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Wl3 HEWLETT
~.... PACKARD SPECIFICATION CONTROL DRAWING
REVISION HISTORY
REV DOCUMENT APPVDBY DATE
EO JPM 07/07/94
E1 JPM 07/28/94
2.0 Gigabyte 3.5 inch Low Profile
Disk Drive Specification
Date this issue: 07/28/94 TItle: 2.0GB 3.5" Low Profile Disk Drive Specification Page " of 22
Changes since previous
issue noted by: JPM PRELIMINARY Dwg.No. Rev.
Approval: HP Part Number: 0950-2606
.-
HEWLETT
PACKARD SPECIFICATION CONTROL DRAWING
1.0 TABLE OF CONTENTS ................................................. 2
2.0 INTR.ODUCTION ....................................................... 4
2.1 Scope ....................................................... 4
2.2 Applicable Documents ......................................... 4
3.0 REQUIRED DESIGN FEATURES ........................................ 5
3.1 MechanicallHardware ......................................... 5
3.2 Firmware .................................................... 5
4.0 FUNCTIONAL SPECIFICATIONS ........................................ 6
4.1 General Specifications ......................................... 6
4.2 Performance Specification ...................................... 6
4.3 Reliability and Life ............................................ 7
4.4 Interface Specification ......................................... 8
4.5 Power Specifications ........................................... 8
4.6 Diagnostics ................................................... 9
4.7 Power Management. . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . .. 10
5.0 MECHANICAL SPECIFICATIONS ....................................... 11
5.1 Physical Specifications ......................................... 11
5.2 Mounting Orientation ......................................... 11
5.3 Acoustic Noise Level .......................................... 11
5.4 Power Interface ............................................... 12
5.5 Signal Interface ............................................... 12
5.6 Options ...................................................... 13
5.7 Cooling Requirements ......................................... 13
6.0 ENVIRONMENTAL SPECIFICATIONS ................................... 14
6.1 Operating Environment ................. , ...................... 14
6.2 Non-Operating Environment ................................... 14
6.3 Transportation Environment .................................... 15
6.4 Product Safety & Emissions ..................................... 16
6.5 Labels and Markings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 17
7.0 DEFAULT VALUES ..................................................... 18
7.1 TID Jumpers ................................................. 18
7.2 Thrmination Power ............................................ 18
7.3 Mode Select Pages ............................................ 18
7.4 Bezel ........................................................ 18
Date this issue: 07/28/94 Title: 2.0GB 3.5" Low Profile Disk Drive Specification Page 10 of 22
Changes since previous Dwg.No. Rev.
issue noted by: JPM PRELIMINARY
Approval: HP Part Number: 0950-2606
rl31 HEWLETT
SPECIFICATION CONTROL DRAWING
~... PACKARD
2.0 INTRODUCTION
2.1 SCOPE
This specification outlines the requirements for a 3.5 inch, 1.0 inch high form factor, SCSI
rigid disk drive. This document specifies the electrical, mechanical, environmental,
reliability, and certification functional requirements of the drive. In the event of a
difference between the manufacturer's specifications and those outlined in this document
the latter shall take precedence.
2.2 APPUCABLE DOCUMENTS
The following is a list of the documents by which this specification is based. For more detail, please
reference these documents as required.
"Enhanced Small Computer System Interface (SCSI-II)",
X3T9.2/86-109 Rev. lOh, available through CBEMA
"ISO 7779" Acoustics - Measurement of airborne noise emitted by computer and
business equipement
Date this issue: 07/'213/94 Title: 2.0GB 3.5" Low Profile Disk Drive Specification Page 12 of 22
Changes since previous Dwg.No. Rev.
issue noted by:' JPM PREUMINARY
Approval: HP Part Number: 0950-2606
"3 HEWLETT SPECIFICATION CONTROL DRAWING
a!1'''' PACKARD
8.0 FIGURES AND TABLES ................................................ 18
Figure 1 Dimensions and Mounting ................................. 19
Figure2 Comb'mat' Co nnect or Pi n A sSlgnment .................. . 20
Ion .
