Service Manuals, User Guides, Schematic Diagrams or docs for : Samsung Audio MM-D470D MMD470DXN_SB-SI_1387455697

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MMD470DXN_SB-SI_1387455697


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                                       DVD MICRO
                                       COMPONENT
                                       SYSTEM
                                        Model Name                     MM-D470D
                                        Model Code                     MM-D470D/XN




SERVICE                                              MANUAL
DVD MICRO COMPONENT SYSTEM                                        Contents

                                               1. Precaution

                                               2. Product Specification

                                               3. Disassembly & Reassembly

                                               4. Troubleshooting

                                               5. PCB Diagram
             MM-D470D
                                               6. Schematic Diagram




      Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents



Contents
1.   Precaution........................................................................................................................................ 1 - 1
     1.1.     Safety Precautions ................................................................................................................... 1 - 1
     1.2.     Servicing Precautions ............................................................................................................... 1 - 3
     1.3.     Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 - 4
2.   Product Specification ......................................................................................................................... 2 - 1
     2.1.     Product Feature ....................................................................................................................... 2 - 1
     2.2.     Specifications.......................................................................................................................... 2 - 2
     2.3.     Specifications Analysis ............................................................................................................. 2 - 3
     2.4.     Accessories ............................................................................................................................ 2 - 4
              2.4.1.     Supplied Accessories ................................................................................................... 2 - 4
3.   Disassembly & Reassembly ................................................................................................................ 3 - 1
     3.1.     Main Disassembly & Reassembly ............................................................................................... 3 - 1
     3.2.     DECK Disassembly & Reassembly ............................................................................................. 3 - 4
4.   Troubleshooting ................................................................................................................................ 4 - 1
     4.1.     Checkpoints by Error Mode ....................................................................................................... 4 - 1
     4.2.     No Power ............................................................................................................................... 4 - 2
     4.3.     No Output .............................................................................................................................. 4 - 4
     4.4.     Measures to be taken when the Protection Circuit operates............................................................... 4 - 6
              4.4.1.     Check AMP in Power Protection .................................................................................... 4 - 6
              4.4.2.     MICOM, MPEG Initialization & Update.......................................................................... 4 - 7
     4.5.     Buyer-Region Code Setting Method ............................................................................................ 4 - 8
              4.5.1.     Inserting the Region Code after replacing the Main PCB ..................................................... 4 - 8
5.   PCB Diagram ................................................................................................................................... 5 - 1
     5.1.     Wiring Diagram....................................................................................................................... 5 - 1
     5.2.     TOUCH KEY PCB Top ............................................................................................................ 5 - 2
     5.3.     TOUCH KEY PCB Bottom ....................................................................................................... 5 - 3
     5.4.     VFD PCB Top......................................................................................................................... 5 - 4
     5.5.     VFD PCB Bottom.................................................................................................................... 5 - 5
     5.6.     MAIN PCB Top ...................................................................................................................... 5 - 6
              5.6.1.     Pin Connection ........................................................................................................... 5 - 7
              5.6.2.     Test Point Wave Form .................................................................................................. 5 - 8
     5.7.     MAIN PCB Bottom.................................................................................................................. 5 - 9
6.   Schematic Diagram ........................................................................................................................... 6 - 1
     6.1.     Overall Block Diagram ............................................................................................................. 6 - 1
     6.2.     TOUCH KEY-1 ....................................................................................................................... 6 - 2
     6.3.     TOUCH KEY-2 ....................................................................................................................... 6 - 3
     6.4.     FRONT ................................................................................................................................. 6 - 4
     6.5.     MAIN-1................................................................................................................................. 6 - 5

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