Service Manuals, User Guides, Schematic Diagrams or docs for : Samsung Laptop NP-Q20 Sens_Q20-9~10-PartsList
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This Document can not be used without Samsung's authorization.
9 Ext-Device Exploded View and Parts List
Sens Q 20 9-1
9 Ext-Device Exploded View and Parts List This Document can not be used without Samsung's authorization.
NO SEC CODE DESCRIPTION SPECIFICATION Q'TY REMARK
1 BA72-01140A CASE-TOP-DVD, EXT PC/ABS TALC 1
2 BA72-01141A CASE-BOTTOM-DVD, EXT PC/ABS TALC 1
3 BA61-00170A BRKT-DVD, EXT SUS 0.8T 1
4 BA72-01142A COVER-SIDE, EXT PC/ABS 2
5 BA61-00171A BRKT-COVER-TOP, EXT SUS 0.5T 1
6 BA75-00682A UNIT-BEZEL-DVD, EXT 1 DVD
BA75-10042A UNIT-BEZEL-CDRW, EXT 1 CDRW
BA75-00683A UNIT-BEZEL-COMBO, EXT 1 COMBO
6-1 BA72-01155A BEZEL-DVD, EXT PC/ABS 1 DVD
BA64-00224A BEZEL-CDRW, EXT PC/ABS 1 CDRW
BA72-01155B BEZEL-COMBO, EXT PC/ABS 1 COMBO
6-2 BA67-00103A LENS-DVD, EXT ACRYL 1
6-3 BA64-00195A KNOB-DVD, EXT PC/ABS 1
6-4 BA70-00559A PLATE-DVD, EXT SUS304 0.15T 1
7 BA73-00190A RUBBER-FOOT, EXT URETHAN 2
8 BA96-01115A ASSY-DVD(Toshiba) 1
BA96-01116A ASSY-CDRW(Toshiba) 1
BA96-01117A ASSY-COMBO(Toshiba) 1
9 Q10 EXTERNAL-DEVICE I/F BOARD 1
10 BA39-00266A EXTERNAL-DEVICE 1394 CABLE 1
11 BA63-00129A GASKET SPDIF GASKET 2
12 6001-001446 MACHINE-SCREW(M2.0*2.5 PH YEL) 6
13 6001-001417 MACHINE-SCREW(M2.0*5.0 PH YEL) 5
14 6001-001154 MACHINE-TAPPING(M2.6*4.0 PM YEL) 6
15 Q10 EMI
9-2 Sens Q 20
This Document can not be used without Samsung's authorization.
10 Ext-Device Schematic Diagrams and PCB Silkscreen
10-1 Ext-Device Main Board Schematic Diagrams
Sens Q 20 10-1
10 Ext-Device Schematic Diagrams and PCB Silkscreen This Document can not be used without Samsung's authorization.
10-1-1(a) Ext-Device Main Board Schematic Sheet 2 of 5(1394 PHY)
10-2 Sens Q 20
This Document can not be used without Samsung's authorization. 10 Ext-Device Schematic Diagrams and PCB Silkscreen
10-1-1(b) Ext-Device Main Board Schematic Sheet 3 of 5(1394 TO IDE)
Sens Q 20 10-3
10 Ext-Device Schematic Diagrams and PCB Silkscreen This Document can not be used without Samsung's authorization.
10-1-1(c) Ext-Device Main Board Schematic Sheet 4 of 5(IDE CONN)
10-4 Sens Q 20
This Document can not be used without Samsung's authorization. 10 Ext-Device Schematic Diagrams and PCB Silkscreen
10-1-1(d) Ext-Device Main Board Schematic Sheet 5 of 5(POWER)
