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bsp16t1-d


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BSP16T1G

High Voltage Transistors
PNP Silicon
Features
 These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS
  Compliant                                                                                    http://onsemi.com


                                                                                         PNP SILICON
                                                                                  HIGH VOLTAGE TRANSISTOR
MAXIMUM RATINGS
                                                                                       SURFACE MOUNT
                   Rating                         Symbol   Value         Unit
  Collector-Emitter Voltage                       VCEO     --300         Vdc
  Collector-Base Voltage                          VCBO     --350         Vdc                       COLLECTOR 2,4
  Emitter-Base Voltage                             VEBO     --6.0        Vdc
  Collector Current                                 IC     --100     mAdc                       BASE
                                                                                                  1
  Total Device Dissipation @ TA = 25C              PD       1.5           W
    (Note 1)
  Storage Temperature Range                        PD      --65 to       C                             EMITTER 3
                                                            +150

  Junction Temperature                              TJ      150          C
                                                                                                                        MARKING
THERMAL CHARACTERISTICS
                                                                                                                        DIAGRAM
              Characteristic                      Symbol   Max           Unit
  Thermal Resistance,                              RJA     83.3      C/W                                                   AYW
                                                                                                  TO--223
    Junction--to--Ambient                                                                                                  BT2G
                                                                                                 CASE 318E
Stresses exceeding Maximum Ratings may damage the device. Maximum                                 STYLE 1                   G
Ratings are stress ratings only. Functional operation above the Recommended                                      1
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a glass epoxy printed circuit board 1.575 in x 1.575 in x              A      = Assembly Location
   0.059 in; mounting pad for the collector lead min. 0.93 sq. in.                          Y      = Year
                                                                                            W      = Work Week
                                                                                            BT2 =Device Code
                                                                                            G      = Pb--Free Package
                                                                                      (Note: Microdot may be in either location)


                                                                                          ORDERING INFORMATION
                                                                                     Device         Package             Shipping
                                                                                 BSP16T1G            TO--223         1000/Tape & Reel
                                                                                                    (Pb--Free)

                                                                                 For information on tape and reel specifications,
                                                                                 including part orientation and tape sizes, please
                                                                                 refer to our Tape and Reel Packaging Specifications
                                                                                 Brochure, BRD8011/D.




 Semiconductor Components Industries, LLC, 2010                      1                                    Publication Order Number:
September, 2010 - Rev. 7
                -                                                                                                       BSP16T1/D
                                                       BSP16T1G

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
                                    Characteristic                       Symbol     Min     Max      Unit
OFF CHARACTERISTICS
Collector -- Emitter Breakdown Voltage                                   V(BR)CEO                    Vdc
  (IC = --50 mAdc, IB = 0, L = 25 mH)                                               --300     --
Collector -- Base Breakdown Voltage                                      V(BR)CBO                    Vdc
 (IC = --100 mAdc, IE = 0)                                                          --300     --
Collector--Emitter Cutoff Current                                          ICES                      mAdc
  (VCE = --250 Vdc, IB = 0)                                                          --     --50

Collector--Base Cutoff Current                                             ICBO                      mAdc
 (VCB = --280 Vdc, IE = 0)                                                           --     --1.0

Emitter--Base Cutoff Current                                               IEBO                      mAdc
 (VEB = --6.0 Vdc, IC = 0)                                                           --     --20
ON CHARACTERISTICS
DC Current Gain                                                            hFE
 (VCE = -- 10 Vdc, IC = --50 mAdc)                                                   30     120       --

Collector-Emitter Saturation Voltage                                     VCE(sat)                    Vdc
  (IC = -- 50 mAdc, IB = -- 5.0 mAdc)                                                --     -- 2.0
DYNAMIC CHARACTERISTICS
Current Gain -- Bandwidth Product                                           fT                       MHz
  (VCE = -- 10 Vdc, IC = --10 mAdc, f = 30 MHz)                                      15       --
Collector--Base Capacitance                                               Cobo                       pF
 (VCB = -- 10 Vdc, IE = 0, f = 1.0 MHz)                                              --      15




                                                     http://onsemi.com
                                                             2
                                                                                     BSP16T1G

                                                                        PACKAGE DIMENSIONS


                                                                               SOT-
                                                                                  -223 (TO--261)
                                                                                CASE 318E--04
                                                                                   ISSUE N


                                          D
                                          b1                                                                      NOTES:
                                                                                                                   1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
                                                                                                                   2. CONTROLLING DIMENSION: INCH.

                                          4                                                                                           MILLIMETERS                       INCHES
                                                                                                                     DIM       MIN        NOM    MAX           MIN        NOM        MAX
                      HE                                   E                                                          A        1.50       1.63   1.75         0.060       0.064      0.068
                                  1       2      3                                                                   A1        0.02       0.06   0.10         0.001       0.002      0.004
                                                                                                                      b        0.60       0.75   0.89         0.024       0.030      0.035
                                                                                                                     b1        2.90       3.06   3.20         0.115       0.121      0.126
                                                                                                                      c        0.24       0.29   0.35         0.009       0.012      0.014
                                                         b                                                            D        6.30       6.50   6.70         0.249       0.256      0.263
                                                                                                                      E        3.30       3.50   3.70         0.130       0.138      0.145
                      e1                                                                                              e        2.20       2.30   2.40         0.087       0.091      0.094
                                      e                                                                              e1        0.85       0.94   1.05         0.033       0.037      0.041
                                                                                                                      L        0.20       ------  ------      0.008        ------     ------
                                                                                                   C                 L1        1.50       1.75   2.00         0.060       0.069      0.078
                                                                                                                     HE        6.70       7.00   7.30         0.264       0.276      0.287
                                                       A                                                                        0           --    10            0            --       10
        0.08 (0003)                                                                                                STYLE 1:
                               A1                                  L                                                 PIN 1.   BASE
                                                                                              L1
                                                                                                                         2.   COLLECTOR
                                                                                                                         3.   EMITTER
                                                                                                                         4.   COLLECTOR

                                                                        SOLDERING FOOTPRINT*
                                                                                            3.8
                                                                                           0.15

                                                                      2.0
                                                                     0.079




                                                                                                                    6.3
                                                                                   2.3              2.3
                                                                                                                   0.248
                                                                                  0.091            0.091



                                                              2.0
                                                             0.079


                                                                           1.5                      SCALE 6:1       inches
                                                                                                                      mm
                                                                          0.059

                                                  *For additional information on our Pb--Free strategy and soldering
                                                   details, please download the ON Semiconductor Soldering and
                                                   Mounting Techniques Reference Manual, SOLDERRM/D.

 ON Semiconductor and             are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
 to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
 arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
 "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
 operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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 intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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 and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
 associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:                                                 N. American Technical Support: 800--282--9855 Toll Free            ON Semiconductor Website: www.onsemi.com
 Literature Distribution Center for ON Semiconductor                     USA/Canada
 P.O. Box 5163, Denver, Colorado 80217 USA                              Europe, Middle East and Africa Technical Support:                  Order Literature: http://www.onsemi.com/orderlit
 Phone: 303--675--2175 or 800--344--3860 Toll Free USA/Canada            Phone: 421 33 790 2910
 Fax: 303--675--2176 or 800--344--3867 Toll Free USA/Canada             Japan Customer Focus Center                                        For additional information, please contact your local
 Email: [email protected]                                              Phone: 81--3--5773--3850                                          Sales Representative


                                                                                http://onsemi.com                                                                           BSP16T1/D
                                                                                              3



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