 Inductor Values):
Change the HP part number of the .68 pH inductor to 9140-0141.
Ic Page R-43, Figure S-35, (Service Sheet 3~A2):
Change in lower right comer, the off page connection to CE) 9"AS.
Page 8.51, Figure 8-47 (Service Sheet 7.A2):
Delete, on A2AlOU25, the connections between pins 1 and 2, 3 and 4, 5 and 6,7 and 12. Show pins 2,4,5,
a"d 1.2 as no connection (NC).
27 March
8 Pages
Model 8671A
CONTENTS
Section Section Page
1 GENERAL INFORMATION l-l 3.38. Receiving the Trigger Message 3.11
1.1. Introduction .................... 1.1 3-40. Receiving the Clear Message 3"ll
1.7. Specifications ................... l-l 3.42. Receiving the Remote Message 3.I,1
1.9. Safety Considerations .............. 1.1 3.44. Receiving the Local Message 3.11
l"13. Inslruments Covered by Manual ....... 1-l 3-46. Receiving the Local Lockout Message 3"12
1..17. Manual Change Supplements, 1.1 3.48. Receiving the Clear Lockout/Set Local
l"20. Description ..................... l-4 Message 3"12
l-22. Frequency .................... 1.4 3"50. Receiving the PassControl Messnge 3.12
l"25. ou1put Level .................. l-4 3-52. Sending the Require Service Message 3.12
I..27. Frequency Modulation ........... 1.1 3.54. Sending the Status Byte Message S-J.2
J-30. Miscellaneous Outputs and Indicators 1.4 3.58. Sending the Status Bit Message 3-13
1.33. Remote Operation .............. l-4 3.60. Receiving the Abort Message 3.13
1.35. Optiulls ....................... l-4 3-62. Programming Quick Reference Guide 3"13
1.36. I':lectrical Opliuns ............... 1-4 3-64. Programming Examples 3.13
1.40. Mechanical Options .............. I,-4
1..46. HP-IH Compatibility ............... l-5
IV PERFORMANCE TESTS ............. 4-l
1.49. Selecting the HP-Ii3 Address l-5
4-l. Introduction ..................... 4-l
1.51. Accessories Supplied ............... l"5
4.3. Equipment Required ................ 4.1
1.53. Equipment Required But Not Supplied ... 1.5
4.5. Test Record. ..................... 4-J
1.57. Equipmenl Available ............... 1-5
4.7. Calibration Cycle .................. 4-l
l-62, I~ecommended Test Equipment. ....... l"6
4.9. Abbreviated Performance Testing ....... 4-l
II INSI',ALIATION ................. 2.1 4.11. Operational Verification Checks ........ 4-l