Sens Q 20 10-5
10 Ext-Device Schematic Diagrams and PCB Silkscreen This Document can not be used without Samsung's authorization.
10-2 Ext-Device PCB Silkscreen
10-6 Sens Q 20
This Document can not be used without Samsung's authorization. 10 Ext-Device Schematic Diagrams and PCB Silkscreen
Sens Q 20 10-7
10 Ext-Device Schematic Diagrams and PCB Silkscreen This Document can not be used without Samsung's authorization.
10-3 Part List
REF SEC code DESCRIPTION
D2 0402-001097 DE-SCHOTTKY;B140,40V,1000MA,DO-214AC,TP, B140
D1 0402-001405 DE-RECTIFIER;B340A,40,3A,SMA,TP, B340A
Q1 0501-000458 SMALL SIGNAL;KST2222ATF,NPN,350mW,SOT-23,TP, KST2222A
QF2 0505-001165 d, FET-SILICON;SI3443DV,P,-20V,+-3.5mA,65mohm, SI3443DV
QF1 0505-001197 s_4d, FET-SILICON;SI4450DY,N,60V,+-7.5A,0.03ohm,, SI4450DY
U1 U5 0801-002462 CMOS LOGIC;7SZ125,GATE BUFFER,SOT-23,5P,63MIL,, NC7SZ125M5X
U3 0904-001578 IC-BUS CONTROLLER;S1R72803F00A,16BIT,QFP,184P,787, S1R72803
U7 0904-001579 IC-BUS CONTROLLER;SPC7290F0A,-,QFP,64P,394MIL,-,T, SPC7290F
U2 1203-001472 C-SWITCH REG.;1624,SOP,8P,150MIL,PLASTIC,1.1, LTC1624CS8#TR
U4 1203-001964 C-VOL. REFERANCE;1772,SOT-23,6P,60MIL,PLASTIC,1., LTC1772CS6
U6 1203-002364 C-RESET;TPS3809K33,SOT-23,3P,63MIL,PLASTIC,3.3V,, TPS3809
R25 2007-000029 P;0OHM,5%,1/10W,DA,TP,2012
R42 2007-000048 HIP;6.19Kohm,1%,1/16W,DA,TP,1608
R20 2007-000067 HIP;15Kohm,1%,1/16W,DA,TP,1608
R6 R27 2007-000070 P;0ohm,5%,1/16W,DA,TP,1608
R7 R38 2007-000074 P;100ohm,5%,1/16W,DA,TP,1608
R28 R29 R41 2007-000078 P;1Kohm,5%,1/16W,DA,TP,1608
R31 2007-000086 P;5.6Kohm,5%,1/16W,DA,TP,1608
R18 2007-000087 P;6.8Kohm,5%,1/16W,DA,TP,1608
R1 R2 R4 R8 R9 R26 2007-000090 P;10KOHM,5%,1/16W,DA,TP,1608
R30 R32 R33 R34
R35 R37 R39 R40
R49 R50
R21 2007-000102 P;100Kohm,5%,1/16W,DA,TP,1608
R5 R36 2007-000113 P;33ohm,5%,1/16W,DA,TP,1608
R16 2007-000286 HIP;100OHM,1%,1/10W,DA,TP,2012
R3 2007-000586 P;22KOHM,5%,1/10W,DA,TP,2012
R17 2007-000828 HIP;39Kohm,1%,1/16W,DA,TP,1608
R24 2007-000910 HIP;43Kohm,1%,1/16W,DA,TP,1608
R14 2007-000962 HIP;5.1Kohm,1%,1/16W,DA,TP,1608
R10 R11 R12 R13 2007-001044 P;56ohm,5%,1/16W,DA,TP,1608
R19 2007-001161 P;75Kohm,5%,1/16W,DA,TP,1608
R22 2007-002900 HIP;11Kohm,1%,1/16W,DA,TP,1608
R23 2007-002906 HIP;200Kohm,1%,1/16W,DA,TP,1608
R15 R48 2007-007568 CHIP;0.033ohm,1%,1W,DA,TP,6331
RA7 2011-000002 ETWORK;22ohm,5%,63mW,L,CHIP,8P,TP
RA1 RA2 RA3 RA4 2011-000881 ETWORK;33ohm,5%,1/16W,L,CHIP,8P,TP
RA5 RA6
C1 C5 C14 C16 C17 2203-000189 CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