Thble 1 Current Requirements ...................................... 21
Thble 2 SCSIInterface Signals ...................................... 21
Thble 3 SCSI ID Settings .......................................... 22
Date this issue: 07/28/94 Title: 2.OGB 3.5" Low Profile Disk Drive Specification Page 11 of 22
Changes since previous Dwg.No. Rev.
issue noted by: JPM PRELIMINARY
Approval: HP Part Number: 0950-2606
, ~-.,~ ~
Wl~ HEWLETT
~.... PACKARD SPECIFICATION CONTROL DRAWING
4.0 FUNCTIONAL SPECIFICATIONS
The appropriate manufacturer's specifications contain information which must be used in conjunction
with this document. In the case of conflicting information, the HP specification shall take precedence.
4.1 GENERAL SPECIFICATIONS
4.1.1 Capacity
Unformatted: 2.5GB (ref only)
Formatted (512): 4194685 blocks (must be exact)
Max LBA (512) 4194684 (must be exact)
4.2 PERFORMANCE SPECIFICATIONS
Note: The requirements of this section are to be met under all combinations of operating
environment and DC supply voltages of sections 5 and 6. Therefore it represents
worst-case requirements.
4.2.1 Seek Times (all numbers include settling time)
'frack to track: 35 ms
Average: 15.1 ms
Maximum: 24 ms
4.2.2 Disk Speed / Rotational Latency
Average Latency: 5.56 msec or less (ref only)
Disk Speed: 5400 RPM minimum +1-0.5% (ref only)
4.2.3 Data 'fransfer Rates
4.2.3.1 Internal (disk)
Burst: 21 to 46 mbitslsec
4.2.3.2 External (bus)
Async: 5 MB/s
Sync: 10 MB/s
4.2.4 Head Switching
Must be less than 500 usec
4.2.5 Command Overhead
Controller overhead: < 300 usec (ref only)
4.2.6 Spin -up 1Spin -down time
Power-on to selection: 1 sec
Power-on to ready: 20 sec
Start command: 20 sec
Stop command: 20 sec
4.2.7 Interleaving
Interleave: 1:1
Date this issue: 07/28/94 TItle: 2.0GB 3.5" Low Profile Disk Drive Specification Page 14 of 22
Changes since previous Dwg.No. Rev.
issue noted by: JPM PRELIMINARY
Approval: HP Part Number: 0950-2606
Wl'31
HEWLETT
~ . PACKARD
. SPECIFICATION CONTROL DRAWING
3.0 REQUIRED DESIGN FEATURES
The device must contain and maintain certain design features that are required in the workstation
environment. The following is a list of the appropriate design requirements:
3,1 MECHANICAL.1HARDWA~"Q.E
1) The device must automatically move the recording heads to a landing zone (completely
free of user data) and latch them there, upon the loss of DC power, without operator or
software intervention.
2) Not require any periodic or preventive maintenance.
3) Mechanism is to have a breather and filtration system in the HDA.
4) Provide dynamic braking of the disks on a power- down cycle.
5) Require no sequencing of power.
6) Device must have the minimum of a 32K dual port buffer system.
7) Be capable of supporting a minimum 48 bit ECC.
8) Glitchless drivers/receivers are to be used on the SCSI bus.
3.2 FIRMWARE
Refer to the Hewlett- Packard document "Standard Firmware for Disk Devices"
Date this issue: 07/28/94 Title: 2.0GB 3.5" Low Profile Disk Drive Specification Page 13 of 22
Changes since previous Dwg.No.
issue noted by: JPM PRELIMINARY Rev.
