Service Manuals, User Guides, Schematic Diagrams or docs for : . Electronic Components Datasheets Active components Transistors ON Semiconductor bcp68t1
<< Back | HomeMost service manuals and schematics are PDF files, so You will need Adobre Acrobat Reader to view : Acrobat Download Some of the files are DjVu format. Readers and resources available here : DjVu Resources
For the compressed files, most common are zip and rar. Please, extract files with Your favorite compression software ( WinZip, WinRAR ... ) before viewing. If a document has multiple parts, You should download all, before extracting.
Good luck. Repair on Your own risk. Make sure You know what You are doing.
Image preview - the first page of the document
>> Download bcp68t1 documenatation <<
Text preview - extract from the document
BCP68T1G
NPN Silicon
Epitaxial Transistor
This NPN Silicon Epitaxial Transistor is designed for use in low
voltage, high current applications. The device is housed in the
SOT- -223 package, which is designed for medium power surface
mount applications. http://onsemi.com
Features
High Current: IC = 1.0 A MEDIUM POWER NPN SILICON
The SOT--223 Package Can Be Soldered Using Wave or Reflow HIGH CURRENT TRANSISTOR
SOT--223 package ensures level mounting, resulting in improved SURFACE MOUNT
thermal conduction, and allows visual inspection of soldered joints.
The formed leads absorb thermal stress during soldering, eliminating
COLLECTOR 2,4
the possibility of damage to the die
The PNP Complement is BCP69T1
BASE
These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS 1
Compliant
EMITTER 3
MAXIMUM RATINGS (TC = 25C unless otherwise noted)
MARKING
Rating Symbol Value Unit DIAGRAM
Collector--Emitter Voltage VCEO 20 Vdc
Collector--Base Voltage VCBO 25 Vdc 4 SOT-
-223 AYW
Emitter--Base Voltage VEBO 5.0 Vdc 1 CASE 318E CA G
2 STYLE 1 G
Collector Current IC 1.0 Adc 3
Total Power Dissipation @ TA = 25C PD 1.5 W
(Note 1)
Derate above 25C 12 mW/C
CA = Specific Device Code
Operating and Storage Temperature TJ, Tstg -- 65 to 150 C
A = Assembly Location
Range
Y = Year
THERMAL CHARACTERISTICS W = Work Week
G = Pb--Free Package
Characteristic Symbol Max Unit
(Note: Microdot may be in either location)
Thermal Resistance, RJA 83.3 C/W
Junction--to--Ambient (Surface Mounted) ORDERING INFORMATION
Lead Temperature for Soldering, TL 260 C
0.0625 in from case Device Package Shipping
Time in Solder Bath 10 Sec
BCP68T1G SOT--223 1000/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum (Pb--Free)
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the BCP68T3G SOT--223 4000/Tape & Reel
Recommended Operating Conditions may affect device reliability. (Pb--Free)
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.
x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in. For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Semiconductor Components Industries, LLC, 2010 1 Publication Order Number:
September, 2010 - Rev. 6
- BCP68T1/D
BCP68T1G
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristics Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector--Emitter Breakdown Voltage (IC = 100 mAdc, IE = 0) V(BR)CES 25 -- -- Vdc
Collector--Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0) V(BR)CEO 20 -- -- Vdc
Emitter--Base Breakdown Voltage (IE = 10 mAdc, IC = 0) V(BR)EBO 5.0 -- -- Vdc
Collector--Base Cutoff Current (VCB = 25 Vdc, IE = 0) ICBO -- -- 10 mAdc