10-8 Sens Q 20
This Document can not be used without Samsung's authorization. 10 Ext-Device Schematic Diagrams and PCB Silkscreen
REF SEC code DESCRIPTION
C19 C20 C21 C22
C23 C26 C28 C40
C41 C42 C47
C8 C10 2203-000206 RAMIC,CHIP;100nF,10%,50V,X7R,TP,2012
C11 C13 2203-000236 RAMIC,CHIP;0.1nF,5%,50V,NP0,TP,1608
C46 C48 2203-000257 RAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C6 C35 2203-000384 RAMIC,CHIP;0.015nF,5%,50V,NP0,TP,1608
C9 C12 C15 C24 C25 2203-000440 RAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C27 C29 C30 C31
C32 C33 C34 C36
C4 2203-001724 CERAMIC,CHIP;4700NF,+80-20%,16V,Y5V,TP,3216
C2 C3 2203-005137 RAMIC,CHIP;10uF,+80-20%,50V,JE,TP,5650,-
C7 2203-005194 RAMIC,CHIP;220pF,10%,50V,X7R,TP,1608,-
C38 C39 2203-005198 CERAMIC,CHIP;1uF,10%,10V,X5R,TP,2012,-
C18 C43 2203-005437 CERAMIC,CHIP;10000nF,+80-20%,10V,Y5V,TP,3216
C44 C45 2402-001109 LYMER AL CHIP;100uF,20%,6.3V,LZ,TP,7.3x4.3x3.
L2 2703-001432 INDUCTOR-SMD;4.7uH,20%,4x4.5x3.2mm, CD43-4R7MC
L1 2703-002085 INDUCTOR-SMD;10uH,30%,10x10.1x3.8mm, CDRH104R-100MC
Y1 2801-003898 TAL-SMD;24.576MHz,50ppm,28-ACC,12pF,50ohm,TP, FA-365-24.576MHz
J2 3711-002050 r-smd-mnt, CONNECTOR-HEADER;BOX,10P,1R,1.25mm,SMD-A,SN, 53261-1090
J1 3711-004900 , CONNECTOR-HEADER;BOX,6P,1R,1.5MM,ANGLE,AU,GRY, 353303-6
J3 517735 r, CONNECTOR-SOCKET;50P,2R,0.8MM,ANGLE,AU, 80093A-050G1
C1 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C2 2203-005137 ccap, C-CERAMIC,CHIP;10uF,+80-20%,50V,JE,TP,5650,-
C3 2203-005137 ccap, C-CERAMIC,CHIP;10uF,+80-20%,50V,JE,TP,5650,-
C4 2203-001724 ccap_v, C-CERAMIC,CHIP;4700NF,+80-20%,16V,Y5V,TP,3216
C5 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C6 2203-000384 ccap, C-CERAMIC,CHIP;0.015nF,5%,50V,NP0,TP,1608
C7 2203-005194 ccap, C-CERAMIC,CHIP;220pF,10%,50V,X7R,TP,1608,-
C8 2203-000206 ccap, C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,2012
C9 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C10 2203-000206 ccap, C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,2012
C11 2203-000236 ccap, C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,1608
C12 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C13 2203-000236 ccap, C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,1608
C14 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C15 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C16 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C17 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
