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                               Service Manual
                                                     Service Manual
                                                     KE500/ME550c




                              Model : KE500/ME550c




Date: May, 2007 / Issue 1.0
                                     Table of Contents
1. General Description........................ 5                           4.15 Ear-Mic Headset MIC
                                                                                Trouble Shooting................................. 95

2. Performance .................................... 6                      4.16 Ear-Mic Headset HSOR/HSOL
                                                                                Trouble Shooting..................................96
   2.1 Product Name ......................................... 6
                                                                           4.17 FM-Radio Trouble Shooting.................98
   2.2 Supporting Standard ................................6
                                                                           4.18 Transflash Trouble Shooting................99
   2.3 Main Parts : GSM Solution...................... 6
                                                                           4.19 Main Key Backlight LED Trouble
   2.4 HW Feature..............................................7
                                                                                Shooting.............................................101
   2.6 Technical Specification ..........................12
                                                                           4.20 Slide Key Backlight LED Trouble
                                                                                Shooting.............................................103
3. Circuit Description........................ 17                          4.21 Vibrator Trouble Shooting ..................104
   3.1 General Description .............................. 17
   3.2 RF Part.................................................. 17     5. Downloading Software ............... 105
   3.3 Digital Baseband....................................24              5.1 The purpose of downloading software 105
   3.4 Analog Baseband.................................. 32                5.2 The Environment of Downloading
   3.5 Bluetooth Interface................................ 40                  Software.............................................. 103
                                                                           5.3 Download Procedure ...........................107
4. TROUBLE SHOOTING .................. 43
   4.1 RF Part Technical Brief......................... 43              6. BLOCK DIAGRAM ....................... 114
   4.2 RF Part Trouble shooting...................... 49
   4.3 Bluetooth Trouble Shooting .................. 57                 7. CIRCUIT DIAGRAM ..................... 117
   4.4 Baseband Part Troubleshooting ........... 61
   4.5 LCD Display Trouble............................. 68              8. PCB LAYOUT ............................... 128
   4.6 Camera Trouble Shooting..................... 73
   4.7 Flash LED Trouble Shooting................. 79
                                                                        9. RF Calibration ................................... 139
                                                                            9.1 What's the Rx Calibration? ................ 139
   4.8 SIM Detect Trouble Shooting................ 82
                                                                            9.2 What's the Tx Calibration? ................ 139
   4.9 Slide Up/Down and Trouble Shooting... 85                             9.3 Calibration program - HOT_KIMCHI ..140
   4.10 Speaker/Receiver Trouble Shooting
        (Common Path)................................... 87             12. EXPLODED VIEW &
   4.11 Speaker/Receiver Trouble Shooting                                   REPLACEMENT PART LIST ..... 145
        (Acoustic Path).................................... 90
                                                                           12.1 EXPLODED VIEW ............................ 145
   4.12 MIC Trouble Shooting ......................... 91