Approval:
I HP Part Number: 0950-2606
,
rl~ HEWLETT
~... PACKARD SPECIFICATION CONTROL DRAWING
4.4 INTERFACE SPECIFICATION
Unless otherwise noted the drive shall meet all of the requirements of the above
mentioned HP "Workstation Division Winchester Drive Interface Specification". Any
specific requirement not covered will follow the following specifications in weighted order:
SCSI -2 ANSI X3T9.2/86-109 Rev. lOh
4.5 POWER SPECIFICATIONS
The following requirements are applicable to the main PCB board power interface
connector (J2).
Voltage Requirements: +5 Volts (1.2A max.)
+12 Volts (2.2 A max.)
( Refer to Thble 1 for specific requirements under typical use.)
Voltage Tolerance: 5 Volts +/-5%
12 Volts +/-5%
+/-10% during start-up
Allowable Ripple: 5 Volts: 100 mV p-p from 0 to 100 KHz
12 Volts: 120 mV p-p from 0 to 100 KHz
Power Consumption: 13.5 watts (max)
Voltage sequencing requirements: None
Date this issue: 07/28/94 Title: 2.0GB 3.5" Low Profile Disk Drive Specification Page 16 of 22
Changes since previous Dwg.No. Rev.
issue noted by: JPM PRELIMINARY
Approval: HP Part Number: 0950-2606
rL3 HEWLETT
.:.1'.... PACKARD SPECIFICATION CONTROL DRAWING
4.3 REUABIUTY AND LIFE
The following information specifies the reliability, read and seek error rates, and the
expected life of the device. The requirements shall be met with no stabilization time and
with no regard to any particular environmental conditions under which the data was
written so long as it was within the operating range of section 5 and 6.
MTBF of the device: 800,000 hrs
MITR of the device: 30 minutes
Design Component Life: 5 years
Preventive Maintenance: not required
Errors (rates specified with retries and ECC enabled)
Correctable Read Error Rate: 1 in 1010 bits read
Uncorrectable Read Error Rate: 1 in 1014 bits read
Seek Error Rate: 1 in 106 seeks
Media Defects:
The manufacturer shall identify all media defects and provide a list of their
locations that is retrievable by accessing the drive's primary defect list. The
defect list need not be attached physically to the outside of the drive, although it
can be. The drive will be shipped with all defects found during manufacturing,
mapped to spare blocks.
No more than a maximum of 2 additional defects shall be allowed during the
first 24 hours of operation. After the initial 24 hours of operation a maximum
of 50 defects will be allowed during the life of the drive.
Power Cycling: 10,000
The head I media interface shall be able to withstand 10,000 power-on I
power-off cycles without suffering any permanent damage or loss of data.
Date this issue: 07/28/94 Title: 2.0GB 3.5" Low Profile Disk Drive Specification Page 15 of 22
Changes since previous Dwg.No. Rev.
issue noted by: JPM PRELIMINARY
Approval: HP Part Number: 0950-2606
rL~ HEWLETT
~~ PACKARD SPECIFICATION CONTROL DRAWING
4.6.4 Diagnostic coverage upon the send diagnostic command should include:
4.6.4.1
Testing of the PCB, servo, seek mechanics, and read/write of all heads, in the
most dense recording area of the disk.
4.6.4.2
The coverage of stuck-at-faults for the drive hardware should be 90%. In
order to show this has been achieved, we require the following:
1. PCB board stuck-at-fault coverage for nets should achieve 90%. This
can be verified by performing fault insertion to each net on the PCB. A net
is a connection between chip pins. Each net should be driven logically high
and low. (The nets can be driven high through an external resistor or by
another method of protection). The faults should be inserted one at a
time, during execution of the send diagnostic command. If the test fails
and the drive indicates status accordingly, then the fault is considered to
have been detected.
2. Media fault coverage should include testing for write fault conditions.
4.6.5
The power-up diagnostics, and the diagnostic executed by the send diagnostic
command, should be non -destructive to the user data. Any writing done on
the drive should be done to a reserved cylinder where user data will never exist.
4.6.6
The Request Sense and Inquiry commands should be fully supported in ROM.
