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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
Table of Contents D
Sheet 1. COVER
HABANA Sheet 2 - 7. DIAGRAM (Block/Power) & ANNOTATIONS
Sheet 8. CLOCK GENERATOR
Sheet 9 - 11. YONAH667 / MEROM CPU(TBD)
Sheet 12. THERMAL SENSOR / FAN CONTROL
Sheet 13 - 17. CALISTOGA-GMCH
Sheet18. DDR II SODIMM
CPU :Intel Yonah -2M/1M Sheet19. DDR TERMINATION
Sheet20 - 23. ICH7-M
Chip Set :Intel Calistoga PM/GM & ICH7-M Sheet24. FWH
Sheet25. LVDS CONNECTOR
Remarks : Mobility Platform Sheet26. VIDEO SWITCHING LOGIC C
Sheet 27. CRT SVHS CONNECTOR
Sheet 28. DVI TRANSMITTER
Sheet 29 - 30. R5C843 CARDBUS CONTROLLER
Sheet 31. EXPRESS & PCMCIA CONNECTOR
Model Name : HABANA Sheet 32. MINI PCI EXPRESS
Sheet 33 - 35. AUDIO
PBA Name : MAIN Sheet 36. HDD ODD CONNECTOR
Sheet 37. MICOM
PCB Code : BA41-#####A Sheet 38. SUPER I/O
Sheet 39 - 40. LAN CONTROLLER
Dev. Step : MP Sheet 41. RJ45,RJ11,USB,LED LOGIC
Sheet 42. SUB BOARD CONNECTOR
Revision : 1.0 Sheet 43. CHARGER
Sheet 44. P3.3V_LAN & P5V_AUX B
T.R. Date : 2005.11.16 Sheet 45. P1.5V & VCCP
Sheet 46. DDR2 POWER
Sheet 47. CPU VRM (SEMTECH)
Sheet 48. MICOM RESET & SWITCHED POWER
Sheet 49. DISCHARGING LOGIC
DRAW CHECK APPROVAL Sheet 50. DOCKING CONNECTOR
Sheet 51. EXT GFx CONNECTOR
Sheet 52 - 55. SUB BOARD
SE LEE ES CHO BL LEE
A
Owner : SEC Mobile R & D Signature : X
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
FAN CPU
D
Mobile Processor VRM
D
PG 12
Yonah - 2M IMVP-6
Graphic
CPU Socket PG 47
Charging Core
LCD Thermal
Circuit
30P Sensor (667MHz)
PG 12 L2 Cache : 2 MB PG 43 GFx board
PG 25 PG 9,10,11 478pin
DDR II
CRT/TV
LVDS PSB Thermistor
667 MT/S PG 12 DDR II Switched PWR
CRT VRM
PG 27
Ext. PEG PEG x16 External Graphics PG 48
Channel A (Standard) DDR II PG 18 PG 46
nVidia G7X
TV GFx Board
SODIMM 0
PG 27
GMCH-M Dual channel DDR II 667/533
SVHS / HDTV
DDR II PG 18
Calistoga-GM/PM Channel B (Reverse)
SODIMM 1
Video Memory
1466 FCBGA
512Mb : K4J52324QC
PG 50 DVI 128Mb : K4J52323QG
PG 29
GFx Board LVDS Internal Graphics PG 13 ~ 17 SD/xD/MS
TMDS
C PG 31 C
PG 28 CRT/TV CARDBUS
Direct Media Interface CardBus
x4, 1.5V R5C843 PG 29
Ext. - Int. Option EEPROM
Clocking R5534V
CK-410M+ PG 29,30 1394
72 PIN CARDBUS Module PG 52
33MHz, 3.3V PCI 4 pin
PG 8
ANT
PCIE x1 Lane 2 52P
USB 0,1,2,3
PG 41,53 USB 0,1,2,3 USB 6 Mini PCIE CONN. Wireless LAN
ANT PG 32
USB4 PG 32
PG 38 Bluetooth
AUDIO PG 42
ICH7-M Finger Printer
Golan
USB5
