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a-134


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    ON-WAFER MEASUREMENTS
            WITH THE
   HP 8510 NETWORK ANALYZER
              AND
CASCADE MICROTECH WAFER PROBES


                     Eric Strid
                President and C.E.O.
              Cascade Microtech, Inc.
                   P.O. Box 2015
              Beaverton, Oregon 97075




   RF & Microwave
   Measurement
   Symposium
   and
   Exhibition


   Flin-   HEWLETT
   ~~ PACKARD




                    www.HPARCHIVE.com
Hewlett-Packard is pleased to have the opportunity to present this paper,
written by Eric Strid of Cascade Microtech, Inc., at the RF & Microwave
Measurement Symposium and Exhibition.



Abstract:


This paper presents a system, consisting of the HP 8510 network analyzer
and Cascade Microtech wafer probes, that is used to make RF measurements
of microwave devices and IC's (MMIC's) directly on-wafer. The
configuration of the system and the characteristics of the wafer probes are
described. Techniques for making the best possible on-wafer measurements
will also be addressed, and a range of on-wafer measurement applications
will be examined.



Biography


Eric Strid received his BSEE degree at MIT in 1974 and MSEE degree from
UC Berkeley in 1975. He first worked on microwave MIC's at Farinon
Transmission Systems, San Carlos, CA. In 1979, he joined the gallium
arsenide research group at Tektronix, which has recently evolved into
TriQuint Semiconductor. In 1983, he co-founded Cascade Microtech, Inc.,
where he is now President and CEO. Eric has published various papers on
power GaAs FET's, noise figure measurements, analog and digital GaAs
IC's, and high-frequency wafer probing.




                                        www.HPARCHIVE.com
                                                                    In this talk, we'll be covering the basics and
                                                                    some details of how to use the Cascade
                                                                    Microtech Wafer Probe System with HP 8510
                                                                    Vector Network Analyzer.



      ON-WAFER MEASUREMENTS
 WITH THE HP 8510 NETWORK ANALYZER
AND CASCADE MICROTECH WAFER PROBES




                                                             5315




                                                                    We'll start with an introduction of the
                                                                    problem of wafer probing at very high
                                                                    frequencies and a discussion of the
                                                                    requirements of a probe for microwave
                                                                    frequencies. Then we'll talk about the
                                                                    mechanical and electrical aspects of the
                        OUTLINE                                     Cascade probe system and how it is
       I. Introduction                                              calibrated at the probe tips. We'll then
       II. The Wafer Probe System                                   move to error corrected measurements using
       III. Measurement Considerations                              a Vector Network Analyzer and some of the
       IV. Typical Measurements and Applications                    error considerations therein. Finally, some
                                                                    typical measurements and applications will
                                                                    be discussed.


                                                                     There are a variety of uses for wafer probes
                                                                     at microwave frequencies. One of the
                                                             5316    obvious applications is that you can get
                                                                     immediate measurements on wafers that
                                                                     have just been completed without having to
                                                                     thin them, dice them out, and bond them
                                                                     into fixtures. It also keeps the positional
                                                                     information between the die intact so that
                                                                     you can do a wafer map of RF parameters
WHY PROBE AT MICROWAVE FREQUENCIES?                                  and use this data to work on process yield



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