Service Manuals, User Guides, Schematic Diagrams or docs for : Samsung GSM Samsung SGH-X810 service manual
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GSM TELEPHONE
SGH-X810
GSM TELEPHONE CONTENTS
1. Safety Precautions
2. Specification
3. Product Function
4. Array course control
5. Exploded View and Parts List
6. MAIN Electrical Parts List
7. Block Diagrams
8. PCB Diagrams
9. Flow Chart of Troubleshooting
10. Reference data
This Service Manual is a property of Samsung Electronics Co.,Ltd. Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law. Code No.: GH68-07387A
2006. 03. Rev.1.0
1. Safety Precautions
1-1. Repair Precaution ...........................................................................1-1
1-2. ESD(Electrostatically Sensitive Devices) Precaution ...........................1-2
2. Specification
2-1. GSM General Specification ..............................................................2-1
2-2. GSM Tx Power Class ......................................................................2-2
3. Product Function
3-1. Main Function ................................................................................3-1
4. Array course control
Software Downloading
4-1. Downloading Binary Files ................................................................4-2
4-2. Pre-requsite for Downloading ..........................................................4-2
4-3. S/W Downloader Program ...............................................................4-3
5. Exploded View and Parts List
5-1. Cellular phone Exploded View .........................................................5-1
5-2. Cellular phone Part list ...................................................................5-2
5-3. Cellular phone Exploded View .........................................................5-4
5-4. Cellular phone assembling ..............................................................5-7
5-5. Slide FPCB KIT assembling ...........................................................5-15
6. MAIN Electrical Parts List
7. Block Diagrams
8. PCB Diagrams
8-1. Main .............................................................................................8-1
8-2. LCD .............................................................................................8-3
9. Flow Chart of Troubleshooting
9-1. Baseband
9-1-1. Power ON .................................................................................9-1
9-1-2. Initial .......................................................................................9-4
9-1-3. Sim Part ...................................................................................9-6
9-1-4. Charging Part ............................................................................9-8
9-1-5. Microphone Part ......................................................................9-10
9-1-6. Speaker Part ...........................................................................9-12
9-1-7. LCD ........................................................................................9-15
9-1-8. Camera ...................................................................................9-17
9-2. RF
9-2-1. GSM Receiver...........................................................................9-19
9-2-2. DCS Receiver............................................................................9-20
9-2-3. PCS Receiver............................................................................9-21
9-2-4. GSM Transmitter.......................................................................9-23
9-2-5. DCS Transmitter.......................................................................9-24
9-2-6. PCS Transmitter........................................................................9-25
9-2-7. Bluetooth Part .........................................................................9-27
10. Reference data
1. Safety Precautions
1-1. Repair Precaution
Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test,
because specipicty of cellular phone is sensitive for surrounding interference(RF noise).
Be careful to use a kind of magnetic object or tool,
because performance of parts is damaged by the influence of manetic force.
Surely use a standard screwdriver when you disassemble this product,
otherwise screw will be worn away.
Use a thicken twisted wire when you measure level.
A thicken twisted wire has low resistance, therefore error of measurement is few.
Repair after separate Test Pack and Set because for short danger (for example an
overcurrent and furious flames of parts etc) when you repair board in condition of
connecting Test Pack and tuning on.
Take specially care of soldering, because Land of PCB is small and weak in heat.
Surely tune on/off while using AC power plug, because a repair of battery charger is
dangerous when tuning ON/OFF PBA and Connector after disassembing charger.
Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
1-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Safety Precautions
1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easilly by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity
prevention string on wrist.
Use earthed soldering steel when you connect or disconnect ESD.
Use soldering removing tool to break static electricity. , otherwise ESD will be damaged by
static electricity.
Don't unpack until you set up ESD on product. Because most of ESD are packed by box and aluminum
plate to have conductive power,they are prevented from static electricity.
You must maintain electric contact between ESD and place due to be set up until ESD is connected
completely to the proper place or a circuit board.
1-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
2. Specification
2-1. GSM General Specification
GSM900 E G S M 9 00 DCS1800
PC S1 90 0
Ph ase 1 Ph ase 2 Ph ase 1
Freq. Ban d [M Hz ] 89 0~ 91 5 88 0~ 91 5 1 71 0~ 1 78 5 18 50 ~1 91 0
Upl in k/Downl in k 93 5~ 96 0 92 5~ 96 0 1 80 5~ 1 88 0 19 30 ~1 99 0
0 ~ 1 24 &
A RF C N ra n g e 1 ~ 1 24 51 2~8 85 5 12 ~8 10
9 75 ~ 10 23
Tx/R x sp aci ng 45 MHz 45 MHz 95 MHz 8 0M Hz
Mod. Bit rat e/ 270.833kbp s 2 70 . 8 33 k b ps 270.833kbp s 27 0. 83 3kb p s
Bit Period 3.692us 3.692us 3.692us 3. 69 2u s
Tim e Sl ot
576.9us 576.9us 576.9us 57 6. 9u s
P eri od /F rame
4. 61 5m s 4 .6 15 m s 4. 61 5ms 4. 61 5ms
Peri od
Modu la t ion 0. 3GM SK 0. 3GM S K 0. 3GM SK 0 .3 GMS K
MS Power 3 3d B m ~ 13 dB m 3 3d B m ~ 5 d B m 3 0d B m ~ 0 d Bm 30 d Bm ~ 0d B m
P ow er Cl a ss 5 p cl ~ 15 p cl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl
S en sitivi t y -1 02 d B m - 10 2d B m -1 00 d B m - 1 00 dBm
TDM A Mu x 8 8 8 8
Cell Ra d iu s 35 Km 35 Km 2 Km -
2-1
Speclflcation
2-2. GSM Tx Power Class
TX Power TX Power TX Power
GSM900 DCS1800 PCS1900
control level control level control level
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