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June 18 ' 08
Intel Penryn
DC, QC, Extream Thermal ITP
N-note Block Diagram PCB Layer Stackup
Processor 3,5 Sensor
LM26
Conn. 07247-1 L1:Component
5 6 Project Code: 91.4Y901.001
AGTL+ FSB 1067/800MHz
L2:GND
Keyboard Light
PCB(Raw Card): L3:Signal 1
UNBUFFERED DDR3 Channel A
L4:Signal 2
SODIMM DDR3 1067/800 LVDS
17"WXGA+/WUXGA L5:GND
Normal/Reverse Socket Intel 21-22 L6:VCC
13 Cantiga-PM L7:Signal 3
DDR3 1067/800MHz
nVidia/ATI L8:Signal4
CRT SELECTION CRT Port
UNBUFFERED DDR3 Channel B PCIE (16X) MXM model 24 L9:GND
Clock Generator SODIMM DDR3 1067/800
23
Normal/Reverse Socket
L10:Component
MLF68
15
14 16 Display Port/DVI DVI TO DOCKING
20
7,8,9,10,11,12 17-20
204-PIN DDR3 SODIMM
Thermal Sensor Power Switch Battery Charger/Selector
EMC1428
MAX8765 57
DMI x4
RICOH R5534
IEEE1394
53 R5C847 76 INPUTS OUTPUTS
SATA Serial ATA I/F CONN M-BAT-PWR
SMBus 4in1
HDD x2 Port0, 1 35 Cardbus + DOCK_PWR20_F
I2C Bus / SM Bus IEEE1394 + CardReader S-BAT-PWR
Bus Switch IC
Serial ATA I/F
Intel PCI Bus / 33MHz
4IN1 SLOT System DC/DC
SATA ICH9-M
54 Cardbus TPS51221 61
ODD Port 2 74-75
33 USB 2.0 (12 ports) VCC5M
Mini PCI-E VINT20
HP OUT LAN Connect I/F (LCI) PCIE/USB 2.0 CH2 Express Card Solt VCC3M
WLAN Card 40 PCIE/USB 2.0 CH7
OP AMP. AN12946A AC97 2.3/Azalia Interface
Mini PCI-E CPU DC/DC
PCIE/USB 2.0 CH3 SMART CARD ADP3207JCPZ 62
Int. MIC Serial ATA 150MB/s ROBSON Card 40 PCIE/USB 2.0 CH5
S/PDIF_O ACPI 2.0 VINT20 VCCGFXCORE
AUDIO CODEC LPC I/F PCIE/USB 2.0 CH4
Mini PCI-E
CX20561_15Z WUSB Card 41 VCC1R05AMT/VCC1R5A
Azalia bus PCI Rev 2.3
MIC IN PCI Express
MAX1540ETJ 65
Docking
56 VCC5V_OUT VCC1R05AMT
INT. RTC INTEL GBE Switch
PCI Express VCC1R5A
AMoM 25,26,27,28,29,30 GLAN PI3L500AZFEX
45 VCC0R75AMT
43 BOAZMAN 44 RJ45 CONN.
39 BD3533 66
SPI LPC Bus / 33MHz VCC1R5A VCC0R75AMT
Finger Print CH8 USB 2.0
47 VCC1R8B
SPI-FLASH BD3550 73
Bluetooth CH9 42 KBC SUPER I/O LPC Debug PMH-7 VCC3M VCC1R8B
(LCD Conn) 26
H8S/F2116TE20V WINBOND Board Conn G/A
G-Sensor 44,45 WPCN385 51 VCC1R05AUX/1R8AUX
52 17
USB 1 CH0,1 50 BD3550 72
34 CH10
VCC3M VCC1R05AUX
USB 2 VCC1R8AUX
34 Int. KB
USB Hub
PCI Express Track point IV
S/PDIF_O SMSC 60
USB20H04
HP OUT MIC IN S/PDIF CRT RJ45
DOCKING
Wistron Corporation
USB x 4 DVI DP eSATA DC-IN 43 21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih,
Taipei Hsien 221, Taiwan, R.O.C.
Title
Block Diagram
Size Document Number Rev
Custom
N-Note 1
Date: Thursday, June 26, 2008 Sheet 1 of 83
A B C D E
RESISTOR
Symbol name Value Tolerance Rating Size
0402=> 1/16W, 25V 2=>0402, 3=>0603, 5=>0805,
EC HISTORY
(J: 5%, F: 1%, D: 0.5%, B: 0.1 %) 0603 => 1/16W, 75V 6=>1206, 0=>1210
0805 => 1/10W, 100V
Stage Date EC No. Page Note
10KR3 10K Ohm If no letter, it means J: 5% 1/16W, 75V 0603
4 33D3R5 33.3 Ohm If no letter, it means J: 5% 1/10W, 100V 0805 4
1KR3F 1K Ohm F: 1% 1/16W, 75V 0603
The naming rule is value + R + size + tolerance
For the value, it can be read by the number before R. (R means resistor)
For the tolerance, it can be read from the last letter.