2.1. Introductiorl .................... 2-J 4.12. RF Output Level and Flatness. ......... 4.3
2.3. Initial Inspection ................. 2-J 4.13. Harmonics. ...................... 4-4
2.5. Preparation For USC 2-l 4~14. SWR .......................... 4-4
2.6. Power Requirements ............. 2.1 4.15. FM Accuracy ..................... 4-l
2.8. Line Voltage and Fuse Selection 2-J 4.16. Non.Harmonically Related Spurious 4.8
2.10. Power Cablr .................. 2.2 4"ll. Power tine Related Spurious .......... 4-9
2.12. I-II'-IB Address lhe Parallel Poll Response 4.18. Single-Sideband Phase Noise Ratio ....... 4.10
Selection 2.2 4.19. FM Frequency Response ............. 4~13
2.16. Mating Connectors .............. 2.4 4.20. FM Harmonic and Non-Harmonic pislortion I-15
2.19. Operating F,nvironment ........... 2-4 4.21. Residual FM in FM and CW Modes ....... 4.18
2.21. Bench Operation ............... 2.4 4~22. Frequency Switching Time ............ 4.20
2.23. Rnck Mounting ................ 2.4 4.23. Internal Time Base Aging Rate ......... 4.23
2.25. Storage and Shipment 2-6
2.26. Environment .................. 2.6
V ADJUSTMENTS. 5-J
2.26. Packaging .................... 2-6
5-1. Introduction 5-l
III OPERATION. ................... 3.1 5.5. Safety Considerations 5-l
3-l. Inlruduclion .................... 3.1 5.1. Equipment Requited 5.1
3.4. Panel Features ................... 3-l 5.11. Factory Selected Comporwnts 5-J.
3.6. Operator's Maintenance 3-J 5.13. Related AdIustmcnts 5-J
3-R. r,ocal operation .................. 3.1 5.18. Adjustment Locations 5"l
3.10. Local Operator's Check ........... 3-l 5.20. A3 RF Sduree Assembly Adjustment 5-4
3.12. Local Operating Instructions 3-l 5"21. Power Supply Adjustments. 5-4
3.14. Remote (HY.IB) Operation ........... 3-J 5.22. 10 MHz Reference Oscillator Adjustment 5.5
3.1% Compatibility ................. 3-l 5-23. Digital-to-Analog Converter Adjustment 5-6
3.21, LocnllRemot~ and Remote/Local Mode 5.24. YTO Driver Adjustment. 5.1
Changes .................... 5"25. VoltageControlled Crystal Oscillator
3.26. DATA Messages ................ (VCXO) Adjustment
3.28. Receiving IIATA Mcssagcs 5.26. M/N Loop Adjustments
3.36, Sending lhe Data Message .......... 5-27. Y'X'OLoop Sampler Adjustmenls
ii
Model 8671A Contents
CONTENTS (Cont'd)
Section Section Page
5.28. YTO Loop Offset and FM Overmodulation 7.7. Instrument Improvements ............... 7-3
Adjustments 5.15 7.11. Instrument Improvement Modification
5.29. YTO Loop Phase Detector Adjustment 5"17 Instructions ........................ 7.3
5.30. FM Driver Adjustment 5-19
5-31. A2 Controller Assembly Adjustments 5.20 VIII SERVICE .......................... 8-l
5-32. 160-240 MHz (20130 MHz or LFS Loop) 8.1. Introduction ........................ 8-l
VCO Prctune Adjustments 5-20 8.5. Safety Considerations .................. 8.1
5.33. 20/30 Mnz (LFS) Loop Divider Bias 8.11. Principles of Operation ................. 8.1
Adjustments 5.21 8.13. Troublesbooting ...................... 8-l
5.34. A2A4 Assembly Notch Filter Adjustment 5-29 8.14. Arrangement in Manual ............... 8.1
5-35. Al RF Output Assembly FM Sensitivity 8.16. Supplemental Troubleshooting Aids ....... 8-l
Adiustment 5-24 8.20. Recommended Test Equipment ............ 8.5
S.22. Service Aids. ........................ 8-5