Emitter--Base Cutoff Current (VEB = 5.0 Vdc, IC = 0) IEBO -- -- 10 mAdc
ON CHARACTERISTICS
DC Current Gain hFE --
(IC = 5.0 mAdc, VCE = 10 Vdc) 50 -- --
(IC = 500 mAdc, VCE = 1.0 Vdc) 85 -- 375
(IC = 1.0 Adc, VCE = 1.0 Vdc) 60 -- --
Collector--Emitter Saturation Voltage (IC = 1.0 Adc, IB = 100 mAdc) VCE(sat) -- -- 0.5 Vdc
Base--Emitter On Voltage (IC = 1.0 Adc, VCE = 1.0 Vdc) VBE(on) -- -- 1.0 Vdc
DYNAMIC CHARACTERISTICS
Current--Gain -- Bandwidth Product fT -- 60 -- MHz
(IC = 10 mAdc, VCE = 5.0 Vdc)
TYPICAL ELECTRICAL CHARACTERISTICS
f T, CURRENT-GAIN-BANDWIDTH PRODUCT (MHz)
300
200
300 TJ = 125C
hFE , DC CURRENT GAIN
200
= 25C
100 100
= -- 55C
70 VCE = 10 V
TJ = 25C
50 f = 30 MHz
VCE = 1.0 V
10 30
1.0 10 100 1000 10 100 200 1000
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 1. DC Current Gain Figure 2. Current-Gain-Bandwidth Product
http://onsemi.com
2
BCP68T1G
TYPICAL ELECTRICAL CHARACTERISTICS
1.0 80
TJ = 25C
TJ = 25C
0.8 VBE(sat) @ IC/IB = 10 70
Cib, CAPACITANCE (pF)
V, VOLTAGE (VOLTS)
0.6 VBE(on) @ VCE = 1.0 V 60
0.4 50
0.2 40
VCE(sat) @ IC/IB = 10
0 30
1.0 10 100 1000 0 1.0 2.0 3.0 4.0 5.0
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)
Figure 3. "On" Voltage Figure 4. Capacitance
25 -- 0.8
TJ = 25C RVB, TEMPERATURE COEFFICIENT (mV/C)
--1.2
20
C ob, CAPACITANCE (pF)
--1.6
15 RVB for VBE
-- 2.0
10
-- 2.4
5.0 -- 2.8
0 5.0 10 15 20 1.0 10 100 1000
VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
Figure 5. Capacitance Figure 6. Base-Emitter Temperature Coefficient
1.0
TJ = 25C
VCE , COLLECTOR VOLTAGE (V)
0.8
0.6 = 1000 mA
0.4 I C = 10 mA = 50 mA = 100 mA
0.2
= 500 mA
0
0.01 0.1 1.0 10 100
IB, BASE CURRENT (mA)
Figure 7. Saturation Region
http://onsemi.com
3
BCP68T1G
PACKAGE DIMENSIONS
SOT-
-223 (TO--261)
CASE 318E--04
ISSUE N
D
b1 NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M,
1994.
2. CONTROLLING DIMENSION: INCH.
4 MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
HE E A 1.50 1.63 1.75 0.060 0.064 0.068
1 2 3 A1 0.02 0.06 0.10 0.001 0.002 0.004
b 0.60 0.75 0.89 0.024 0.030 0.035
b1 2.90 3.06 3.20 0.115 0.121 0.126
c 0.24 0.29 0.35 0.009 0.012 0.014
b D 6.30 6.50 6.70 0.249 0.256 0.263
E 3.30 3.50 3.70 0.130 0.138 0.145
e1 e 2.20 2.30 2.40 0.087 0.091 0.094
e e1 0.85 0.94 1.05 0.033 0.037 0.041
L 0.20 ------ ------ 0.008 ------ ------
C L1 1.50 1.75 2.00 0.060 0.069 0.078
HE 6.70 7.00 7.30 0.264 0.276 0.287
A 0 -- 10 0 -- 10
0.08 (0003) STYLE 1:
A1 L PIN 1. BASE
L1
2. COLLECTOR
3. EMITTER
4. COLLECTOR
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
6.3
2.3 2.3
0.248
0.091 0.091
2.0
0.079
1.5 SCALE 6:1 inches
mm
0.059
*For additional information on our Pb--Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
"Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800--282--9855 Toll Free ON Semiconductor Website: www.onsemi.com
Literature Distribution Center for ON Semiconductor USA/Canada
P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit
Phone: 303--675--2175 or 800--344--3860 Toll Free USA/Canada Phone: 421 33 790 2910
Fax: 303--675--2176 or 800--344--3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local
Email: [email protected] Phone: 81--3--5773--3850 Sales Representative
http://onsemi.com BCP68T1/D
4
◦ Jabse Service Manual Search 2024 ◦ Jabse Pravopis ◦ onTap.bg ◦ Other service manual resources online : Fixya ◦ eServiceinfo