                                                                           12.2 Replacement Parts
   4.13 Ear-Mic Jack Detection                                                  .................... 147
        Trouble Shooting................................. 93                    
........................... 151 4.14 Ear-Mic Hook Detection 12.3 Accessory ......................................... 166 Trouble Shooting................................. 94 -3- 1. General Description 1. General Description The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the ME550c. -5- 2. Performance 2. Performance 2.1 Product Name ME550c : GPRS Class 10 / EDGE Class 10 2.2 Supporting Standard Item Feature Comment Supporting Standard EGSM/DCS1800/PCS1900 with seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1,2,3,E Frequency Range EGSM TX : 880 - 915 MHz EGSM RX : 925 - 960 MHz DCS1800 TX : 1710 - 1785 MHz DCS1800 RX : 1805 - 1880 MHz PCS1900 TX : 1850 - 1910 MHz PCS1900 RX : 1930 - 1990 MHz Application Standard WAP 2.0, JAVA 2.0 2.3 Main Parts : GSM Solution Item Part Name Comment Digital Baseband Neptune (D761811BZVL): TI Analog Baseband Triton (TWL3029): TI RF Chip B6PLD: RENESAS -6- 2. Performance 2.4 HW Feature Item Feature Comment Form Factor Slide 1) Capacity Battery Standard : Li-Polymer, 800mAh 2) Packing Type : Hard Pack Standard : Size 97.0 X 47.0 X 14.9 mm Weight 90g With Battery Volume 75cc PCB Staggered 10Layers , 0.8t Stand by time 250 hrs @ Paging Period 5 Charging time 3 hrs @ Power Off / 800mAh Talk time Min : 3.0 hrs @ Power Level 7 @ EGSM / 800mAh EGSM : -105 dBm RX sensitivity DCS 1800 : -105 dBm PCS 1900 : -105 dBm GSM/ EGSM : 33 dBm Class4 (EGSM) GPRS DCS 1800 : 30 dBm Class1 (PCS) PCS 1900 : 30 dBm Class1 (DCS) TX output power EGSM : 27 dBm E2 (EGSM) EDGE DCS 1800 : 26 dBm E2 (PCS) PCS 1900 : 26 dBm E2 (DCS) GPRS compatibility GPRS Class 10 EDGE compatibility EDGE Class 10 Plug-In SIM SIM card type 3V /1.8V Main LCD Display 262K Color TFT (176 x 220) Backlight : White LED Built-in Camera 2M CMOS Camera One button access -7- 2. Performance Item Feature Comment Status Indicator None Alphanumeric Key : 12 Function Key: Function Key : 9 4 Key Navigation, OK, F1, Side Key : 4 F2, CLR, SND Keypad Total No of Keys :25 Side Key : Volume up/down, CAM, PWR/END Main : Internal Fixed Type ANT Blue tooth : Internal Fixed Type System connector 18 Pin Ear Phone Jack 18pin, 4 Pole, Stereo PC synchronization Yes NAND Flash : 1Gbit Memory SDRAM : 512Mbit Speech coding FR, EFR, HR,AMR Data & Fax Built in Data & Fax support Vibrator Built in Vibrator V2.0, HSP, HFP, OPP, FTP(server), Blue Tooth BPP, A2DP, AVRCP MIDI (for Buzzer Function) SW Decoded 64Poly Music Player MP3/ AAC/AAC+ With Graphic EQ Camcorder MPEG4, H.263, H.264 Voice Recording Yes Speaker Phone mode Yes Support Travel Adapter Yes CDROM Yes Stereo Headset Yes Optional Data Cable Yes Optional T-Flash (External Memory) Yes Optional -8- 2. Performance Item Feature Comment RSSI 0 ~ 5 Levels Battery Charging 0 ~ 4 Levels Key Volume 0 ~ 5 Level Audio Volume 1 ~ 5 Level Time / Date Display Yes NITZ Multi-Language Yes English / French Phone Book / Message / Camera Quick Access Mode / My Stuff / Favorite PC Sync Schedule / Phonebook / MEMO / SMS / Download(Photo, file) Speed Dial Yes (2~9) Voice mail center -> 1 key Profile Yes CLIP / CLIR Yes (different melody) Phone Book 4 Numbers + 1 Memo + 1 e-mail + Total 1000 Member Group Select + Picture Last Dial Number Yes (40) Last Received Number Yes (40) Last Missed Number Yes (40) Search by Number/Name Name only Group 7 Possible Rename Fixed Dial Number Yes Service Dial Number Yes Own Number Yes Voice Memo Yes Call Reminder Yes Network Selection Automatic Mute Yes Call Divert Yes Call Barring Yes Call Charge (AoC) No No for Cingular -9- 2. Performance Item Feature Comment Call Duration Yes SMS (EMS) 100 (10) EMS : Release4 (Except Text align) SMS Over GPRS Yes EMS Melody / Picture Yes Send / Receive / Save MMS MPEG4 / Send / Yes Receive / Save Long Message MAX 925 Characters Cell Broadcast Yes Download Over the WAP Game YES Calendar Yes Memo 50 Unit Convert Currency/Area/Length/Volume/Weigh t/Temperature/Velocity Tip Calculator No Wall Paper Yes Default 5ea WAP Browser Over WAP 2.0 Up Brower Obigo Q-line Download Melody / Yes Over WAP Wallpaper SIM Lock Yes Operator Dependent SIM Toolkit Class 