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PRODUCT SPECIFICATION
Tentative Specification
Preliminary Specification
Approval Specification
MODEL NO.: V460H1
SUFFIX: LS1
Rev.:B6
Customer:
APPROVED BY SIGNATURE
Name / Title
Note
Please return 1 copy for your confirmation with your
signature and comments.
Approved By Checked By Prepared By
Chao-Chun Chung Ken Wu John Yen
Version 1.6 1 Date 12 Apr. 2011
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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PRODUCT SPECIFICATION
CONTENTS
1. GENERAL DESCRIPTION .......................................................................................................... 4
1.1 OVERVIEW ........................................................................................................................................................... 4
1.2 FEATURES ........................................................................................................................................................... 4
1.3 APPLICATION ...................................................................................................................................................... 4
1.4 GENERAL SPECIFICATI0NS............................................................................................................................... 4
1.5 MECHANICAL SPECIFICATIONS ....................................................................................................................... 5
2. ABSOLUTE MAXIMUM RATINGS .............................................................................................. 6
2.1 ABSOLUTE RATINGS OF ENVIRONMENT ........................................................................................................ 6
2.2 PACKAGE STORAGE .......................................................................................................................................... 7
2.3 ELECTRICAL ABSOLUTE RATINGS .................................................................................................................. 7
3. ELECTRICAL CHARACTERISTICS ........................................................................................... 8
3.1 TFT LCD MODULE............................................................................................................................................... 8
3.2 BACKLIGHT CONVERTER UNIT ...................................................................................................................... 11
4. BLOCK DIAGRAM OF INTERFACE ......................................................................................... 15
4.1 TFT LCD MODULE............................................................................................................................................. 15
5. INTERFACE PIN CONNECTION ............................................................................................... 16
5.1 TFT LCD MODULE............................................................................................................................................. 16
5.2 BACKLIGHT UNIT.............................................................................................................................................. 22
5.3 CONVERTER UNIT ............................................................................................................................................ 22
5.4 BLOCK DIAGRAM OF INTERFACE .................................................................................................................. 24
5.5 LVDS INTERFACE.............................................................................................................................................. 26
5.6 COLOR DATA INPUT ASSIGNMENT ................................................................................................................ 27
6. INTERFACE TIMING.................................................................................................................. 29
6.1 INPUT SIGNAL TIMING SPECIFICATIONS....................................................................................................... 29
6.2 POWER ON/OFF SEQUENCE ........................................................................................................................... 33
7. OPTICAL CHARACTERISTICS ................................................................................................ 35
7.1 TEST CONDITIONS............................................................................................................................................ 35
7.2 OPTICAL SPECIFICATIONS .............................................................................................................................. 36
8. DEFINITION OF LABELS.......................................................................................................... 42
8.1 CMI MODULE LABEL ........................................................................................................................................ 42
9. PACKAGING.............................................................................................................................. 43
9.1 PACKING SPECIFICATIONS ............................................................................................................................. 43
9.2 PACKING METHOD ........................................................................................................................................... 43
10. INTERNATIONAL STANDARD................................................................................................ 45
10.1 SAFETY ............................................................................................................................................................ 45
10.2 EMC .................................................................................................................................................................. 45
11. PRECAUTIONS........................................................................................................................ 46
11.1 ASSEMBLY AND HANDLING PRECAUTIONS ............................................................................................... 46
11.2 SAFETY PRECAUTIONS ................................................................................................................................. 46
12. MECHANICAL CHARACTERISTICS ...................................................................................... 47
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PRODUCT SPECIFICATION
REVISION HISTORY
Version Date Page(New) Section Description
Ver. 1.6 Apr. 12, 2011 All All The preliminary specification was first issued.
Version 1.6 3 Date 12 Apr. 2011
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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PRODUCT SPECIFICATION
1. GENERAL DESCRIPTION
1.1 OVERVIEW
V460H1- LS1 is a 46" TFT Liquid Crystal Display module with LED Backlight and 4ch-LVDS interface. This
module supports 1920 x 1080 Full HDTV format and can display 1.07G colors ( 8-bit+ FRC). The converter
module for backlight is built-in.
1.2 FEATURES
-High brightness (350 nits)
- Ultra-high contrast ratio (TBD)
- Faster response time (Gray to gray average 6.0 ms)
- High color saturation NTSC 72% (72%)
- Ultra wide viewing angle: 176(H)/176(V) (CR20) with Super MVA technology
- DE (Data Enable) only mode
- LVDS (Low Voltage Differential Signaling) interface
- Low color shift function
- RoHs compliance
1.3 APPLICATION
- TFT LCD TVs
- Multi-Media Display
1.4 GENERAL SPECIFICATI0NS
Item Specification Unit Note
Active Area 1018.08 (H) x 572.67 (V) (46" diagonal) mm
(1)
Bezel Opening Area 1024.48 (H) x 578.67 (V) mm
Driver Element a-si TFT active matrix -
Pixel Number 1920 x R.G.B. x 1080 pixel
Pixel Pitch (Sub Pixel) 0.1805 (H) x 0.5405 (V) mm
Pixel Arrangement RGB vertical stripe -
Display Colors 1.07G color
Display Operation Mode Transmissive mode / Normally Black -
Anti-Glare Coating (Haze 11%)
Surface Treatment -
Hard Coating (3H)
Note (1) Please refer to the attached drawings in chapter 9 for more information about the front and back outlines.
Note (2) Please refer sec 3.1 and 3.2 for more information of Power consumption
Note (3) The spec. of the surface treatment is temporarily for this phase. CMI reserves the rights to change this feature.
Version 1.6 4 Date 12 Apr. 2011
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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PRODUCT SPECIFICATION
1.5 MECHANICAL SPECIFICATIONS
Item Min. Typ. Max. Unit Note
Horizontal(H) 1075.5 1076.5 1077.5 mm (1)
Vertical(V) 633.7 634.7 633.8 mm
Module Size Depth(D) 9.9 10.8 11.8 mm To Rear
To converter
Depth(D) 24.6 25.6 26.6 mm
cover
Weight - 9400 - g
Note (1) Please refer to the attached drawings for more information of front and back outline dimensions.
Version 1.6 5 Date 12 Apr. 2011
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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PRODUCT SPECIFICATION
2. ABSOLUTE MAXIMUM RATINGS
2.1 ABSOLUTE RATINGS OF ENVIRONMENT
Value
Item Symbol Unit Note
Min. Max.
Storage Temperature TST -20 +60 ◦ Jabse Service Manual Search 2024 ◦ Jabse Pravopis ◦ onTap.bg ◦ Other service manual resources online : Fixya ◦ eServiceinfo