Service Manuals, User Guides, Schematic Diagrams or docs for : . Various NP-R70A001_SER_SM_EN_20070602092538656_04_Schematic_Diagram
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
Sheet 1. Cover
Sheet 2-7. Diagram (Block/Power) & Annotations
Sheet 8. Clock Generator
Sheet 9. Thermal Sensor & FAN
OSLO Sheet 10-12. Merom-4M CPU
g l
Sheet 11. ITP & BSEL Logic
Sheet 13-17. Crestline-GMCH
n a
Sheet 18. DDR II SODIMM A
Sheet 19. DDR II SODIMM B
u ti
CPU :Intel Merom-4M (800/667 MHz) Sheet 20-24. ICH8-M
Sheet 25. SPI ROM & Debug Connector
Sheet 26-29. NB8X Ext GFx Chip
s n
C Chip Set :Intel Crestline & ICH8-M Sheet 30. NB8X Straps C
Remarks : Mobility Platform Sheet 31-32. GDDR3 Memory
Sheet 33. HDCP ROM
m e
Sheet 34. LCD CONNECTOR
Sheet 35. CRT Connector
a id
Sheet 36. HDMI Connector
Sheet 37-38. CARD BUS CONTROLER
Model Name : SANTA ROSA STD Sheet 39. 4 IN 1 & PCMCIA Connector
S f
Sheet 40. MINI CARD 1,2 (WLAN,DVB-T or ROBSON)
PBA Name : MAIN Sheet 41. SATA, PATA Connector
PCB Code : BA41-#####A Sheet 42-46. High Definition Audio (Azalia)
Sheet 47. LAN (Marvell 88E8038, 88E8055)
n
Dev. Step : MP Sheet 48. RJ45, USB, RJ11
B Sheet 49. MICOM (KBC) B
Revision : 1.0 Sheet 50. KBD, TouchPad, Camera, Bluetooth, LID Switch
o
Sheet 51. LED_Logic, MICOM Reset
T.R. Date : 2007.03.02 Sheet 52. Switched Power
C
Sheet 53. P1.05V, P1.5V, P1.25V
Sheet 54. DDR-2 VR
Sheet 55. Charger
Sheet 56. P3.3V _ALW & P5V_AUX VR
DESIGN CHECK APPROVAL Sheet 57. CPU VR
Sheet 58. Cresetline VR/ Ext GFx VR
Sheet 59. Discharging Logic
A A
SAMSUNG
ELECTRONICS
Owner : SEC Mobile R & D Signature : X
4 3 2 1
# Mobile Intel Santa Rosa Platform Design Guide 0.5 (Dec, 2005) # Mobile Intel Crestline Platform Checklist TBD (TBD)
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
FAN CPU Smart
Charging
Clocking Mobile Processor DC/DC Battery DC/DC
D PG 9 Circuit D
CK-505 IMVP-6 Module
Merom-4M
PG 8 CPU PG 57 PG 55 PG 55 PG 56
Thermistor (800MHz)
(TBD) 478pin ON BOARD
PG 9
PG 10,11,12 L2 Cache : 4 MB
Termination VCCP / DC-DC
FSB PG 18,19
PG 53
g l
667/800 MT/S
PG 28 HDMI Channel A (Reverse) DDR II 667/533 DDR II PG 18
MCH-M SODIMM 0
n a
Dual channel DDR II Power
OPTION Crestline-PM Channel B (Reverse)
DDR II PG 19 PG 54
DDR II 667/533 SODIMM 1
PM965
u ti
PG 30 LCD PG 30 LCD Ext. PEG PEG x16 External Graphics
1299 FCBGA
NB8X
s n
CRT PG 13 - 17
PG 33 CRT
C C
Direct Media Interface CLINK CARDBUS
x4, 1.5V M/S(SD...) PG 39
m e
SPDIF. PG 48 USB 0,1,2 USB 0,1,2 R5C843 CardBus PG 39
PG 37, 38
a id
ANT
USB 5 33MHz, 3.3V PCI
PG 50 Bluetooth
ICH8-M
S f