For the rating, we don't show on the symbol name.
For the size, R2=>0402, R3=>0603, R5=>0805,....
CAPACITOR
3 Symbol name Value Tolerance Rating Size 3
(M: +/-20, K: +/-10, Z: +80/-20) 2=>0402, 3=>0603, 5=>0805,
6=>1206, 0=>1210
SCD1U10V2MX-1 0.1uF M/X5R 10V 0402
SC10U6D3V5MX 10uF M/X5R 6.3V 0805
SC2D2U16V5ZY 2.2uF Z/Y5V 16V 0805
The naming rule is
Capacitor type + value + rating + size + tolerance + material
SCD1U10V2MX-1
SC=> SMT Ceremic, TC=> POS cap or SP cap
D1U => 0.1uF
10V => the voltage rating is 10V
2=> 0402, 3=>0603, 5=>0805
M=>tolerance M, K, Z
X=> X7R/X5R, Y=> Y5V
-1 => symbol version, nonsense to EE characteristic
2 2
PLANAR_ID[3..0]
PCI TABLE
ICH8-M GPIOn 39 38 37 36
DEVICE IDSEL IRQ (Default) REQ# / GNT#
Planar ID Version Planar PCB Version
PLANAR_IDn 3 2 1 0
MINIPCI SLOT AD18 F, G REQ# 3/ GNT#3
0 0 0 0 N-note Pre-DV SA
CARDBUS R5C811 AD16 SERIRQ REQ#0 / GNT#0
0 0 0 1
USB UHCI AD29 A, C, D
0 0 1 0
USB 2.0 EHCI AD29 H
0 0 1 1
DMI-to-PCI/
AC97 Modem/ AD30 B
0 1 0 0 AC97 Audio B
1 1
0 1 0 1
LPC Bridge
0 1 1 0
IDE
SATA AD31
C
C
Wistron Corporation
21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih,
SMBus B Taipei Hsien 221, Taiwan, R.O.C.
0 1 1 1
Title
PCI Express AD28 A, B, C, D Reference
Size Document Number Rev
Custom 1
N-Note
Date: Thursday, June 26, 2008 Sheet 2 of 83
A B C D E
A B C D E
7 -A[35..3]
U58A 1 OF 4 VCC1R05B
-A3 J4 H1 -ADS 7 -ADS 1 TPAD34 TP678
A3# ADS#
ADDR GROUP_0
-A4 L5 E2 -BNR 7
-A5 A4# BNR#
L4 A5# BPRI# G5 -BPRI 7
1
-A6 K5
4
-A7 A6# R654 4
M3 A7# DEFER# H5 -DEFER 7
-A8 N2 F21 49D9R2F-GP
A8# DRDY# -DRDY 7
-A9 J1 E1 -DBSY 7
-A10 A9# DBSY#
N3
2
-A11 A10#
P5 A11# BR0# F1 -BR0 7
-A12 P2 A12#
CONTROL
-A13 L2 D20 -IERR
-A14 A13# IERR#
P4 A14# INIT# B3 -INIT 25
-A15 P1
-A16 A15#
R1 A16# LOCK# H4 -HLOCK 7
7 -ADSTB0 M1 ADSTB0# -CPURST 6,7
7 -HREQ[4..0] RESET# C1 -RS[2..0] 7
-HREQ0 K3 F3 -RS0
-HREQ1 REQ0# RS0# -RS1
H2 REQ1# RS1# F4
-HREQ2 K2 G3 -RS2
-HREQ3 REQ2# RS2#
J3 REQ3# TRDY# G2 -HTRDY 7
-HREQ4 L1 REQ4# VCC1R05B
HIT# G6 -HIT 7
-A17 Y2 E4 -HITM 7
-A18 A17# HITM#
U5 A18#
1
-A19 R3 AD4 -XDP_BPM0 6
A19# BPM0#
ADDR GROUP_1
-A20 W6 AD3 -XDP_BPM1 9 R717
-A21 A20# BPM1# 51R2F-2-GP
U4 A21# BPM2# AD1 -XDP_BPM2 9
-A22 Y5 AC4 -XDP_BPM3 9
XDP/ITP SIGNALS