8.27. Repair ............................ S-5
VI REPLACEABLE PARTS 6.1
8.29. Factory Selected Components. .......... 8-5
6.1. Introduction 6-l
8.31. Non-Field Repairable Assemblies ......... 8.5
6-3. Excharlge Asfiemblips 6-l
8.33. Module Exchange Program ............. S.5
6-5. Abbreviations 6.1
8.35. After Service Product Safety Checks ...... 8-6
6.1. Replaceable Parts List 6-l
8.41. Disassembly and Reassembly Procedures .... 8-6
6.11 Ordering Information 6-l
8.52. Logic Symbols ...................... S-10
6-14 spare Parts Kit 6-l
8.54. Qualifiers ....................... 8.11
8.56. Indicator Symbols ................. Kll
VII MANUAL CHANGES 7-l 8.58. Contiguous Blocks ................. 8.11
7.1. Introduction I-l E-60. Dependency Notation ............... 8-11
7-3. Manual Changes 7-l 8.62. Common Control Block .............. 8-14
7-6. Manual Change Instructions 7.1 8"64. Complex Devices .................. 8-14
SERVICE SHEETS
Service Sheet Page
1 Overall Troubleshooting Rlock Diagram 8.29 12.A2 P/O Front Panel Assembly 8.60
2 A3 RF Source Assembly 8-30 13.A2 P/O Front Panel Assembly 8-62
3 A2 Controller Assembly 8.34 l-A3 Reference Phase Lock Assembly 8.64
l.Al AlAl Front Panel Assembly. 8.36 2~A3 100 MHz VCXO Assembly 8-66
l-A2 20130 MHz Divider Assembly 8.38 3-A3 M/N Phase Detector Assembly 8.68
2.A2 20/30 MHz Phase Detector Assembly 8.40 4-A3 M/N VCO Assembly 8-70
3.A2 VCO 160-240 MHz Assembly 8-42 5.A3 M/N Output Assembly 8-72
4.A2 HP-In Address Assembly 8.44 6.A3 Digital-to-Analog Converter 8-74
5.A2 P/O HP.IB Interface Assembly 8.46 7.A3 YTO Main Coil Driver 8-76
6.A2 P/D IntexKace Assembly 8.48 %A3 YTO Sampler Assembly 8.78
7.A2 Ilegistex 1 Assembly 8-50 9-A3 YTO Phase Detector Assembly 8.K
8.A2 P/O Timing and Control Assembly 8.52 IO-A3 FM Driver Assembly 8.82
9.A2 P/O Timing and Control Assembly 8.54 11.A3 Rectifier Assembly 8~84
lo-A2 P/O Output Register Assembly 8.56 12.A3 Positive Regulator Assembly 8-86
Il-AZ P/O Output Regsiter Assembly 8.58 13.A3 Negative Regulator Assembly 8-88
Model. 8671A
ILLUSTRATIONS
FIgwe Page
1"l. Mudcl 8671A and Accessories Supplied 5.11. 20130 MHz Loop Divider Bias Adjustment
l-2. Special Interconnect Cable Test Setup. 5.22
5.12. A2A4 Assembly Notch Filter Adjustment
Test Setup. 5.23
2-l. Line Voltage and Fuse Selection 2.1
5-18. FM Sensitivity Adjustment Test Setup 5.24
2.2. Power Cable and Mains Plug Part Numbers 2-2
2.3. Locatiorl OK IIY.IB Address and 6"l. Al Assembly, Front Panel Mechanical Parts 6.6
Parallel Poll Switches, . 2.4 6-2. A2 Assembly, Front Panel Mechanical Parts. 6-20
2-4. Hewlett-Packard Interface Bus Connection 2-5 6.3. Synthesizer Chassis Parts 6.41
8.1. Schematic Diagram Notes 8-2
3.1 Front Panel Connectors, Controls; Switches 8.2. Rear Panel of the Synthesizer 8-7
and Displays 3-2 8-3. A2 Assembly Front Panel Fully Extended 8.8
3-2. Rear Panel Controls, Connectors, and 8.4. httom of the Synthesizer 8-9
Indicators 3.3 3"5. A3A9 Assembly in Service Position R-10
3.3. Operator's Frequency and Modulation 3.6. Qualifiers S-11,
Checks Test Setup 3-5 8.7. Contiguous Blocks 8-11
3-4. r`xequency Prugramming '3.10 8.8. Indicator Symbols S-12
3.5. Typical Freqoency Switching Time for the 8-9. AND Dependency Notation 8"13
8671A Synthesizer Showing Worst Case OR and Free Dependency Notation 8.13
S-10.
