Service Manuals, User Guides, Schematic Diagrams or docs for : Samsung samsung_np-r540_r780_bremen2-l_rev_0.9_sch
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
Sheet 1. Cover
BREMEN2-L Sheet 2-6.
Sheet 7.
Sheet 8
Diagram (Block/Power) & Annotations
Clock Generator -CK505 Shrink Version
Thermal Sensor & FAN
Sheet 9-12 Arrandale CPU
Sheet 13. DDR3 SODIMM A
Sheet 14. DDR3 SODIMM B
CPU :Intel Arrandale Sheet 15-19. IBEX PEAK
Sheet 20-23 GFx_External_M92-XTX
Chip Set :Intel Ibex Peak(HM55) Sheet 24-27 Graphics_Memory_gDDR3 1g bit
Sheet 28 Graphic Strap
C
GFX : M92-XTX / Park-XT Sheet 29-31 Graphic Interface C
Sheet 32-33 High Definition Audio (ALC269Q-GR)
Remarks : Calpella Platform Sheet 34 LAN_Marvell_88E8040
Sheet 35 MultiCard_AU6336 (3 in 1)
Model Name : BREMEN2-L Sheet 36 PCIE_Minicard_Slot (Half type only)
Sheet 37 SATA I/F CONN
PBA Name : MAIN Sheet 38 MICOM_MEC1300-NU
Sheet 39 Micom Glue Logic
PCB Code : BA41-01285A Sheet 40 LED_Switch
Sheet 41 USB Port
BA41-01286A Sheet 42 Touchpad LED
BA41-01287A Sheet 43 USB Interface
Sheet 44 Charger
Dev. Step : PR Sheet 45 PWR_3V_5V
B
Revision : 0.9 Sheet 46 PWR_Calpella B
Sheet 47 PWR_Memory
T.R. Date : 2010.04.25 Sheet 48 PWR_CPU_VRM
Sheet 49 PWR_GFX_Ext
Sheet 50 PWR_MV_Switched
Sheet 51 PWR_MV_DisCharger
Sheet 52 2 USB Port & Power S/W SUB B'D
Design CHECK APPROVAL Sheet 53 SATA ODD SUB B'D Battery IF B'D
Sheet 54 EMC Capacitor & ICT Port
A A
MS Yang SE Lee MK Kim DRAW
MS Yang
DATE
1/26/2010
TITLE
BREMEN2 SAMSUNG
CHECK DEV. STEP
ELECTRONICS
SE Lee ADV MAIN
APPROVAL REV PART NO.
COVER
Owner : SEC Mobile R & D Signature : X MK Kim REV 0.1 BA41-
MODULE CODE LAST EDIT
March 06, 2010 17:48:35 PM PAGE 1 OF 54
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D:/Users/mobile39/mentor/Bremen-2/0306/Bremen2-M_MAIN
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
BLOCK DIAGRAM
D D
CPU
Thermistor
Clocking CPU P5.0V_ALW
FAN
DC/DC POWER LOGIC
CPU P1.05V
EMC2012 CK-505-Shrink
PG 8
P3.3V_AUX
PG 8 PG 8 IMVP-6.5
PG 32 HDMI - B GFX VR P1.8V Charging
HDMI
Arrandale Circuit
LCD
PG 30 LCD M92-XTX PCIE X16
PG 45
PG 31 CRT PARK-XT
CRT Channel A (Standard)
DDR 3 1067/1333 DDR 3 PG 13
SODIMM 0 DDR 3 Power
Dual channel
DDR 3 PG 14 PG 48
C PG 9, 10,11,12 L3 Cache : 6 MB Channel B (Reverse) C
DDR 3 1067/1333 SODIMM 1
DMI PECI
x4, 1.5V
PCIE x1 Lane 6 PG 35 Marvell RJ45
88E8040
PG 44 USB 0,1,4,9 USB 0,1,4,9
PCH
High Definition Audio USB 11 ANT
HDAUDIO PG 46 Camera
PCIE x1 Lane 1
USB 2 PG 37 Mini Card 1
PG 33
Audio HD Audio
ALC269
IBEX PEAK
PG 33 PG 16 - 20
USB 3 SD(SDHC) PG 36
B PG 34 3 in 1 (AU6336) B
MMC PG 36
2P 2P SATA 0
SATA 1
LPC
SPI
HP PG 34
MIC-IN
PG 38 SATA HDD SPI ROM
SPKR R
PG 55 SATA ODD SUB BD
SPKR L Touch
PAD PG 40
MICOM
3.3V LPC, 33MHz KBD PG 40
SMSC MEC1300
PG 39
80 Port
A A
DRAW DATE TITLE
PG 44
CHECK
MS Yang
DEV. STEP
1/26/2010
BREMEN2 SAMSUNG
ELECTRONICS
SE Lee ADV MAIN
APPROVAL REV PART NO.