Sens Q 20 10-9
10 Ext-Device Schematic Diagrams and PCB Silkscreen This Document can not be used without Samsung's authorization.
REF SEC code DESCRIPTION
C18 2203-005437 ccap_v, C-CERAMIC,CHIP;10000nF,+80-20%,10V,Y5V,TP,3216
C19 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C20 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C21 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C22 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C23 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C24 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C25 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C26 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C27 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C28 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C29 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C30 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C31 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C32 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C33 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C34 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C35 2203-000384 ccap, C-CERAMIC,CHIP;0.015nF,5%,50V,NP0,TP,1608
C36 2203-000440 ccap, C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
C38 2203-005198 ccap_v, C-CERAMIC,CHIP;1uF,10%,10V,X5R,TP,2012,-
C39 2203-005198 ccap_v, C-CERAMIC,CHIP;1uF,10%,10V,X5R,TP,2012,-
C40 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C41 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C42 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C43 2203-005437 ccap_v, C-CERAMIC,CHIP;10000nF,+80-20%,10V,Y5V,TP,3216
C44 2402-001109 ecap, C-POLYMER AL CHIP;100uF,20%,6.3V,LZ,TP,7.3x4.3x3.
C45 2402-001109 ecap, C-POLYMER AL CHIP;100uF,20%,6.3V,LZ,TP,7.3x4.3x3.
C46 2203-000257 ccap, C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C47 2203-000189 ccap_v, C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,1608,
C48 2203-000257 ccap, C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
D1 0402-001405 diode, DIODE-RECTIFIER;B340A,40,3A,SMA,TP, B340A
D2 0402-001097 diode, DIODE-SCHOTTKY;B140,40V,1000MA,DO-214AC,TP, B140
J1 3711-004900 head-6s-1r, CONNECTOR-HEADER;BOX,6P,1R,1.5MM,ANGLE,AU,GRY, 353303-6
J2 3711-002050 head-10s-1r-smd-mnt, CONNECTOR-HEADER;BOX,10P,1R,1.25mm,SMD-A,SN, 532
J3 517735 sock-50z-4r, CONNECTOR-SOCKET;50P,2R,0.8MM,ANGLE,AU, 80093A-050G1
L1 2703-002085 inductor, INDUCTOR-SMD;10uH,30%,10x10.1x3.8mm, CDRH104R-100MC
L2 2703-001432 inductor, INDUCTOR-SMD;4.7uH,20%,4x4.5x3.2mm, CD43-4R7MC
Q1 0501-000458 npn_tr, TR-SMALL SIGNAL;KST2222ATF,NPN,350mW,SOT-23,TP, KST2222A
QF1 0505-001197 nmos_fet_3s_4d, FET-SILICON;SI4450DY,N,60V,+-7.5A,0.03ohm,, SI4450DY
10-10 Sens Q 20
This Document can not be used without Samsung's authorization. 10 Ext-Device Schematic Diagrams and PCB Silkscreen
REF SEC code DESCRIPTION
QF2 0505-001165 pmos_fet_4d, FET-SILICON;SI3443DV,P,-20V,+-3.5mA,65mohm, SI3443DV
R1 2007-000090 res, R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R2 2007-000090 res, R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R3 2007-000586 res, R-CHIP;22KOHM,5%,1/10W,DA,TP,2012
R4 2007-000090 res, R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R5 2007-000113 res, R-CHIP;33ohm,5%,1/16W,DA,TP,1608
R6 2007-000070 res, R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R7 2007-000074 res, R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R8 2007-000090 res, R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R9 2007-000090 res, R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R10 2007-001044 res, R-CHIP;56ohm,5%,1/16W,DA,TP,1608