Lock and Settling Times 3"12 8.11. AND Dependency Notation, Coder Example
Programming Examples 3.14 using Letters 8.13
8.12. Common Control Block 8.14
4-l. Typical Output Power from 8671A 4-2 8.13. Quad D-Type Latch (Individual) 8.14
4.2. SWR Test Setup 4.5 8.14. Quad D-Type Latch (Combined) S-14
4-3. FM Accurtxy Test Setup 4.7 S-15. Quad D.Type Latch Example S-14
4.4. Power Line Related Spurious Test Setup 4-9 S-16. Multiplexer (AND.OR Selected) Example S-15
4-5. Signal-to-Phaw Noise Retiu Test Setup '4-u 8.17. Shift Register Example 8-15
4-6. FM Frequency Response `Test Setup 4.13 S-18. Up.Down Counter Example 8-15
4.7. FM Dietortiorl Test Setup 4.15 E-19. Synthesizer's Simplified Block Diagram 8-24
4.8. Residual FM in FM and CW Modes 8.20. Major Afisembly Locations 8.24
Test Setup. 4.18 8-21. Overall Troubleshooting Block Diagram 8-29
4.9. Frequency Switching Time Test Setup 4-21 E-22. A3 RF Source Assembly Troubleshooting
4-10. Internal Time Base Aging Rate Block Diagram 8-33
Test Setup. 4.24 8.23. A2 Controller Assembly Troubleshooting
Rlock Diagram 8.35
5-s. 10 MHz Reference Oscillator Adjustment 8.24. Al RF Output Assembly Block Diagram 8.37
`hst Setup. 5.5 3.25. AlAl Front Panel Assembly Component,
5.2. VCXO Adjustment Test Setup 5.8 Adjustment, and Test Point Locations 8.31
5.3. M/N Loop Adjustment Test Setup 5"ll 3.26. AlAl Front Panel Assembly
5.4. YTO Loop Sampler Adjustment Schematic Diagram 8.37
Test Setup. 5.13 8-21. A2A5 ZOj30 MHz Divider Assembly
5-5. Typical Swept Frequency Response at Component, Adjustment and Test Point
A3A9A5TPl (Frequency span per Location 8-38
division 20 MI-Ii;) 5.14 8.28. 20130 MHz Divider `Block Diagrams 8-39
5.6. YTO Loop Of&t and FM Overmodulation 8.29. 20/30 MHz Divider Assembly
Adjustment Test Setup 5.15 Schematic Diagram 8-39
YTO Loop Offset Adjustment Waveforms 5-16 8-30. A2A4 20/30 MHz Phasp Detector Assembly
YTO Loop Phase Detector Adjustment Component, Adjustment, and Test Point
`Test Selup Locations 8-40
Spectrum Analyzer Display of Phase-Locked 8-31. ZOj30 MHz Phase Detector Block Diagrams 8.41
LoopGain...................... 8-32. 20130 MHz Phase Detector Assembly
0/I Driver Adjustment Tebt Setup Schematic Diagram S-41
Model 8671A contents
ILLUSTRATIONS (Cont'd)
Figure Page
8.33. A2A3 160-240 MHz Assembly Component 8-66. A3AlAl Reference J'hase Lock Board
Locations R-42 Assembly Component and Test Point
8.43. VCO 160-240 MHz Lllock Diagrams 8-43 Locations 8-64
8~35. VCO `160-240 MHz Assembly Schematic 8-67. Hefexsnce Phase Lock Block Diagrams 8.65
Diagram 8-48 8"68. Refcrencc Phase Lock Assembly Schematic
H-36. KM9 HP-IB Addresfi Assembly Cumponent Diagram 8-65
Localiuns 8.44 8-69. A3AlA2 100 MHz VCXO Assembly
8.37. HP-It< Address Block Diagrams 8.45 Component, Adjustment, and Test
8-38. HP-ID Address Assembly Schematic Diagram 8-45 Point Locations 8-66
H-39. P/O h2h7 Interface Assembly Component 8.70. 100 MHz VCXO Block iliagxams 8-67
and Tesl Point Locations 8.46 8-71. 100 MHz VCXO Assembly Schematic
8.40. P/O Jntexfnce Block Dia@ams 8.47 Diagram 8-81
8-11. P/O HP-Ii3 Interface Assembly Schematic 8.72, A3AlA3 M/N Phase Detector Assembly
Diagram 8-47 Component and Test Point Locations 8-68
&i"42. P/O A2Al interface Assembly Component s-73. M/N Phase Deteclur Block Diagrams. 8.69
Locations 8.48 8.74. M/N Phase Detector Assembly Schematic
M-43. P/O lntsrface Block Diagrams 8.49 wiagxam 8.69
8.44. P/O Interface Assembly Schematic Diagram 8-49 8-75. A3AlA4A2 M/N VCO Board Assembly
H"45. A2A10 Register 1 Assembly Component Component, Adjustment, and Test Point
Locations 8-50 Locations 8.70