Audio X-DOCK 652 BGA PCIE x1 Lane 4 26P
AZALIA PG 50 AZALIA Primary USB 7 Express Card TBD
AMP PG 31
Codec PG 31
AD1986A 12P
PCI
PG 34 PG 33
AZALIA
AZALIA Secondary
RJ11 MDC PG 20 ~ 23 PCIE x1 Lane 1
B B
HP & SPDIF. Modem BCM5751/4401 RJ45
PG 41
PG 41 Option PG 39,40
PG 35 MIC-IN PG 41
FWH
49LF008A X-DOCK
PG 24 CRT
4P
HDD SATA S-VHS
PG 36
S-ATA DVI
TPM PG 52
PG 54 1394
Touch PCIE x1 Lane 3
SPKR R HDD Pri. IDE master PATA
PG 36
3.3V LPC, 33MHz
MICOM PAD LPC
U-ATA 100
Hitachi H8S
PS2
H8S/2111B KBD
SPKR L USB 5
Pri. IDE slave PG 50
CD-ROM PG 37 PG 42
PG 36
A A
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SAMSUNG PROPRIETARY
Power Diagram
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D KBC3_LANPWRON KBC3_SUSPWRON KBC3_PWRON KBC3_VRON VCCP3_PWRGD D
AC Adapter VCC_CORE
P1.05V_AUX P1.05V YONAH
CALISTOGA
(VCCP) ICH7-M
YONAH
ICH7-M
DOCK DC VDC * Made by ICH7-M Internal VR
(P3.3V_AUX, INTVRMEN high)
*ICH7-M Sequence SODIMM (DDR II)
P1.8V_AUX P1.8V GPU (G7X series)
P1.05V_Sus GDDR
P3.3V_Sus SODIMM (DDR II)
Battery DC CALISTOGA
P1.2V GPU (G7X series)
* Intel used 0.9V_AUX for DDR-2
(LT validation)
P0.9V DDR II-Termination
C C
MICOM_P3V
MICOM
ICH7-M PCMCIA HDD
CRT USB
P5V_AUX P5V MICOM PS/2 PEG
R5C843 HEATSINK FAN CIRCUIT
DDR2 Power VRM
CALISTOGA Thermal Sensor MICOM
ICH7-M SODIMM R5C843
P3.3V_LAN P3.3V CK410M+ FWH M_PCI
SUPER I/O PCMCIA
PEG LEDs
LAN BCM4401 / 5751 TPM LCD
CALISTOGA
P2.5_3.3V_LAN P2.5V ICH7-M
P3.3V_AUX R5C843
ICH7-M GPU(G7X series)
B LAN
B
MDC
BT
P1.2_3.3V_LAN P1.5V VCCA YONAH
P1.5V
CALISTOGA
ICH7-M
GPU(G7X series)
Rail
+V*Always +V*AUX +V SUSPWR PWRON VRON
State GFX_CORE GPU G7X series : P1.0V - P1.2V
Full On ON ON ON H H H
S3 ON ON OFF H L L
S4 ON ON OFF H L L
S5 ON OFF OFF L L L
S5 / S4 S3 S0
A A
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER SEQUENCE Rev. 0.8
16
1 11) P3.3V
CLOCK 16) CLK3_PWRGD*
D
2 Thermal D
VDC RTC 1-2) CHP3_RTCRST
Monitor CHIP 17 17) Clock Running
SI4435 Battery Sheet 12
Sheet 8
2) VDC Sheet 20 18) VRM3_CPU_PWRGD
Sheet47
3) MICOM_P3V
3 P3.3V_LAN & P5V_AUX
CPU 16) CLK3_PWRGD*
13) KBC3_PWRGD
POWER RHU002N06 MAX 1999 VRM 16) VRM3_CPU_PWRGD
(KBC3_RST*) SC452 15) VCC_CORE
S/W Sheet48
(1/2) 13) KBC3_PWRGD
P3.3V_AUX
(MICOM_P3V) 14 15
Sheet 47
Sheet44
DC/DC B'd INTVRMEN
19 CPU
5 17 17) KBC3_PWRGD
VRMPWRGD
PWROK
5) POWER_SW*
20) PLT3_RST* 19) CPU1_PWRGDCPU 19) CPU1_PWRGDCPU
19
20) PLT3_RST* 11) P1.5V
9 9) CHP3_SLPS5*/S3*
9 20 20) PCI3_RST* 12) P1.05V
21
KBC 8) KBC3_RSMRST**