In this manner the disk need not be spinning to execute these commands. The
Inquiry data including manufacturer name, drive model number, firmware
revision, and serial number should be included in the ROM as well.
Date this issue: 07/28/94 TItle: 2.0GB 3.5" Low Profile Disk Drive Specification Page 18 of 22
Changes since previous Dwg.No; Rev.
issue noted1Jr.: JPM PRELIMINARY
Approval: HP Part Number: 0950-2606
n:w HEWLETT
SPECIFICATION CONTROL DRAWING
~~ PACKARD
4.6 DIAGNOSTICS
The following are the minimum diagnostics requirements for the 3.5 inch SCSI disk drive.
The interface requirements basically emphasize items in the ANSI SCSI standard that are
necessary to meet HP workstation diagnostic goals.
4.6.1
Drive self-test diagnostics must execute upon recelvmg the SCSI send diagnostic
command, with the self-test bit set. No other bits shall be required.
4.6.2
When the drive reports self-test status for the send diagnostic command, a check
condition status indicates self-test failure and a good status indicates self-test passed.
Upon receiving the check condition status, the host can send the drive a SCSI request
sense command. The drive will usc and support the extended sense format for the request
sense data. A good status will be reported only upon the diagnostic passing. Upon failure
the device should use the sense key 04(hex) to indicate a hardware failure. The additional
sense code should supply more information on the error.
4.6.3
If the implementation of the send diagnostic command resides originally on the disk, then
power-up diagnostics must ensure that this command can be supported, by getting the
firmware off the disk, into RAM, and check-summing it. If the power-up self-test
passes, it means the drive can support SCSI commands, especially the send diagnostic
command. If it fails, the condition of the drive should indicate a check condition status.
The sense keys should include the error information. The drive should not report drive
ready, but indicate a hardware error if it has found one. The drive should only indicate
drive not ready (sense key 02 hex) if it has not found a problem, and is not ready for use.
The drive should indicate a drive not ready status until the power up diagnostics are
complete and the status is available.
If power-up diagnostics pass, the sense key should be set to unit attention (06 hex) and the
additional sense key set to 29 hex, indicating a power-on or reset condition. If the drive
fails power-up self-test, then the sense key should be set to hardware failure (04 hex) and
the additional sense key should give additional error code as defined in SCSI - 2
specification.
Date this issue: 07/28/94 Title: 2.0GB 3.5" Low Profile Disk Drive Specification Page 17 of 22
Changes since previous Dwg.No. Rev.
issue noted by: JPM PRELIMINARY
Approval: HP Part Number: 0950-2606
~~ HEWLETT
~.... PACKARD SPECIFICATION CONTROL DRAWING
5.0 MECHANICAL SPECIFICATIONS
5.1 PHYSICAL SPECIFICATIONS
The disk drive must conform to the industry standard low profile form factor and mounting
scheme. Dimensions do not include the face plate.
Width of the device: 101.6 mm (4.0")
Height of the device: 25.4 mm (1.00")
Depth of the device: 146.2 mm (5.75")
Weight of the device: .67kg (1.5 I bs)
5.2 MOUNTING ORIENTATION
The disk drive may be mounted in any orientation.
Mounting Specification: Refer to Figure 1
There should not be any additional clearance around the physical limits of the device
required to allow for movement.
5.3 ACOUSTIC NOISE LEVEL
The drive shall meet the acoustic requirements below. Output measured according to the
test procedures outlined in ISO 7779. The values listed are maximum allowable levels.
Idle: 32dbA (A weighted sound pressure)
4.3 bels (sound power)
Seeking: 34dbA (A weighted sound pressure)
4.5 bels (sound power)
Date this issue: 07/28/94 TItle: 2.0GB 3.5" Low Profile Disk Drive Specification Page 20 of 22
Changes since previous Dwg.No. Rev.
issue noted by: JPM PRELIMINARY
Approval: HP Part Number: 0950-2606
rL~ HEWLETT
.:r PACKARD
... SPECIFICATION CONTRa L DRAWING
4.7 POWER MANAGEMENT
4.7.1
Some level of Power Management will be required. At this time that
requirement has not been defined.