H-16. Register 1 block Diagrams 8-51 8.76. M/N VCO Rlock Diagrams. 8-71
8.47. Register 1 Assembly Schematic Diagram 8-51 8-77. M/N VCO Assembly Schematic Diagram 8-71
H-48. P/O A2All Timing and Control Assembly 8.78. A3AlA5 M/N Output Assembly Component
Componenl and Test Point Locations 8-52 Locations 8-72
P/O Timing and Control Block Diagrams 8-53 8.79. M/N Output Block Diagrams. 8-78
P/O Timing and Corltrul Assembly Schematic 8.80. M/N Output Assembly Schematic Diagram 8-73
Diagram 8-53 8.81. A3A5 DAC Asscmhly Component,
H-51. U/O A2All Timing and Control Assembly Adjustment, and Test Point Locations H-14
Component and Test Point Localiuns 8-54 8.82. Wigital-Lo-Analog Converter Block
U/O Timing and Control Block Diagrams R-55 Diagrams. 8-75
P/D Timing and Control Assembly Schematic S-83. Digital.to.Analog Converter Schematic
Diagram 8.55 Diagram 8"75
8-54. P/O A2A8 Output Register Assembly 8.84. A3A6 YTO Main Coil Driver Assembly
Component and `Test Point Locations 8-56 Component, Adjustment, and Test Point
8.55. P/O Ch~lpul Register Klock Diagrams 8.57 Localions 8-76
M"5ti. P/O Output Register Assembly Schematic 8.85. YTO Main Coil Driver Block Diagrams 8.77
Diagram 8-57 8.86. YTO Main Coil Driver Schematic Diagram 8.77
8.57. V/O h2AM Output llegister Assembly 8.87. A3A9A5 YTO Sampler Assembly Component
Cumpununt and Test Point Locations 8.58 Adjustment, and Test Point Locations R-78
8-58. P/O Output Kegister Block Diagrams 8.59 8.88. YTO Sampler Block Diagrams 8.79
8.59. P/O Oolpul Register Assrmhly Schematic S-89. YTO Sampler Assembly Schematic
Diagram 8-59 nisgram 8.79
MO. I'/0 A2Al Krront Panel Assembly Component S-90. ABAYA4 YTO Phase Detector Assembly
Lucations 8.60 Component, Adjustment, and Test Point
8-61. P/O Front Parwl Block Diagrams 8.61 Locations ; sao
8.82. P/O Front Panel Assembly Schematic 8-91. YTO Phase Detector Block Diagrams R-81,
Diagram 8.61 8.92. YTO Phase Detector Assembly Schematic
8.63. P/O A2Al Front Panel Assembly Diagram 8-81
Component Locatiorrs 8.62 R-93. A3A7 FM Driver Assembly Component,
8.64. P/O Pront Panel Block Diagrams 8.63 Adjustment, and Test Point Locations 8-82
8-65. P/O Front Panel Assembly Schfmatic 8.94. FM Driver Block Diagrams 8.83
DiaKram 8-63 8.95. FM Driver Assembly Schematic Diagram 8.83
contents Model 8671A
ILLUSTRATIONS (Cont'd)
Figure Page Figure Page
8.96, A3A2 Rectifier Assembly Component 8.109. A2A12 Motherboard Assembly Component
Adjustment, and Test Point Locations 8.84 Locations 8.91
8~91. Ilcctifier Block Diagrams 8-85 8.110. A3A10 RF Source Motherboard Component
8.98. Rectifier Assembly Schematic Diagram 8.85 Locations 8-93
8.99. A3A3 Positive Regulator Assembly, 8.111. A8AlA6 Reference and M/N Motherboard
Component, Adjustment, and Assembly Component and Connector
Test Point Locations 8-86 Locations 8.93
R-100. Positive Regulator Block Diagrams 8-87 8.112. A3 Plug-in Circuit Board Adjustment and
8.101. Positive Regulator Assembly Schematic Test Point Locations 8-93
Diagram 8.87 8.113. A3A9 Assembly Locations 8-95
8~102. A3A4 Negative Regulator Assembly 8.114. A3A9 Cable Connections 8-95
Component and Test Point Locations 8-88 8.115. Major Assembly Locations 8-95
8.103. Negative Regulator Block Diagrams 8.89 8.116. Bottom View Assembly Locations 8.95
8.104. Negative Regulator Assembly Schematic 8.117. Major Assembly Locations 8.97
13iagram 8-89 E-118. Top View Assembly Locations 8-97
8.105. Rem& Operator's Checks Test Setup 8-90 8.119. Top View Chassis Mounted Parts and
8.106. AI to A2 Interconnections 8.90 Assembly Locations 8.97
B"107. AI to A3 Interconnections 8.90 8.120. Top View A2 and A3 Assemblies Adjust-
