Service Manuals, User Guides, Schematic Diagrams or docs for : . Electronic Components Datasheets Active components Transistors ST am81720-0
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RF & MICROWAVE TRANSISTORS
COMMUNICATIONS APPLICATIONS
.
. REFRACTORY/GOLD METALLIZATION
.
.
EMITTER SITE BALLASTED
RUGGIZED VSWR :1
.
.
LOW THERMAL RESISTANCE
INPUT/OUTPUT MATCHING
.
.
OVERLAY GEOMETRY
METAL/CERAMIC HERMETIC PACKAGE
POUT = 12 W MIN. WITH 7.4 dB GAIN
.400 x .400 2LFL (S036)
hermetically sealed
ORDER CODE BRANDING
AM81720-012 81720-12
PIN CONNECTION
DESCRIPTION
The AM81720-012 is designed specifically for Tele-
communications applications.
The device is capable of withstanding any mis-
match load condition at any phase angle (VSWR
:1) under full rated conditions. The unit is an
overlay, emitter site ballasted, geometry utilizing
a refractory/gold metallization system.
The unique AMPACTM devices are housed in Her- 1. Collector 3. Emitter
metic Metal/Ceramic packages with internal
2. Base 4. Base
Input/Output matching structures.
ABSOLUTE MAXIMUM RATINGS (T case = 25
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