1, 2, 3, A-E MMS Yes Openwave MMS Client EONS Yes CPHS Yes V4.2 ENS Yes Camera Yes 2M F/F / Digital Zoom : x4 JAVA Yes CLDC V1.1 / MIDP V2.0 Download Over WAP Voice Dial No - 10 - 2. Performance Item Feature Comment IrDa No V2.0 HSP, HFP, OPP, Blue tooth Yes FTP(server), BPP, A2DP, AVRCP GPRS Yes Class 10 EDGE Yes Class 10 Hold / Retrieve No Conference Call Yes Max. 6 DTMF Yes Memo pad Yes TTY No AMR Yes Sync ML No IM No Email No - 11 - 2. Performance 2.6 Technical Specification Item Description Specification GSM850 TX: 824 + n x 0.2 MHz (n=1 ~ 124) RX: TX + 45 MHz GSM900 TX: 890 + n x 0.2 MHz (n=1 ~ 124) 890 + (n-1024) x 0.2 MHz (n=975 ~ 1023) RX: TX + 45 MHz 1 Frequency Band DCS1800 TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885) RX: TX + 95 MHz PCS1900 TX: 1850 + ( n-511 ) x 0.2 MHz RX: 1930 + ( n-511 ) x 0.2 MHz (n = 512 ~ 810) RMS < 5 degrees 2 Phase Error Peak < 20 degrees 3 Frequency Error < 0.1ppm GSM850/GSM900 Level Power Toler. Level Power Toler. 5 33 dBm 2dB 13 17 dBm 3dB 6 31 dBm 3dB 14 15 dBm 3dB 7 29 dBm 3dB 15 13 dBm 3dB 8 27 dBm 3dB 16 11 dBm 5dB 9 25 dBm 3dB 17 9 dBm 5dB 10 23 dBm 3dB 18 7 dBm 5dB 11 21 dBm 3dB 19 5 dBm 5dB 4 Power Level 12 19 dBm 3dB DCS1800/PCS1900 Level Power Toler. Level Power Toler. 0 30 dBm 2dB 8 14 dBm 3dB 1 28 dBm 3dB 9 12 dBm 4dB 2 26 dBm 3dB 10 10 dBm 4dB 3 24 dBm 3dB 11 8 dBm 4dB 4 22 dBm 3dB 12 6 dBm 4dB 5 20 dBm 3dB 13 4 dBm 4dB 6 18 dBm 3dB 14 2 dBm 5dB 7 16 dBm 3dB 15 0 dBm 5dB - 12 - 2. Performance Item Description Specification GSM900 Offset from Carrier (kHz). Max. dBc 100 0.5 200 -30 250 -33 400 -60 600~ <1,200 -60 1,200~ <1,800 -60 1,800~ <3,000 -63 3,000~ <6,000 -65 Output RF Spectrum 6,000 -71 5 (due to modulation) DCS1800/PCS1900 Offset from Carrier (kHz). Max. dBc 100 0.5 200 -30 250 -33 400 -60 600~ <1,200 -60 1,200~ <1,800 -60 1,800~ <3,000 -65 3,000~ <6,000 -65 6,000 -73 GSM900 Offset from Carrier (kHz) Max. (dBm) Output RF Spectrum 400 -19 6 (due to switching transient) 600 -21 1,200 -21 1,800 -24 - 13 - 2. Performance Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum 400 -22 6 (due to switching transient) 600 -24 1,200 -24 1,800 -27 7 Spurious Emissions Conduction, Emission Status 8 Bit Error Ratio BER (Class II) < 2.439% @-102dBm 9 Rx Level Report accuracy 3 dB 10 SLR 8 3 dB Frequency (Hz) Max.(dB) Min.(dB) 100 -12 - 200 0 - 300 0 -12 11 Sending Response 1,000 0 -6 2,000 4 -6 3,000 4 -6 3,400 4 -9 4,000 0 - 12 RLR 2 3 dB Frequency (Hz) Max.(dB) Min.(dB) 100 -12 - 200 0 - 300 2 -7 500 * -5 13 Receiving Response 1,000 0 -5 3,000 2 -5 3,400 2 -10 4,000 2 * Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to be Max. level in the range. - 14 - 2. Performance Item Description Specification 14 STMR 13 5 dB 15 Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) -35 17.5 -30 22.5 -20 30.7 16 Distortion -10 33.3 0 33.7 7 31.7 10 25.5 17 Side Tone Distortion Three stage distortion < 10% System frequency 18 2.5ppm (13 MHz) tolerance 19 32.768KHz tolerance 30ppm Full power - 340mA(GSM900), < 260mA(DCS/PCS) 20 Power consumption Standby - Normal mode ? 4.0mA(Max.power) - Using Test mode on DSP Sleep function ? 6mA GSM900/Lvl 7 (Battery Capacity 800mA) : 180 min 20 Talk Time GSM900/Lvl 12 (Battery Capacity 800mA) : 300 min PCS1900/Level5 (Battery 800mA) : 310 Min PCS1900/Level10(Battery 800mA) : 390 Min Under conditions, at least 200 hours: 1. Brand new and full 800mAh battery 2. Full charge, no receive/send and keep GSM in idle mode. 21 Standby Time 3. Broadcast set off. 4. Signal strength display set at 3 level above. 5. Backlight of phone set off. At least 70 dB under below conditions: 22 Ringer Volume 1. Ringer set as ringer. 2. Test distance set as 50 cm Fast Charge : < 550 mA 23 Charge Voltage Slow Charge: < 60 mA - 15 - 2. Performance Item Description Specification Antenna Bar Number Power 5 -85 dBm ~ 4 -90 dBm ~ -86 dBm 24 Antenna Display 3 -95 dBm ~ -91 dBm 2 -100 dBm ~ -96 dBm 1 -105 dBm ~ -101 dBm 0 ~ -105 dBm Barttey Bar Voltage 0(included Blinking) 3.65V~3.35V 1 3.71V ~ 3.66V 25 Battery Indicator 2 3.78V ~ 3.72V 3 3.91V ~ 3.79V 4 4.20V ~ 3.92V 3.60V 0.03V (Standby) 26 Low Voltage Warning 3.50V 0.03V (Call) 27 Forced shut down Voltage 3.35 0.03 V 1 Li-polymer Battery, Hardpack Standard Voltage = 3.7 V 28 Battery Type Battery full charge voltage = 4.2 V Capacity: 800mAh Switching-mode charger 27 Travel Charger