8.108. Major Assembly Locations 8-91 ments and Test Point Locations 8.91
TABLES
Table Page Table Page
Specifications l"2 5"l. Factory Selected Components. ......... 5-2
Recommended Test Equipment. 1-6 5.2. Performance Test Failure and Required
Action ........................ 5-2
USA Standard Code for Information 5-3. Related Adjustments ................ 5.3
Interchange (ASCII) 2-3
6-l. Part Numbers for Exchange Assemblies 6-2
6.2. Reference Designations and Abbreviations. 6.3
3.1. Front Panel Features .. .............. 3-2
6-3. Replaceable Parts 6-5
3-2. Rear Panel Features ................... 3-3
6-4. Code List of Manufacturers 6.48
3.3. Local Operator's Checks ................ 3.4
3-4. Local Operating Instructions .............. 3-6
l"1. Manual Changes 7-l
3-5. Message Reference Table ................ 3-9 1.2. Summary of Changes by Component 7-4
3.6. Frequency Program Codes and Arguments. ... 3.10
3-7. FM Program Codes and Arguments ...... 3-11
8-l. HP-IB Diagnostic Program 8-16
3.8. RF Output Program Code ........... .. 3.11 8.2. Front Panel Status Annunciators 8"25
3-9. Programming Quick Reference Guide ....... 3-16
8-3. Overall Troubleshooting 8-26
8.4. M and N Numbers and Resulting Frequencies 8.31
Record of Operational Verification Checks 4-3 8.5. Remote Operator's Check 8.90
Harmonic Level versus Percentage 8-6. Controller Assembly (A2) Interconnections 8.91
Distortion 4-11 8.7. Motherboard Assembly (A3AlO)
Performance Test Record 4-26 8.93
vi
Model 8671A Safety Considerations
SAFETY CONSIDERATIONS
GENERAL SAFETY EARTH GROUND
This product and rt!latt!d documentation must be This is a Safety Class I product (provided with a
revicwt!d f'or familiarization with safety markings protective earthing terminal), An uninterruptible
and instructions before operation. This product has safety earth ground must be provided from the
bwn designed and tested in accordancewith inter- main power source to the product input wiring ter-
national standards. minals, power cord, or supplied power cord net.
Whenever it is likely that the protection has been
impaxed, the product must be made inoperative
SAFETY SYMBOLS
and be secured against any unintended operation,
Instruction manual symbol: the
A prodwl will be marked with this
symbol when it is necessaryfur
the user to refer to the instruc" BEFORE APPLYING POWER
tion manual in order to protect Verify that the product is configured to match lhe
against damage (refer to Table available main power source per the input power
of Contents). configuration instructions provided in thiv manual.
Indicates hazardcx~s
voltages. If this product is to be energizedvia an auto-tranrc-
f former make sure the common terminal is con-
nected to the neutral (grounded side of mains
Indicates earth (ground) terminal. SUPPlY ),
SERVlCfNG
`The WARNING sign denotes a
hazard. It calls attention to a
procedure, practice, or 1:helike,
which, if not cvrrectlp Performed Any sewkin& adjustm,ent, maintenoncc,
or adhered to, could result in or repair of this product musl be per-
personal injury. Do not proceed formed only by qualified personnel.
beyond a WARNTNC sign until
the indicated conditions are fully Adjustments described in thir: manwl
understood and met. may be performed with, power supplied
to the product while proteclirx? couer.s
are rumoued. ISner~,y availahla ot many
The CAIJTION sign denot,es a points may> if contactnd. resL111.in per-
hazard. It calls attention to an sonal injury,
operating procedure, pxactice, or
the like, which, if not correctly
P'rformed or adhered to, could
result in damage to or destruc-
tion of Part or all of the Product.
