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am81720-0


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                                                                                                AM81720-012
                                                 RF & MICROWAVE TRANSISTORS
                                                COMMUNICATIONS APPLICATIONS

.
.   REFRACTORY/GOLD METALLIZATION

.
.
    EMITTER SITE BALLASTED
    RUGGIZED VSWR :1

.
.
    LOW THERMAL RESISTANCE
    INPUT/OUTPUT MATCHING

.
.
    OVERLAY GEOMETRY
    METAL/CERAMIC HERMETIC PACKAGE
    POUT = 12 W MIN. WITH 7.4 dB GAIN
                                                                                   .400 x .400 2LFL (S036)
                                                                                       hermetically sealed
                                                                           ORDER CODE                       BRANDING
                                                                            AM81720-012                      81720-12



                                                                                    PIN CONNECTION


DESCRIPTION
The AM81720-012 is designed specifically for Tele-
communications applications.
The device is capable of withstanding any mis-
match load condition at any phase angle (VSWR
:1) under full rated conditions. The unit is an
overlay, emitter site ballasted, geometry utilizing
a refractory/gold metallization system.
The unique AMPACTM devices are housed in Her-                                    1. Collector           3. Emitter
metic Metal/Ceramic packages with internal
                                                                                 2. Base                4. Base
Input/Output matching structures.

ABSOLUTE MAXIMUM RATINGS (T case = 25 



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