Input: 100 ~ 240 V, 50/60Hz Out put: 4.8V, 900mA - 16 - 3. Circuit Description 3. Circuit Description 3.1 General Description The RF part consists of a transmitter, a receiver, a synthesizer, a voltage supply and a DCXO part. The main RF Chipset B6PLD is a highly integrated RF tranceiver IC FOR Digital Interface of GSM 850, GSM900, DCS1800 and PCS1900 quad-band cellualr systems. The B6PLD incorporates EDGE tranceiver apability, quad R low-noise amplifiers(LNSa). Direct conversion mixers, a programmable gain amplifier(PGA) with DC offset and frequency response correction, ADC, Digital filiter, Digital Interface, fully integrated VCOs, an RF fractiona-N synthesiser, a low-noise offset PLL transmitter, Digital modulator, TXDAC, RAMPDAC, and AFCDAC. The B6PLD includes state machine control through serial programming. All functions operate down to 2.67V and are housed in a 72-pin BGA package. Hence the B6PLD can form a small size transceiver handset for quad band EDGE tranceiver. 3.2 RF Part 3.2.1 Receiver Part The B6PLD receiver supports quad band, so the front-end incorporates four LNAs and two mixers. The incoming RF signals are mixed directly down to I/Q baseband by the front-end bolck. This incorporates four LNAs/four buffers and two Gillbert Cell mixer blocks optimised for operation at 850MHz, 900MHz, 1800MHz and 1900MHz respectively. The front-end block is followed by two closely matched baseband amplifier chains. These include distributed low pass filtering, one switched gain stage and one fixed gain stage. In addition, the baseband section integrates A/D and D/A converters which provide automatic on-chip correction of DC offsets. Receiver Part Block Diagram - 17 - 3. Circuit Description 3.2.1.1 Baseband PGA/Low pass Filter Specifications The baseband programmable amplifier comprises one stage with variable gain followed by a fixed gain amplifier. The overall gain control range is 36dB with 6dB Steps. The filtering is provided by a single R/C low pass filter with an on-chip capacitor followed by on-chip Chebychev low pass filters. The filters have been specified to achieve maximal group delay flatness in the pass-band combined with the required levels of suppression of interfering signals. The distribution of the gain and filtering has been designed to ensure that the receiver does not compress under blocking conditions. The final fixed gain amplifier is included to match the on-chip levels to the input dynamic range of the ADC. 3.2.1.2 DC offset auto-calibration system B6PLD implements a system for cancelling the DC offsets in the baseband programmable gain amplifiers(PGA). This prevents a small DC offset at the input giving a large DC offset at the output, even at high gain settings. When the B6PLD receiver is performing an auto-calibration, the sequencer cancels the offsets locally around the PGA, then the Digital filter. The system includes switches to short out the signal path whilst the cancellation is occurring. The switches are opened in sequence as the calibration progresses. For PGA the A/D converter system employs a successive approximation technique and achieves 6 bit resolution. The PGA stage has an associated 6 bit current DAC which cancels the DC offset at the output. The sequencer ensures that on-chip filters have sufficient time to settle before applying correction in the next digital offset cancellation stage. - 18 - 3. Circuit Description 3.2.2 Transmitter part The B6PLD transmitter is capable of both GMSK and 8-PSK modulation, to support for conventional GSM and EDGE. B6PLD integrates all loop filters to configure both PM loop and AM loop. See block diagram below. Fig. Simplified Block diagram for Tx part 3.2.2.1 Polar Loop Structure Three main functions are identified in the transmitter architecture; I/Q vector modulation at IF frequency, amplitude and phase loop at IF/RF frequencies and power amplification. - 19 - 3. Circuit Description 3.2.3 RF Systhesiser 3.2.4 Front End Module Specification 3.2.4.1 Block Diagram and Internal Matching Condition HWXR693 - 20 - 3. Circuit Description 3.2.4.2 Logic Table for Selction Select Mode Vc(GSM850/EGSM) Vc(DCS/PCS) GSM850_Rx Low Low EGSM_Rx Low Low GSM850/EGSM_Tx High Low DCS_Rx Low Low PCS_Rx Low Low DCS/PCS_Tx Low High Band SW Logic Table 3.2.5 Power Amplifier Module for Quad-band GSM/GPRS/EDGE 3.2.5.1 PAM Specification -. Quad