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PRODUCT SPECIFICATION
Tentative Specification
Preliminary Specification
Approval Specification
MODEL NO.: V260B3
SUFFIX: LE2
Approved By Checked By Prepared By
Chao-Chun Chung Vincent Chou Delia Lin
Version 1.0 1 Date 14 Apr. 2011
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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PRODUCT SPECIFICATION
CONTENTS
1. GENERAL DESCRIPTION ............................................................................................................................................4
1.1 OVERVIEW.........................................................................................................................................................4
1.2 FEATURES .........................................................................................................................................................4
1.3 APPLICATION.....................................................................................................................................................4
1.4 GENERAL SPECIFICATI0NS.............................................................................................................................4
1.5 MECHANICAL SPECIFICATIONS......................................................................................................................5
2. ABSOLUTE MAXIMUM RATINGS ................................................................................................................................5
2.1 ABSOLUTE RATINGS OF ENVIRONMENT ......................................................................................................5
2.2 ELECTRICAL ABSOLUTE RATINGS .................................................................................................................6
3. ELECTRICAL CHARACTERISTICS .............................................................................................................................7
3.1 TFT LCD MODULE .............................................................................................................................................7
3.2 BACKLIGHT UNIT ..............................................................................................................................................9
4. BLOCK DIAGRAM OF INTERFACE ...........................................................................................................................10
4.1 TFT LCD MODULE ...........................................................................................................................................10
5. INTERFACE PIN CONNECTION ................................................................................................................................ 11
5.1 TFT LCD MODULE ........................................................................................................................................... 11
5.2 BACKLIGHT UNIT ............................................................................................................................................13
5.3 BLOCK DIAGRAM OF INTERFACE.................................................................................................................14
5.4 LVDS INTERFACE............................................................................................................................................15
5.5 COLOR DATA INPUT ASSIGNMENT...............................................................................................................16
6. INTERFACE TIMING ...................................................................................................................................................17
6.1 INPUT SIGNAL TIMING SPECIFICATIONS.....................................................................................................17
6.2 POWER ON/OFF SEQUENCE ........................................................................................................................20
7. OPTICAL CHARACTERISTICS ..................................................................................................................................21
7.1 TEST CONDITIONS .........................................................................................................................................21
7.2 OPTICAL SPECIFICATIONS ............................................................................................................................22
8. DEFINITION OF LABELS............................................................................................................................................25
8.1 CMI MODULE LABEL.......................................................................................................................................25
9. PACKAGING................................................................................................................................................................26
10. PRECAUTIONS.........................................................................................................................................................28
10.1 ASSEMBLY AND HANDLING PRECAUTIONS..............................................................................................28
10.2 SAFETY PRECAUTIONS ...............................................................................................................................28
10.3 STORAGE PRECAUTIONS ...........................................................................................................................28
11. REGULATORY STANDARDS....................................................................................................................................29
11.1 SAFETY ..........................................................................................................................................................29
12. MECHANICAL CHARACTERISTIC ..........................................................................................................................30
Version 1.0 2 Date 14 Apr. 2011
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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PRODUCT SPECIFICATION
REVISION HISTORY
Page
Version Date Section Description
(New)
Ver 1.0 Apr. 14,'11 All All Preliminary Specification was first issued
Version 1.0 3 Date 14 Apr. 2011
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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PRODUCT SPECIFICATION
1. GENERAL DESCRIPTION
1.1 OVERVIEW
V260B3-LE2 is a TFT Liquid Crystal Display module with LED Backlight unit and 1ch-LVDS interface. The
display diagonal is 26". This module supports 1366 x 768 WXGA format and can display 16.7M colors
(8-bit/color).
1.2 FEATURES
- Optimized Brightness 300nits
- Contrast Ratio (3000:1)
- Fast Response Time (Gray to Gray Average 8.5ms)
- Color Saturation NTSC 72%
- WXGA (1366 x 768 pixels) Resolution
- DE (Data Enable) Only Mode
- LVDS (Low Voltage Differential Signaling) Interface
- Viewing Angle: 176(H)/176(V) (CR>20) MVA Technology
- Color Reproduction (Nature Color)
1.3 APPLICATION
-TFT LCD TVs
-Optimized Brightness, Multi-Media Displays
1.4 GENERAL SPECIFICATI0NS
Item Specification Unit Note
Active Area 575.769 (H) x 323.712 (V) (26" Diagonal) mm
(1)
Bezel Opening Area 580.2 (H) x 328.2 (V) mm
Driver Element a-si TFT Active Matrix - -
Pixel Number 1366 x R.G.B. x 768 pixel -
Pixel Pitch(Sub Pixel) 0.1405 (H) x 0.4215 (V) mm -
Pixel Arrangement RGB Vertical Stripe - -
Power consumption 32W (LVDS input Power 6.72W + LED Backlight Power 24.95 W) (2)
Display Colors 16.7M color -
Display Operation Mode Transmissive Mode / Normally Black - -
Anti-Glare Coating (Haze 11%)
Surface Treatment - (3)
Hard Coating (3H)
Note (1) Please refer to the attached drawings for more information of front and back outline dimensions.
Note (2) Please refer sec 3.1 and 3.2 for more information of Power consumption
Note (3) The spec. of the surface treatment is temporarily for this phase. CMI reserves the rights to change this
feature.
Version 1.0 4 Date 14 Apr. 2011
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited
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Global LCD Panel Exchange Center www.panelook.com
PRODUCT SPECIFICATION
1.5 MECHANICAL SPECIFICATIONS
Item Min. Typ. Max. Unit Note
Horizontal (H) 612 613 614 mm Module Size
Vertical (V) 360 361 362 mm
Module Size
9.3 10.3 11.3 mm To Rear
Weight Depth (D)
13.8 14.8 15.8 mm To PCB Protector
Weight 2610 g
Note (1) Please refer to the attached drawings for more information of front and back outline dimensions.
Note (2) Module Depth does not include connectors.
2. ABSOLUTE MAXIMUM RATINGS
2.1 ABSOLUTE RATINGS OF ENVIRONMENT
Value
Item Symbol Unit Note
Min. Max.
Storage Temperature TST -20 +60 ◦ Jabse Service Manual Search 2024 ◦ Jabse Pravopis ◦ onTap.bg ◦ Other service manual resources online : Fixya ◦ eServiceinfo