MK Kim REV 0.1 BLOCK DIAGRAM BA41-
MODULE CODE LAST EDIT
undefined March 06, 2010 17:48:35 PM PAGE 2 OF 54
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. POWER DIAGRAM Rev 0.1
D KBC3_SUSPWR KBC3_PWRON D
(CHP3_SLPS4#) (CHP3_SLPS3*) KBC3_VRON
AC Adapter
P1.1V_VTT VCC_CORE
Battery DC VDC P1.05V
PEG
P1.5V_AUX SODIMM (DDR III) P1.5V gDDR-3 for EGFX
CFD
P0.75V
C C
PCMCIA HDD
FDD USB M_PCI
SPI ROM
P3.3V_MICOM P5.0V CRT HEATSINK FAN CIRCUIT
MICOM MDC AUX DISPLAY
MICOM PEG
CFD
P5.0V_STB P1.8V Nvidia N11
P5.0V_ALW USB CONN
P5.0V_ALW USB CONN
EGFX_CORE Nvidia N11
P5V_AUX IBEX PEAK
USB CONN
When USB Charge Enable
IBEX PEAK Thermal Sensor LCD BT
IBEX PEAK FF Sensor
P3.3V Nvidia N10P MICOM MDC
P3.3V_ALW P3.3V_AUX LAN DDR3 MINI PCIE HD AUDIO
B B
EXPCARD LEDs MMC
P12.0V_ALW P1.2V_LAN LAN
Power On/Off Table by S-state
Rail
S0 S3 S4 S5
State
+V*A(LWS) S5-S4 S3 S0
ON ON ON ON
+V*LAN
A +1.8V_AUX A
ON ON
+0.9V
DRAW DATE TITLE
+V*AUX ON ON
CHECK
MS Yang
DEV. STEP
1/26/2010
BREMEN2 SAMSUNG
ELECTRONICS
SE Lee ADV MAIN
+V ON
APPROVAL REV PART NO.
MK Kim REV 0.1 POWER DIAGRAM BA41-
+V* (CORE) ON
MODULE CODE LAST EDIT
undefined March 06, 2010 17:48:35 PM PAGE 3 OF 54
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER RAILS ANALYSIS
220V
Rev. 0.6 (060920)
D D
5.0V_AUX ( TBD A )
Adapter Battery
3.3V_AUX ( TBD A )
MICOM 3V ( TBD A )
1.8V ( TBD A )
1.05V
0.1 A (TBD) ITP
CPU CORE MICOM 3V
CPU CORE ( TBD A )
1.05V (VCCP)
41 A (TBD) Penryn-6M 3.3V
0.75 A (TBD)
Thermal
3.3V
0.08 A (TBD) KBC
1.05V ( TBD A ) 4.5 A (TBD) Sensor 0.08 A (TBD)
1.5V ( 35 W )
1.5V ( TBD A ) 0.13 A (TBD)
1.25V ( TBD A )
3.3V ( TBD A ) MICOM 3V
5.0V ( TBD A ) 1.05V (MCH CORE)
0.1 A (TBD) PWR LED
1.8V_AUX ( TBD A ) 7.7 A (TBD)
1.05V (VCCP)
0.9V( TBD A ) 4.48 A (TBD) Cantiga
1.5V 1.8V
C 0.125 A (TBD) 3.3V C
1.25V GMCH 0.25 A (TBD) CLOCK 3.3V
VGA CORE (TBD A)
2.43A (TBD)
VDC INV ( TBD A )
3.3V
0.33 A (TBD)
PEX IO (TBD A)
1.8V_AUX 3.79 A (TBD) (8 - 8.5 W )
RTC_Battery
3.3V KeyBoard
0.2 A (TBD) 3.3V_AUX
0.6 A (TBD) LAN
1.05V
1.13 A (TBD)
1.5V
3.3V 2.4A (TBD) ICH9-M 3.3V
0.374 A (TBD) 0.01 A (TBD) KBD LED 3.3V_AUX
3.3V_AUX 0.1 A (TBD) SD Card
0.209 A (TBD)
5V
5V_AUX 0.001 A (TBD)
RTC_Battery
0.001 A (TBD) ( ~ 2.0 W ) 3.3V 0.015 A (TBD) SPI 3.3V
0.006 A (TBD)
5V
1.0V-1.1V (EGFX CORE) 3.3V
17.75 A (TBD) 5V 0.06 A (TBD) HD Audio 3.3V
0.07 A (TBD) 1.5 A (TBD)
