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UMTS TELEPHONE
SGH-ZV50

UMTS TELEPHONE CONTENTS

1. Safety Precautions
2. Specification

3. Product Function

4. Array course control

5. Exploded View and Parts List

6. MAIN Electrical Parts List

7. Block Diagrams

8. PCB Diagrams

9. Flow Chart of Troubleshooting

10. Reference data

11. Disassembly and Assembly
Instructions
CONTENTS

1. Safety Precautions
1-1. Repair Precaution .........................................................................1-1
1-2. ESD(Electrostatically Sensitive Devices) Precaution ..........................1-2

2. Specification
2-1. GSM General Specification .............................................................2-1
2-2. GSM Tx Power Class .....................................................................2-2

3. Product Function

4. Array course control
Software Downloading
4-1. Downloading Binary Files ..............................................................4-2
4-2. Pre-requsite for Downloading ........................................................4-2
4-3. S/W Downloader Program .............................................................4-3

5. Exploded View and Parts List
5-1. Cellular phone Exploded View .......................................................5-1
5-2. Cellular phone Part list .................................................................5-2

6. MAIN Electrical Parts List

7. Block Diagrams
7-1. RF Solution Block Diagram.............................................................7-1
7-2. BaseBand Solution Block Diagram...................................................7-2

8. PCB Diagrams
CONTENTS

9. Flow Chart of Troubleshooting
9-1. Power On.....................................................................................9-1
9-2. Initial ..........................................................................................9-4
9-3. Charging Part................................................................................9-5
9-4. Sim Part......................................................................................9-7
9-5. Microphone Part ...........................................................................9-9
9-6. Speaker Part(Melody)..................................................................9-11
9-7. Key Data Input...........................................................................9-13
9-8. Earphone Part.............................................................................9-14
9-9. LCD Part.....................................................................................9-16
9-10. Key Back Light(Main).................................................................9-17
9-11. Camera Part.............................................................................9-19
9-12. GSM900 Receiver......................................................................9-20
9-13. GSM900 Transmitter..................................................................9-21
9-14. DCS Receiver............................................................................9-22
9-15. DCS Transmitter........................................................................9-23
9-16. PCS Receiver............................................................................9-24
9-17. PCS Transmitter........................................................................9-25
9-18. WCDMA Receiver.......................................................................9-26
9-19. WCDMA Transmitterr.................................................................9-27

10. Reference data
10-1. Reference Abbreviate..................................................................10-1

11. Disassembly and Assembly Instructions
11-1. Disassemby...............................................................................11-1
11-2. Assembly..................................................................................11-4
1. Safety Precautions

1-1. Repair Precaution

Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test,
because specipicty of cellular phone is sensitive for surrounding interference(RF noise).

Be careful to use a kind of magnetic object or tool,
because performance of parts is damaged by the influence of magnetic force.

Surely use a standard screwdriver when you disassemble this product,
otherwise screw will be worn away.

Use a thicken twisted wire when you measure level.
A thicken twisted wire has low resistance, therefore error of measurement is few.

Repair after separate Test Pack and Set because for short danger (for example an
overcurrent and furious flames of parts etc) when you repair board in condition of
connecting Test Pack and tuning on.

Take specially care of soldering, because Land of PCB is small and weak in heat.

Surely tune on/off while using AC power plug, because a repair of battery charger is
dangerous when tuning ON/OFF PBA and Connector after disassembling charger.

Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

1-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Safety Precautions

1-2. ESD(Electrostatically Sensitive Devices) Precaution

Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.

Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity
prevention string on wrist.

Use earthed soldering steel when you connect or disconnect ESD.

Use soldering removing tool to break static electricity. , otherwise ESD will be damaged by
static electricity.

Don't unpack until you set up ESD on product. Because most of ESD are packed by box and aluminum
plate to have conductive power,they are prevented from static electricity.

You must maintain electric contact between ESD and place due to be set up until ESD is connected
completely to the proper place or a circuit board.

1-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
2. Specification

2-1. GSM General Specification

EG SM 900 DCS1 800 PCS1 900 W- CDMA

Fr eq. Band [MHz] 880~9 15 1710~1 785 1850~1 910 1 920~19 80
Up link/ Do wnl ink 925~9 60 1805~1 880 1930~1 990 2 110~21 70

0~1 24 & UL:9 612~98 88
ARFCN ran ge 512~8 85 512~8 10
975~1 023 DL:10 562~10 838

Tx/Rx spacin g 45MHz 95MHz 80MHz 190MHz

Mod . Bit r ate/ 270.8 33kbps 270.8 33kbps 270.8 33kbps 3. 84Mcps
Bi t Peri od 3.69 2us 3.69 2us 3.69 2us

Tim e Slot 576. 9us 576. 9us 576. 9us F rame l ength : 10ms
Per iod/ Fra me Per iod 4 .615ms 4 .615ms 4 .615ms Slot lengt h : 0. 667ms

GSM/ 0.3G MSK 0.3G M SK 0.3G MSK
G PR S
QPSK
Modu lation
HQPSK
EDG E 8PSK 8PSK 8PSK

MS Power 33dBm~ 5dBm 30dBm~ 0dBm 30dBm~ 0dBm 2 4dBm ~ - 50dBm

4 1 1 3
Po wer Class
(max +33dBm) (max +30dBm) (max +30dBm) (max +24dBm)

Sen sitivity - 102dBm - 100dBm - 100dBm - 106.7 dBm

TDMA M ux 8 8 8

Cell Radius 35Km 2Km 2Km 2Km

2-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Specification

2-2. GSM TX power class
TX Power TX Power TX Power
GSM900 DCS1800 PCS1900
control level control level control level

5 33

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