676 BGA
8039 or 8055 RJ45 PG 48
PCIE x1 Lane 3
OPTION PG 47
HDAUDIO USB 7
High Definition Audio PG 50 Camera
PCIE x1 Lane 1 52P ANT
PG 43 PG 20 - 24
Aud. Audio HD Primary PG 40 Mini Card 1
AMP
ALC262 12P
n
MDC HD Secondary
PG 42 RJ11
B Modem B
o
ANT
PG 48
PG 45 PG 48 PCIE x1 Lane 4 52P
USB 6 Mini Card 2
SPI PG 40
C
HP SPI ROM
PG 25
OPTION
MIC-IN
LPC
SATA 0
2P 2P PG 41 SATA HDD
PG 43
Pri. IDE master
PATA
Touch
80 Port MICOM PAD PG 50
3.3V LPC, 33MHz
SPKR R PG 25 H8S-2110B
PG 41
CD-ROM PG 49 TMKBC (TBD) KBD PG 50
CD / DVD
A SPKR L A
LED PG 51
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. BOARD INFORMATION
D SCHEMATIC ANNOTATIONS AND BOARD INFORMATION D
PCI Devices
Crystal / Oscillator
Devices IDSEL# REQ/GNT# Interrupts
TYPE FREQUENCY DEVICE USAGE
Cardbus AD25 3 A,B,C
Crystal 32.768KHz ICH8-M Real Time Clock
g l
Crystal 10MHz MICOM HD64F2169/2160
Crystal 14.318MHz CLOCK-Generator CK-505
USB AD29(internal) - USB2.0 #0 (USB0) : A
USB2.0 #1 (USB1) : D Crystal 25MHz LAN Intel LAN
USB2.0 #2 (USB4) : C
n a
USB2.0 #3 (USB5) : E
USB2.0 #4 (EHCI) : H
Hub to PCI AD30(internal) - -
LPC bridge/IDE/AC97/SMBUS AD31(internal) - B
u ti
Internal MAC AD24(internal) - E
AC Link - - B
GLAN - - F
LCD Pannel Detect (TBD)
s n
C Devices Resolution PANNEL_DETECT_0 C
Voltage Rails
VDC
VCC_CORE
GFX_CORE
P1.05V (VCCP)
P3.3V_MICOM
Primary DC system power supply (7 to 21V)
Core Voltage for CPU
Core Voltage for GPU
VTT for CPU, Crestline & ICH8-M
3.3V always power rail (for Micom)
m e
a id
2
I C / SMB Address
Devices
ICH8-m
Address
Master
Hex
-
Bus
SMBUS Master
S f
P1.5V 1.5V switched power rail (off in S3-S5)
P1.8V 1.8V switched power rail (off in S3-S5) CPU Thermal Sensor 0111 101x 7Ah Thermal Sensor
SODIMM0 1010 000x A0h -
P1.8V_AUX 1.8V power rail for DDR (off in S4-S5)
P0.9V 0.9V power rail for DDR (off in S3-S5) SODIMM1 1010 010x A4h -
Thermal Sensor on SODIMM0 0011 000x 30h -
P3.3V 3.3V switched power rail (off in S3-S5) Thermal Sensor on SODIMM1 0011 010x 34h -
P3.3V_AUX 3.3V switched on power rail (off in S4-S5)
CK-505M (Clock Generator) 1101 001x D2h Clock, Unused Clock Output Disable
P5.0V 5.0V switched power rail (off in S3-S5)
P5.0V_AUX 5.0V switched on power rail (off in S4-S5)
P5.0V_ALW 5.0V always power rail
B
o n B
USB PORT Assign
PORT #
0
1
2
3
4
5
6
7
8
ASSIGNED TO
SYSTEM PORT 0
SYSTEM PORT 1
SYSTEM PORT 2
NC
NC
Bluetooth
Mini PCI Express 2
Camera
NC
PORT #
0
1
2
3
4
5
NC
NC
LOM
NC
C
PCI Express Assign
ASSIGNED TO
Mini Card 1 (WLAN)
Mini Card 2 (ROBSON or DVB-T)
REVISION HISTORY
See rev notes for more information.