band GSM, GPRS & Ploar Loop EDGE Amplifier -. For 3.5V nominal operation -. Bulit-in LDO circuit -. GPRS Class 12 operation compatible -. Integrated directional coupler 3.2.5.2 Circuit Diagram and peripheral components RPF09036B - 21 - 3. Circuit Description 3.2.6 Digital Core 3.2.6.1 Digital Interface Block Diagram Fig. 1-1 Digital Interface Block Digram - 22 - 3. Circuit Description 3.2.6.2 Control system and digital interface The B6PLD is a RF transceiver IC for GSM850, GSM900, DCS1800 and PCS1900 quad band cellular system, and incorporates EDGE transceiver capability. The B6PLD has a digital interface connection to the baseband processor. This interface complies with the digital interface specification DigRF standard v112. The digital interface consists of two separate interface connections; (1) the control interface, (2) the data interface, and a system clock on/off control signal and a precise timing singal. These are realized by eight signal lines in B6PLD(Look at Fig1.1 above) - The control interfce is used to configure the B6PLD for RX and TX operation, transfers of control data for several built-in circuits, and for triggering the events. The control interface comprise a bi- directional 3-wire serial interface with the three signal lines CtrlData, CtrlEn and CtrlClk accessing the control registers in B6PLD by transferring the control words. - The data interface is used to transfer transmit modulation symbols and receive IQ-sampling data. The data interface comprises a single serial bus with the three signal lines RxTxData, RxTxEn and SysClk. The SysClk is used for system clock to baseband. - The SsClkEn signal enables the SysClk output and powers the 26MHz oscillator on. When the SysClkEn is negated, the SysClk is held low, and if the TEST1 pin is low by the default settings, the logic power supply by typical 1.8 volts to the internal core logic circuits is also switched off. - 23 - 3. Circuit Description 3.3 Digital Baseband OMAPV1030 Block Diagram 3.3.1 General description The OMAPV1030 E-GPRS multimedia device belongs to the Texas Instruments OMAP-Vox_ processors family. It combines both a modem engine and an application engine. Memory and CPU resources are shared between modem and application processing. The OMAPV1030 chip is based on the OMAP3.4 architecture and integrates two processor subsystems: - An MPU subsystem based on an ARM926EJ-S - A DSP subsystem based on a UMA 2.6 architecture integrating a C55x DSP core The OMAPV1030's silicon process technology is a c027.0 90-nm digital CMOS. - 24 - 3. Circuit Description 3.3.2 Block Description The OMAPV1030 E-GPRS multimedia device is based on an OMAP3.4 platform that integrates: - The MPU subsystem - The DSP subsystem - A system DMA - A traffic controller providing: - External memory interfaces with: - A slow interface (EMIFS) to ROM, SRAM, FLASH memories - A fast interface (EMIFF) to SDRAM memories - Layer 3 (L3) interconnect made of two OCP target ports (OCP-T1 and OCP-T2) and one OCP initiator port (OCP-I) - Layer 4 (L4) interconnect made of two DSP peripheral busses (private DSP TIPB and shared DSP TIPB) and two MPU peripheral busses (public MPU TIPB and private MPU TIPB) - Clock management - A set of processor peripherals: - Three 32-bit timers, a 16-bit Watchdog timer, and an interrupt handler for the MPU - Three 32-bit timers, a 16-bit Watchdog timer, and a 2nd-level interrupt handler for the DSP - Test and debug interfaces (JTAG, Window Tracer) - Trace capabilities: ETM9 and Ctools The other OMAPV1030 modules or subsystems are connected to the OMAP3.4 platform through the L3 and L4 interconnects. OMAPV1030 Top-Level Architecture Overview - 25 - 3. Circuit Description The OMAP3.4 platform is the computing core of the device. The other OMAPV1030 components are organized as follows: - The internal memory subsystem is made of a single-port 256K-bit shared internal SRAM. - The security subsystem is a set of several components, including dedicated a secure mode to run secure applications. - A master-slave USB module provides an external interface supporting high data transfer rates between the OMAPV1030 and external application - The memory interfaces provide access to external memories. There are two types of memory controllers: - SDRAM controller supporting SDR and DDR modes - General-purpose controller supporting asynchronous and synchronous - The system components are used to manage system interactions such as interrupts, clock control, reset control, and idle management. - The peripheral subsystem refers to all the peripherals accessible by the MPU and/or the DSP. They are all OCP- or TIPB-compliant and are connected to the OMAP3.4 platform through the traffic controller or the TIPB busses. 