Date this issue: 07/28/94 TItle: 2.0GB 3.5" Low Profile Disk Drive Specification Page 19 of 22
Changes since previous Dwg.No. Rev.
. issue noted by: JPM PRELIMINARY
Approval: HP Part Number: 0950-2606
.
Wl~ HEWLETT
SPECIFICATION CONTROL DRAWING
.:.1'''' PACKARD
5.6 OPTIONS
Reference section 7 for default values.
5.6.1 TID JUMPERS
The device must have a set of ID jumpers, consisting of two rows of male pins
with adjacent pins 2 mm apart.
5.6.2 TERMINATION POWER
The drive shall supply power to the terminators and the TERM POWER pin
through a zener diode and a fuse.
5.6.3 SPINDLE CONTROL
The drive shall power-up automatically upon application of power.
5.6.4 BUS PARITY
The drive shall check parity on commands and data.
5.6.5 BARCODE
There shall be a barcode label affixed to the drive following the EIA -556 code
39 standard with the serial number printed and barcoded.
5.7 COOLING REQUIREMENTS
Per manufacturing Product Specification or via natural convection if not
specified.
Date this issue: 07/28/94 TItle: 2.0GB 3.5" Low Profile Disk Drive Specification Page 22 of 22
Changes since previous Dwg.No. Rev.
issue noted bv: JPM PRELIMINARY
Approval: HP Part Number: 0950-2606
HEWLETT
PACKARD SPECIFICATION CONTROL DRAWING
5.4 POWER INTERFACE
The power interface shall adhere to the following specifications:
1. Power connector: AMP mate-n-Iock (PIN 350543-1) or equivalent
2. Power connector pin assignment: see Figure 2
3. Power connector location: see Figure 1
4. Mating connector: AMP 1-480424-0 or equivalent
5. Ground: The HDA base and cover shall be connected to PCB
(DC) ground in order to provide noise shielding.
5.5 SIGNAL I~'TERFACE
Interface:
SCSI single ended (Ref. to ANSI SCSI spec X3.131)
SCSI signal pin assignments:
See Table 2
SCSI connector:
A fifty pin, low density, unshielded, keyed, shrouded connector consisting of two rows of 25
male pins with adjacent pins 2.54 mm (0.1 in.) apart.
SCSI connector location:
See Figure 1
Mating Connector/Cable:
A fifty pin, low density, keyed, strain - relief connector consisting of two rows of 25 female
contacts with adjacent contacts 2.54mm (0.1 in.) apart.
Termination:
Removable packs or disableable termination is to be used and must conform to the ANSI
standard.
Terminator location:
Location of terminators should be on the back end of the PCB.
Date this issue: 07/28/94 Title: 2.0GB 3.5" Low Profile Disk Drive Specification Page 21 of 22
Changes since previous Dwg.No. Rev.
issue noted by: JPM PREUMINARY
Approval: HP Part Number: 0950-2606
rl'3 HEWLETT
SPECIFICATION CONTROL DRAWING
~... PACKARD
6.3 TRANSPORTATION ENVIRONMENT
Every unit shall be shipped in a ESD bag with desiccant.
The original shipping container must be capable of withstanding (without functional or
cosmetic damage) three 30 inch free fall drops onto any face, edge and corner of the
shipping container.
Date this issue: 07/28/94 Title: 2.0GB 3.5" Low Profile Disk Drive Specification Page 24 of 22
Changes since previous Dwg.No. Rev.
issue noted by: JPM PRELIMINARY
Approval: HP Part Number: 0950-2606
rL:.I HEWLETT
.:1'
.... PACKARD SPECIFICATION CONTROL DRAWING
6.0 ENVIRONMENTAL SPECIFICATIONS
6.1 OPERATING ENV1RONMENT
Temperature:
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