C 8 7) P3.3V_AUX 12) ICH_CORE (P1.05V)
Sheet 9-11
C
22) CPU1_CPURST*
7) P1.05V_AUX
10) KBC3_PWRON 10-1) KBC3_VRON 11) P2.5V 11) P2.5V Sheet 13 - 17
10 11) P3.3V 11) P1.5V
6) KBC3_SUSPWRON
ICH7-M GMCH
20) PLT3_RST*
6 Sheet 20-23
7 20 7) P1.8V_AUX
KBC Sub B'd
KBC3_LANPWRON 11) P0.9V
3-1
P1.5V & VCCP 11) P1.5V
5-1) KBC3_ALWON(BAT MODE) 12) P1.05V (VCCP) 12) MCH_CORE 12 18
**Note
*KBC3_ALWON WILL BE HIGH
10) KBC3_PWRON ISL6227 1.5V_PWRGD
AFTER POWER _SW IS PUSHED IN BATT. MODE
14) VCCP3_PWRGD 11) P3.3V
Sheet 45
10-1) KBC3_VRON
P5V_AUX & P3V_AUX
6) KBC3_SUSPWRON
DDR2
MAX 1999 7) P5V_AUX
DDR2 POWER 7) P1.8V_AUX and MEM1_VREF 7) P1.8V_AUX
Memory
4 (2/2) MAX8550
11) 0.9V ( or 7) 0.9V_AUX ) 11) P0.9V
Sheet 18 - 19
B 4) P3.3V_LAN
Sheet44 7 11) P5V B
1.8V_AUX_PWRGD 20) PLT3_RST*
Sheet 46
6) KBC3_SUSPWRON 11) P1.8V
4) P3.3V_LAN
FDS6680A
11 G73M
7) P3.3V_AUX
7) P5V_AUX 11) P2.5V
10) KBC3_PWRON* SI4435DY 11) P5V Ext.GPU
7 Sheet 48 11) GFX_CORE
4) P3.3V_LAN 7) P3.3V_LAN
11) P3.3V 11) P1.2V
FDS6680A Sheet 25 - 28
Sheet 48
4) P1.2V_LAN/1.8V Sheet 40
7) P3.3V_AUX 11) P2.5V 11) P1.8V GDDR
LOM 4) P2.5V_LAN
4 11) P1.5V Sheet 30 - 31
SC338A 11) P1.2V
BCM5751/4401 10) KBC3_PWRON
Sheet 48 11) P3.3V
Sheet 43-44
4) P2.5V_LAN
7) P1.8V_AUX 11) P1.8V MiniPCI
10) KBC3_PWRON FDS6680A 20) PCI3_RST* CardBus
Sheet 48 Sheet 34-35
A A
2) VDC Ext. GPU CORE 11
SC470 11) GFX_CORE
10) KBC3_PWRON
10 GFx board
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER RAILS ANALYSIS Rev. 0.8 S0 - S5
S0 - S3
OFF IN S3 - S5
D D
220V
This sheet should be updated !!!
Adapter Battery
3.3V_AUX ( TBD A )
5V_AUX ( TBD A )
MICOM 3V ( TBD A )
1.8V ( TBD A )
1.05V
0.1 A (TBD) ITP
CPU CORE MICOM 3V
CPU CORE ( TBD A )
1.05V (VCCP)
28A Yonah-2M 3.3V 0.1 A (TBD)
Thermal
3.3V
0.08 A (TBD)
0.08 A (TBD) KBC
1.05V ( TBD A ) 2.5A Sensor
1.5V ( 31 W )
1.5V ( TBD A ) 0.3 A (TBD)
2.5V ( TBD A )
3.3V ( TBD A ) 3.3V MICOM 3V
5V ( TBD A ) 1.05V (MCH CORE)
0.02 A (TBD) SIO 0.1 A (TBD) PWR LED
C 1.8V_AUX ( TBD A ) 1.05V (VCCP) 4.8 A (TBD) *1.5V : 13.4 A (TBD) C
2A Calistoga
0.9V_AUX ( TBD A ) 1.5V 1.8V
1.3 A (TBD)
P3.3V_ALW ( TBD A )
3.3V 0.14 A (TBD)
CLOCK
P2.5V_ALW (TBD A)
P1.2V_ALW (TBD A)
2.5V GMCH 3.3V
VGA CORE (TBD A)
0.2 A (TBD) 0.3 A (TBD) 0.1 A (TBD) R5C843
VDC INV ( TBD A )
3.3V 3.3V_AUX
0.12 A (TBD) 0.1 A (TBD)
PEX IO (TBD A)
1.8V_AUX
2.7 A (TBD) (8 - 8.5 W )
RTC_Battery
3.3V KeyBoard
0.2 A (TBD)
1.05V (ICH CORE)
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