3.3.3 RF Interface (Digital RF Interface) The OMAPV1030 radio interface module of OMAPV1030 device is an interface that carries the following information: - Transmit symbols from DBB to RF IC - Receive samples from RF IC to DBB - Bidirectional information control - Real-time and activation signals from DBB to RF IC - System clock The OMAPV1030 radio interface module of OMAPV1030 device supports two types of radio interfaces. They differ mainly in the type of data interface: - The first interface is based on a standard six-wire scheme: three wires for transmit and three for receive. - The second one is based on a two-wire bidirectional scheme: one wire for data in/out, and one for control receive/transmit. - 26 - 3. Circuit Description OMAPV1030 Radio Interface This implementation is based on the following: - The time processing unit (TPU) module is a real-time sequencer dedicated to monitoring GSM baseband processing. - The serial port of the time serial port (TSP) module controls both interfaces. - The real-time TSPACT signal of the TSP module - The McBSP digital RF module is used for the six-wire data interface. - The serial radio interface module is used for the two-wire data interface. - A system clock interface receives a squared 26-MHz clock from the RF IC. - 27 - 3. Circuit Description 3.3.4 SIM interface SIM interface scheme is shown in below. SIM_IO, SIM_CLK, SIM_RST, SIM_PWRCTRL ports are used to communicate DBB via ABB with plugged sim card and the LDO (VRSIM) in ABB enables operate 1.8V to 2.5V to search SIM card SIM Interface SIM_CLK : SIM Card reference clock SIM_PWCTRL : SIM Card power activation SIM_RST : SIM Card async/sync reset SIM_IO : SIM Card bi-directional data line VRUSIM(Power supply VCC) : 3 V 10% (class B) or 1.8 V 10% (class C) Misc_ext_irq : USIM card presence detection (USIM_CD) purposes. - 28 - 3. Circuit Description 3.3.5 UART Interface ME550c has Three UART Drivers as follow : - UART1 : USB - UART2 : ETM, Calibration - UART3 : AT command, Fax_modem, Bluetooth UART1(USB) Resource Name Description USB_DP DP Data USB_DM DM Data USB_PWR POWER USB_POWER VBUS VBUS USB_Detect UART2 (ETM) DEBUG_RX RX Receive Data(UART2) DEBUG_TX TX Transmit Data(UART2) UART3 (Bluetooth) UART3_RXD UART3_RXD Receive Data UART3_TXD UART3_TXD Transmit Data UART3_RTS UART3_RTS Request To Send UART3_CTS UART3_CTS Clear To Send UART Interface Spec - 29 - 3. Circuit Description 3.3.6 GPIO Map In total 22 allowable resources, ME550c is using 9 resources except 3 resources dedicated to SIM and Memory. ME550c GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table 3. Resource Inactive Active I/O # Net Name I/O State State State I/O (1) Not used I/O (2) I Sysboot HIGH LOW I/O (4) USB_BOOT_SEL I Sysboot LOW (Giant Plus) HIGH (Nanya) I/O (6) I Sysboot HIGH LOW I/O (7) DIF_VSCNC I GPIO LOW HIGH I/O (8) BT_NRST O GPIO LOW (LCD B/L Of f ) HIGH (LCD B/L On) I/O (9) CHG_EN O GPIO LOW HIGH I/O (10) VCAM28_EN O GPIO LOW HIGH I/O (12) CAM_RST O GPIO HIGH LOW I/O (13) FM_INT I GPIO HIGH LOW I/O (16) MAIN_KEY_BL_EN I Sysboot LOW HIGH I/O (17) BOOT_SEL I GPIO HIGH HIGH I/O (18) DP_PWON O GPIO LOW HIGH I/O(27) SLIDE I GPIO LOW HIGH I/O(32) SPK_EN O GPIO HIGH LOW I/O (33) Not used O GPIO LOW HIGH I/O (42) VCAM18_EN I GPIO LOW HIGH I/O(43) CHG_STAT O GPIO HIGH LOW I/O (46) CIF_PD I GPIO LOW HIGH I/O (47) JACK_DETECT O GPIO HIGH LOW I/O (55) HOOK_DETECT O GPIO HIGH LOW I/O (63) SPK_EN O GPIO LOW HIGH GPIO Map - 30 - 3. Circuit Description 3.3.7 Camera interface ME550c have a 8-bit parallel camera interface(NOBT Mode) . This is a general parallel interface with vertical and horizontal synchronization signals.(See. Figure 12) The maximum clock is 96 MHz for 8-bit data data, or 48 MHz for 10- or 12-bit data. Generic Parallel Camera Interface Table7. describes the I/O signals of the generic parallel camera interface. Figure13, Figure14 show the frame and data timing according to synchronization signals in the parallel NOBT configuration.