I,)<> proceed beyond a CALJ-
not
TION sign until the indicated
conditions are fully understood
and met.
vii
General Information Model 8671A
MODEL 8671A
EXTENDER BOARDS
LINE POWER CABLE
FUSE
Figure 1.1. Model 8671A and Accessories Supplied
Model 8671A General Information
SECTION I
GENERAL INFORMATiON
l-l. INTRODUCTION 1-11. The Synthesizer and all related documenta-
tion must be reviewed for familiarization with
l"2. `I'his manual contains information pertinent safety markings and instructions before operation.
to installing, operating, testing, adjusting, and ser-
vicing the Hewlett-Packard Model 86'71A Synthe- Refer to the Safety ConsiderationGpage found at
the beginning of this manual for a summary of the
sizer. The Model 8671A will generally be referred
lo as the Synthesizer throughout this manual. safety information.
l-12. Safety information pertinent to the task at
l-3. Information pertaining to the Mewlett- hand (installation, operation, performance testing,
Packard Interface Bus (HP-IB) as it relates to the adjustments, or service) is found throughout this
Synthcsizcr is found in various sections of this manual.
manual. Section VIII contains a diagnostic program
for checkout of ,HP-IB functions. A remote Opera-
tor's Check is also found in Section VIII. I-13. INSTRUMENTSCOVERED BY MANUAL
l-14. Options. Electrical options 002, 003, 005,
1-4. Figure 1-l shows the Synthesizer with all sup- and various mechanical options are documented in
plied accessories. this manual. The differencas are noted under the
appropriate paragraphsuch asOptions in Section I,
I-5. Packagedwith this manual is an Operating In- the Replaceable Parts J,ist and the schematic
l'ormation Supplement. This is simply a copy of the diagrams.
first three sections of this manual. This supplement
should stay with the instrument for USC the op-
by 1-15. Serial Numbers. Attached to this instrument
erator. Additional copies of the Operating Informa- is a serial number Plato. The serial number is in the
tion Supplement may be ordered separatelythrough form 1234A00123. The first four digits and the
your nearest Hewlett-Packard office. `The part letter comprise the serial prefix. The last five digits
number is listed on the title pageof this manual. form the sequential suffix that is unique to each in-
strument. The contents of this manual apply di-
1~6. On the title page of this manual, below the rectly to instruments having the same serial num-
manual pas1 number, is a "Microfiche" part num- ber prefii(es) as listed under SERIAL NUMBERS
bcr. This number may be used to order 100 x 150 on the title page.
mm (4. x B-inch) microfilm transparencies of the
manual. Each microfiche contains up to 96 photo- l-16. For information concerning a serial number
duplicates of the manual pages. The microfiche p&ix not listed on the title pageor in the Manual
package also includes the latest Manual Changes Changessupplement, contact your nearestHewlett-
supplement as well as all pcrtincnt Service Notes. I'ackard office.
1.7. SPECIFICATIONS I-17. MANUAL CHANGE SUPPLEMENTS
1-8. Instrument specifications are listed in Table 1-18. An instrument manufactured after the print-
1,-l. These specifications are ,the performance stan- ing of this maqua may have a serial prefix that is
dards or limits against which the instrument may not listed on the title page.This unlisted serial pre-
be tested. fix indicates that the instrument is different from
those documented in this manual. The manual for
this instrument is supplied with a yellow Manual
1-9. SAFETY CONSlDERATlONS Changessupplement that contains "change inform-
l-10. This producl is a Safety Class I instrument ation" that documents the differences.
(provided with a protective earth terminal). The
instrument and manual should be reviewed for l-1.9. In addition to change information, the sup-
safety markings and instructions before operation. plement may contain information for correcting
1-l
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