-A23 A22# BPM3#
XDP FOR QUAD CORE CPU U1 AC2 -XDP_BPM4 6
2
-A24 A23# PRDY#
R4 A24# PREQ# AC1 -XDP_BPM5 6 XDP_TDI 6
VCC1R05B -A25 T5 AC5 XDP_TCK 6
-A26 A25# TCK
T3 A26# TDI AA6
-A27 W2 AB3 VCC1R05B
R105 A27# TDO XDP_TDO 6
R108 -A28 W5 AB5 XDP_TMS 6
-A29 A28# TMS
1 2 1 2 0R2J-2-GP TDI_1 Y4 A29# TRST# AB6 -XDP_TRST 6
1
51R2F-2-GP -A30 U2 C20 -XDP_DBRESET 6,28
TDI_TDO_M 1 -A31 A30# DBR#
2 0R2J-2-GP TDO_2 V4 A31#
R656
R109 -A32 W3 68R2-GP
-A33 A32#
AA4 A33# THERMAL R5347
-A34
---DC:R105/R108 NOASM AB2
2
VCC1R05B -A35 A34#
AA3 A35# PROCHOT# D21 1 2 0R0402-PAD -PROCHOT 62
3
---QC:R105/R108 ASM 7 -ADSTB1 V1 ADSTB1# THERMDA A24
B25
THERMDA 53 3
THERMDC THERMDC 53 -PROCHOT_D
DY R100 25 -A20M A6 A20M#
ICH
25 -FERR A5 FERR# THERMTRIP# C7 -THERMTRIP 9,25
1 2 -BPM1_0 25 -IGNNE C4 IGNNE#
51R2F-2-GP
CPUCLK_CPU_266M 15
1
DY 25 -STPCLK R57 1 2 0R0402-PAD -STPCLK_R D5
R97 STPCLK#
25 INTR C6 LINT0 H CLK
1
1 2 -BPM1_1 25 NMI B4 LINT1 BCLK0 A22
51R2F-2-GP 25 -SMI A3 A21 R54
SMI# BCLK1 100R2F-L1-GP-U TP19
R90 2 0R2J-2-GP -BPM1_1 TPAD40-GP
DY R96 6 XDP_OBS6 1 M4 RSVD#M4
6 XDP_OBS7 R91 1 2 0R2J-2-GP -BPM1_0 N5
2
RN71 1 RSVD#N5
1 2 -BPM1_2 53 THERMDA_1 4 T2 RSVD#T2
51R2F-2-GP 53 THERMDC_1 DY 2 3 V3 RSVD#V3 -CPUCLK_CPU_266M 15
RESERVED
R80 6 XDP_OBS5 R92 1 2 0R2J-2-GP -BPM1_2 B2 RSVD#B2
CPU_RSVD06 SRN0J-6-GP D2 B1
RSVD#D2 NC#B1
1 2 -XDP_BPM0 6 5 GTLREF_2 D22 RSVD#D22
51R2F-2-GP TDO_2 D3 RSVD#D3
R83 TDI_1 F6 RSVD#F6
1 2 -XDP_BPM1 9
---DC:R54 NOASM
51R2F-2-GP
---QC:R54 ASM
R87
BGA479-SKT-13-GP
1 2 -XDP_BPM2 9
51R2F-2-GP
R89
1 2 -XDP_BPM3 9
51R2F-2-GP
R58
1 2 XDP_TMS 6
54D9R2F-L1-GP
R63
1 2 XDP_TDI 6
54D9R2F-L1-GP
2 2
R72
1 2 -XDP_BPM5 6
54D9R2F-L1-GP
R73
6 XDP_TCK 1 2
54D9R2F-L1-GP
R78
6 -XDP_TRST 1 2
649R2F-GP
1 1
Wistron Corporation
21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih,
Taipei Hsien 221, Taiwan, R.O.C.
Title
Penryn CPU(1/1)
Size Document Number Rev
C 1
N-Note
Date: Thursday, June 26, 2008 Sheet 3 of 83
A B C D E
5 4 3 2 1
Thermal Sensor for CPU
D D
VCC3SW
7 -D[63..0]
7 -DSTBN[3..0]
7 -DSTBP[3..0]
1
C4670
7 -DINV[3..0]
1
R5278
0R0402-PAD
U58B 2 OF 4
2
1
SCD1U10V2KX-4GP
U171 TP164 -D0 E22 Y22 -D32
2
TPAD40-GP -D1 D0# D32# -D33
F24 D1# D33# AB24
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