Generic Parallel Camera Interface - 31 - 3. Circuit Description 3.4 Analog Baseband 3.4.1 General Description The TRITON chip is the analog and power management part of the Texas Instruments next generation wireless terminal. These GSM/GPRS/E-GPRS, 3G W-CDMA, CDMA2000 platforms are composed of a digital baseband processor, a RF chip, an application processor OMAP and of different peripheral devices like a LCD panel, a Multi-Media Card, a Bluetooth modem, a GPS modem. The purpose of the Triton device is to provide to platforms the following resources: - A power management system - Three White-LEDs drivers - Power supply resources - A vibrator driver - A voice and audio interface - A SIM-Card detection - A battery charger - A thermal shutdown - A monitoring system - An I2C interface - A real time clock resource - A JTAG and boundary scan - A USB 2.0 OTG transceiver with a carkit interface TWL3029 Architecture - 32 - 3. Circuit Description 3.4.2 Audio Signal Processing & Interface The Audio module consists of a Voice Codec dedicated to mobile telephone terminal application and a Stereo path. - The Voice Codec circuit processes analog audio components in the uplink path and transmits the converted data to the DSP speech coder through the voice serial port (VSP). In the downlink path, the Voice Codec converts the digital samples of speech data received from the DSP via the VSP port into analog audio signals. The Voice Codec supports a 8kHz (default narrowband mode) to a 16kHz(wideband mode) sampling frequency. - The Stereo path converts audio digital samples received from the I2S serial interface into analog audio. It supports all standard frequencies from 8kHz to 48kHz (8, 11.025, 12, 22.05, 24, 32, 44.1 and 48kHz). - Two included PLLs provide the suitable system clocks to the Voice and Stereo circuitry (ADC, DACS, Digital Filters, Digital interfaces). The Audio module supports 3 possible input master clocks : 12MHz, 13MHz and 19.2MHz. 3.4.3 Power Resources The power supply module of Triton generates the different power supplies required by Triton, the processors and the external peripherals. - 33 - 3. Circuit Description Power Supply Scheme - 34 - 3. Circuit Description 3.4.4 Monitoring ADC The monitoring ADC (MADC) consists of a 10-bit analog-to-digital converter (ADC) combined with an 11- input analog multiplexer. The ADC implementation consists of a successive approximation conversion. Five of the eleven inputs are available externally (ADIN1..5), and the remaining six inputs are dedicated to die temperature measurement, main battery voltage, backup battery voltage, charger voltage, charger current monitoring and USB Vbus voltage. Three external inputs (ADIN1..3) are standard inputs. The two others (ADIN4..5) which are associated with current sources, are intended for battery temperature and battery type measurements. ADC 8 channels Resource Name Description VCHG VCHG Charging Management VBAT VBAT ICTL ICTL ADIN1 TEMP_SENSE Temperature Sensing ADIN2 JACK_TYPE Remote control's Detect- Now No Use ADIN3 ADIN4 REMOTE_ADC Remote control's function (play, stop,etc..)