9 NC
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. POWER DIAGRAM
D
KBC3_SUSPWR KBC3_PWRON D
(CHP3_S4_STATE*) (CHP3_SLPS3*) KBC3_VRON
AC Adapter P1.05V_AUX P1.05V MEROM
MEROM
CRESTLINE VCC_CORE
(VCCP) ICH8-M
P1.5V_AUX
g l
Battery DC VDC ICH8-M
n a
PEG
P1.8V_AUX SODIMM (DDR II) P1.8V GDDR-3 for PEG
CRESTLINE
u ti
DDR II-Termination DDR II-Termination
P0.9V DDR II for PEG (TBD)
P0.9V
s n
OPTION FOR ME
C C
ICH8-M PCMCIA HDD
FDD USB M_PCI
P3.3V_MICOM P5.0V CRT HEATSINK FAN CIRCUIT
P5V_AUX MICOM MDC
m e
AUX DISPLAY
PEG
MICOM
a id
IGFX_CORE CRESTLINE
S f
CRESTLINE
P1.5V ICH8-M
P3.3V_ALW P3.3V_AUX
EGFX_CORE nVidia (TBD)
n
ICH8-M LAN
MDC BT CRESTLINE Thermal Sensor MICOM
ICH8-M SODIMM
B P5.0V_ALW P3.3V SPI PCMCIA M_PCI B
o
PEG LEDs
MDC
LCD
CRESTLINE
C
ICH8-M
P1.2V_LAN P1.25V
P12.0V_ALW
LAN
PEG
P1.8V_LAN
P1.2V
P2.5V_LAN
Power On/Off Table by S-state LAN
Rail
S0 S3 S4 S5
State
+V*A(LWS)
S5-S4 S3 S0
ON ON ON ON
+V*LAN
A +1.8V_AUX A
ON ON
+0.9V
+V*AUX ON ON SAMSUNG
ELECTRONICS
+V ON
+V* (CORE) ON
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER RAILS ANALYSIS
Rev. 0.6 (060920)
D D
220V
5.0V_AUX ( TBD A )
Adapter Battery
3.3V_AUX ( TBD A )
MICOM 3V ( TBD A )
g l
1.8V ( TBD A )
1.05V
n a
0.1 A (TBD) ITP
CPU CORE MICOM 3V
CPU CORE ( TBD A )
1.05V (VCCP)
41 A (TBD) Merom-4M 3.3V
0.75 A (TBD)
Thermal
3.3V
0.08 A (TBD)
0.08 A (TBD)
KBC
1.05V ( TBD A ) 4.5 A (TBD) Sensor
u ti
1.5V ( 34 W )
1.5V ( TBD A ) 0.13 A (TBD)
1.25V ( TBD A )
3.3V ( TBD A ) MICOM 3V
PWR LED
s n
5.0V ( TBD A ) 0.1 A (TBD)
1.05V (MCH CORE)
1.8V_AUX ( TBD A ) 7.7 A (TBD)
C 1.05V (VCCP) C
0.9V( TBD A ) 4.48 A (TBD) Crestline
1.5V 0.125 A (TBD) 1.8V
3.3V 0.14 A (TBD)
1.25V GMCH 0.25 A (TBD) CLOCK 3.3V
VGA CORE (TBD A)
2.43A (TBD) 0.2 A (TBD) R5C843
VDC INV ( TBD A )
3.3V
0.33 A (TBD)
m e
(8 - 8.5 W )
PEX IO (TBD A)
1.8V_AUX
3.79 A (TBD)
RTC_Battery
3.3V KeyBoard
0.2 A (TBD) 3.3V_AUX
0.6 A (TBD) LAN
a id
1.05V
1.13 A (TBD)
1.5V
3.3V 2.4A (TBD) ICH8-M 3.3V
0.01 A (TBD) KBD LED
0.374 A (TBD) 3.3V_AUX
3.3V_AUX 0.1 A (TBD) SD Card
S f
0.209 A (TBD)
5V
0.001 A (TBD)
5V_AUX
RTC_Battery 0.001 A (TBD) ( ~ 2.0 W ) 3.3V
0.015 A (TBD) SPI 3.3V
0.006 A (TBD) 1.2 A (TBD)
5V 1 A (TBD)
Card Bus
1.0V-1.1V (EGFX CORE) 3.3V
17.75 A (TBD) 5V 0.06 A (TBD)
0.07 A (TBD)
HD Audio 3.3V
1.5 A (TBD)
3.3V_AUX
n
1.8V
6.53 A (TBD) PEG 1.5V
0.5 A (TBD) Mini Card X 2
0.75A (TBD)
1.2V (PEX IO)
1.75 A (TBD) 5V
B 3.3V
0.67 A (TBD)
1.5 A (TBD) ODD PATA B
o
3.3V_AUX
1.8V_AUX 0.5 A (TBD) MDC
0.9V
3.1 A (TBD) DDR-2 5V
0.22 A (TBD) SATA HDD
1 A (TBD) (Dual slots)
C
( ~ 5.0 W )
1.8V GDDR 5V FAN
3.1 A (TBD) 0.16 A (TBD)
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