1.8V 3.3V_AUX
6.53 A (TBD) PEG 1.5V
0.5 A (TBD) Mini Card X 2
0.75A (TBD)
1.2V (PEX IO)
1.75 A (TBD) 5V
3.3V
0.67 A (TBD)
1.5 A (TBD) ODD SATA
3.3V_AUX
B
1.8V_AUX
0.5 A (TBD) MDC B
0.9V
3.1 A (TBD) DDR-3 5V
0.22 A (TBD) SATA HDD
1 A (TBD) (Dual slots)
( ~ 5.0 W )
1.8V GDDR 5V FAN
3.1 A (TBD) 0.16 A (TBD)
3.3V (LCD 3V)
0.67 A (TBD) 5V Audio AMP
19V (VDC INV)
0.5 A (TBD)
LCD 1.5 A (TBD)
P3.3V_AUX 5V
0.08 A (TBD) 2 A (TBD) USB (x 3)
P1.2V_LAN 0.29 A (TBD) LAN (88E8055)
P1.8V/2.5V_LAN
0.15 A (TBD)
5V 0.2 A (TBD) Touch Pad
A A
DRAW DATE TITLE
Value by Datasheet/Application notes (Value by measurement) CHECK
MS Yang
DEV. STEP
1/26/2010
BREMEN2 SAMSUNG
ELECTRONICS
SE Lee ADV MAIN
APPROVAL REV PART NO.
MK Kim REV 0.1 POWER RAILS BA41-
MODULE CODE LAST EDIT
undefined March 06, 2010 17:48:35 PM PAGE 4 OF 54
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PRELIMINARY
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. POWER SEQUENCE Rev. 0.5
3) P3.3V_MICOM 5) KBC3_ALWS_ON
2) VDC
D 4) P5.0V_ALW D
CHARGER 4) ADP3_IN# 7-1) KBC3_PWRBTN# 5) KBC3_ALWS_ON
6) P3.3V_ALW
8) KBC3_RSMRST# TPS5112
POWER_SW# 9) CHP3_SLPS4# 10) P3.3V_AUX
7) POWER_SW#
8) CHP3_SLPS5#
KBC 12) KBC3_ME_PWRGD 10) P5.0V_AUX
9) CHP3_SLPS4# 13) KBC3_VRON
(START 110ms DELAY
FROM P3.3V ON) 9) CHP3_SLPS4# SC486 10) P1.5V_AUX
9) CHP3_SLP_LAN#
16) KBC3_PWRGD
9-1) CHP3_SLPS3#
MEM POWER
9-1) CHP3_SLPM#
10-1) P1.1V_VTT
9-1) CHP3_SLPS3#
15) VRM3_CPU_PWRGD
SC415 10) P1.1V_M_LAN
19)CHPT3_SUSSTAT# 9) CHP3_SLPLAN# VTT / ME POWER
C C
11) VTT3_PWRGD
8) CHP3_SLPS5#
1) PRTC_BAT 12) GFX1_VR_EN 13) IGFX_CORE
9) CHP3_SLPS4# IGFX_CORE
8) KBC3_RSMRST#
9) CHP3_SLP_LAN#
15) VRM3_CPU_PWRGD
12) KBC3_ME_PWRGD 12) CHP3_ME_PWRGD 9-1) CHP3_SLPS3#
14) KBC3_VRON
9-1) CHP3_SLPM# CPU_CORE 15-1) VRM3_CLKPWRGD#
12) CHP3_LANRST# PCH
11) CHP1_DRAM_PWRGD 10-1) P1.1V
10-1) P1.8V
16) KBC3_PWRGD 12) GFX1_VR_EN
ALL_SYS_PWRGD
SWITCHED POWER
PWROK 9-1) CHP3_SLPS3# 10-1) P1.5V
18) CPU1_PWRGD
LOGIC 10-1) P3.3V
B B
19)CHPT3_SUSSTAT# 10-1) P5.0V
20) PLT3_RST#
10-1) P1.1V_M
9-1) CHP3_SLPM#
SWITCHED POWER
LOGIC 10-1) P3.3V_M
11) CHP1_DRAM_PWRGD
MCP
11) AND1_VTT_PWRGD 10) P1.0V_M_LAN
VTT_PWRGD 10) P1.1V_M_LAN
HANKSVILLE 10-1) P3.3V_M_LAN
10-1) P3.3V_M
10-1) P1.8V_M_LAN
18) CPU1_PWRGD
VCCP_PWRGD0
VCCP_PWRGD1
A A
20) PLT3_RST# SAMSUNG
ELECTRONICS
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