- Now No Use ADIN5 BATT_TEMPS Battery Detect ADC Channel Spec 3.4.5 Switch ON/OFF ME550c Power State : Defined 4cases as follow - Power-ON : mobile is powered by main battery or backup battery. - Power-OFF : mobile isn't any battery. - Switch-ON : mobile is powered and waken up from switch-off state. - Switch-OFF : mobile is powered to maintain only the permanent function(ULPD). To enter into Switch-ON state, one of following 4 condition is satisfied. - PWR-ON pushed after a debouncing time of 30ms. - ON_REMOTE : After debouncing, when a falling edgeis detected on RPWON pin. - IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin. - CHARGER_IC :When a charger voltage is above VBAT+0.4V on VCHG. - 35 - 3. Circuit Description 3.4.6 Memories - 512Mbit NAND Flash + 512Mbit DDR RAM 3.4.7 LCD Module The NM200CND module is a Color Active Matrix Liquid Crystal Display with an Light Emission Diode (LED) Back Light system. The matrix employs a-Si Thin Film Transistor as a active element. It is a transmissive type display operating in the normally white mode. This TFT-LCD has a 2.0 inch diagonally measured active display area with QCIF+ resolution(176 x RGB x 220 pixels). Each pixel is divided into Red, Green, Blue sub-pixels or dots which are arranged in vertical stripes. Gray scale or the brightness of the dots color is determined with a 6 bit gray scale signal for each dot, thus, presenting a palette of more than 262,144 colors. 3.4.7.1 General Description Properties Spec. of Main LCD Unit Active screen size 31.68(H)*39.6(V) mm Viewing area size 33.08(H)*41.0(V) mm Color depth 262,000 colors - Resolution 176 x RGB x 220 - Pixel format RGB Vertical Stripe - Dot pitch 0.06(H)*0.18(V) mm Display operating mode Transmissive type - User viewing angle 6 O' clock - 36 - 3. Circuit Description 3.4.7.2 LCD module pin map description - 37 - 3. Circuit Description 3.4.8 Keypad Map description 1 4 7 AST 200 201 202 AST KEYPAD R200 KBR(0) 150 2 5 8 0 203 204 205 206 VA200 EVLC5S02100 R201 KBR(1) 150 3 6 9 SHP 207 208 209 SHP VA201 EVLC5S02100 R202 KBR(2) 150 VA202 EVLC5S02100 R203 150 KBC(0) R204 150 KBC(1) R205 150 KBC(2) R206 150 KBC(3) VA203 VA204 VA205 VA206 SIDE_KEY_VOL CN202 1 R207 150 EVLC5S02100EVLC5S02100 KBC(1) 2 R208 150 EVLC5S02100EVLC5S02100 KBC(0) 3 4 VA208 VA207 EVLC5S02100 R209 150 KBR(3) SIDE_KEY_CAM+PWON CN203 1 2 R211 150 KBC(2) 3 4 R210 150 PWON VA209 VA210 VA211 EVLC5S02100 KEYPAD S_UP S_DOWN S_OK S_LEFT S_RIGHT R122 KBR(4) 150 S_MENU100 S_MENU101 SEND CLR VA100 EVLC5S02100 R123 KBR(5) 150 VA101 EVLC5S02100 R124 150 KBC(0) R125 150 KBC(1) R127 150 KBC(2) R128 150 KBC(3) R129 150 KBC(4) VA102 VA103 VA104 VA105 VA106 EVLC5S02100 EVLC5S02100 EVLC5S02100 EVLC5S02100 EVLC5S02100 Keypad schematic KBC0 KBC1 KBC2 KBC3 KBC4 KBR0 1 4 7 * KBR1 2 5 8 0 KBR2 3 6 9 3 KBR3 VOL_UP VOL_DOWN CAMERA # KBR4 HOT_UP HOT_DOWN O.K HOT_LEFT HOT_RIGHT KBR5 SOFT_LEFT SOFT_RIGHT SEND CLR - 38 - 3. Circuit Description 3.4.9 Bottom System Connector Pin # ME550c Description 18Pin 1 FM_ANT FM_RADIO ANTENNA 2 HSMICIP/HOOK DETECT HEAD SET 3 JACK_TYPE HAED SET 4 HSO_L CHARGING (VCHG) 5 HSO_R CHARGING (VCHG) 6 UART3_TX/USB_DP USB/UART3 (Transmit Data) 7 UART3_RX/USB_DM USB/UART3 (Receive Data) 8 JACK_DETECT HEAD SET 9 VBAT BAT T ERY(+4.2V) 10 VBAT BATTERY(+4.2V) 11 RPWON REMOT E POWER ON 12 VCHG_IN CHARGING (VCHG) 13 VGHG_IN CHARGING (VCHG) 14 UART3_DSR UART3 (Transmit Data) 15 VBUS USB POWER( +5.0 V) 16 UART2_TX TEST : UART2 (Transmit Data) 17 UART2_RX TEST : UART2 (Receive Data) 18 GND GND - 39 - 3. Circuit Description 3.5 Bluetooth Interface 3.5.1 Bluetooth Circuit BT_NRST BLUETOOTH (Shielding Block) VRIO VBAT KA_OUT VLDO_OUT 10K R102 C103 C105 1u VLDO_OUT C106 0.1u 4.7u C108 CLK_32K 47p G7 G6 G5 D6 H6 D8 H8 H3 C2 A3 B3 E3 F1


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