R11 2007-001044 res, R-CHIP;56ohm,5%,1/16W,DA,TP,1608
R12 2007-001044 res, R-CHIP;56ohm,5%,1/16W,DA,TP,1608
R13 2007-001044 res, R-CHIP;56ohm,5%,1/16W,DA,TP,1608
R14 2007-000962 res_t, R-CHIP;5.1Kohm,1%,1/16W,DA,TP,1608
R15 2007-007568 res_pt, R-CHIP;0.033ohm,1%,1W,DA,TP,6331
R16 2007-000286 res_t, R-CHIP;100OHM,1%,1/10W,DA,TP,2012
R17 2007-000828 res_t, R-CHIP;39Kohm,1%,1/16W,DA,TP,1608
R18 2007-000087 res, R-CHIP;6.8Kohm,5%,1/16W,DA,TP,1608
R19 2007-001161 res, R-CHIP;75Kohm,5%,1/16W,DA,TP,1608
R20 2007-000067 res_t, R-CHIP;15Kohm,1%,1/16W,DA,TP,1608
R21 2007-000102 res, R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R22 2007-002900 res_t, R-CHIP;11Kohm,1%,1/16W,DA,TP,1608
R23 2007-002906 res_t, R-CHIP;200Kohm,1%,1/16W,DA,TP,1608
R24 2007-000910 res_t, R-CHIP;43Kohm,1%,1/16W,DA,TP,1608
R25 2007-000029 res, R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R26 2007-000090 res, R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R27 2007-000070 res, R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R28 2007-000078 res, R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R29 2007-000078 res, R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R30 2007-000090 res, R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R31 2007-000086 res, R-CHIP;5.6Kohm,5%,1/16W,DA,TP,1608
R32 2007-000090 res, R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R33 2007-000090 res, R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R34 2007-000090 res, R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R35 2007-000090 res, R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R36 2007-000113 res, R-CHIP;33ohm,5%,1/16W,DA,TP,1608
R37 2007-000090 res, R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R38 2007-000074 res, R-CHIP;100ohm,5%,1/16W,DA,TP,1608
Sens Q 20 10-11
10 Ext-Device Schematic Diagrams and PCB Silkscreen This Document can not be used without Samsung's authorization.
REF SEC code DESCRIPTION
R39 2007-000090 res, R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R40 2007-000090 res, R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R41 2007-000078 res, R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R42 2007-000048 res_t, R-CHIP;6.19Kohm,1%,1/16W,DA,TP,1608
R48 2007-007568 res_pt, R-CHIP;0.033ohm,1%,1W,DA,TP,6331
R49 2007-000090 res, R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R50 2007-000090 res, R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
RA1 2011-000881 rneta, R-NETWORK;33ohm,5%,1/16W,L,CHIP,8P,TP
RA2 2011-000881 rneta, R-NETWORK;33ohm,5%,1/16W,L,CHIP,8P,TP
RA3 2011-000881 rneta, R-NETWORK;33ohm,5%,1/16W,L,CHIP,8P,TP
RA4 2011-000881 rneta, R-NETWORK;33ohm,5%,1/16W,L,CHIP,8P,TP
RA5 2011-000881 rneta, R-NETWORK;33ohm,5%,1/16W,L,CHIP,8P,TP
RA6 2011-000881 rneta, R-NETWORK;33ohm,5%,1/16W,L,CHIP,8P,TP
RA7 2011-000002 rneta, R-NETWORK;22ohm,5%,63mW,L,CHIP,8P,TP
U1 0801-002462 7s125, IC-CMOS LOGIC;7SZ125,GATE BUFFER,SOT-23,5P,63MIL,, NC7SZ125M5X
U2 1203-001472 ltc1624, IC-SWITCH REG.;1624,SOP,8P,150MIL,PLASTIC,1.1, LTC1624CS8#TR
U3 0904-001578 s1r72803, IC-BUS CONTROLLER;S1R72803F00A,16BIT,QFP,184P,787, S1R72803
U4 1203-001964 ltc1772, IC-VOL. REFERANCE;1772,SOT-23,6P,60MIL,PLASTIC,1., LTC1772CS
U5 0801-002462 7s125, IC-CMOS LOGIC;7SZ125,GATE BUFFER,SOT-23,5P,63MIL,, NC7SZ125M5X
U6 1203-002364 tps3809, IC-RESET;TPS3809K33,SOT-23,3P,63MIL,PLASTIC,3.3V,, TPS3809
U7 0904-001579 spc7290f, IC-BUS CONTROLLER;SPC7290F0A,-,QFP,64P,394MIL,-,T, SPC7290F
Y1 2801-003898 xtal, CRYSTAL-SMD;24.576MHz,50ppm,28-ACC,12pF,50ohm,TP, FA-365-24.576
10-12 Sens Q 20
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