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CCS Technical Documentation
RH-10 Series Transceivers
System Module
Issue 1 09/2002 Confidential Nokia Corporation
RH-10
System Module CCS Technical Documentation
Page 2 Nokia Corporation Confidential Issue 1 09/2002
RH-10
CCS Technical Documentation System Module
Contents
Page No
Useful Terms.................................................................................................................. 5
Transceiver RH-10......................................................................................................... 9
Introduction ..................................................................................................................9
Operational Modes .................................................................................................... 9
Baseband Module......................................................................................................... 11
UEM ..........................................................................................................................11
UEM Introduction ................................................................................................... 11
Regulators................................................................................................................ 11
Charging Control..................................................................................................... 13
Digital Interface....................................................................................................... 13
Audio Codec............................................................................................................ 13
UI Drivers................................................................................................................ 13
IR Interface.............................................................................................................. 13
AD Converters......................................................................................................... 13
BB-RF Interface Connections ...................................................................................... 14
UPP ............................................................................................................................17
UPP Introduction..................................................................................................... 17
Blocks...................................................................................................................... 17
Flash Memory ............................................................................................................18
Introduction ............................................................................................................. 18
User Interface Hardware .............................................................................................. 18
LCD ...........................................................................................................................18
Introduction ............................................................................................................. 18
Interface................................................................................................................... 18
Keyboard ....................................................................................................................18
Introduction ............................................................................................................. 18
Power Key ............................................................................................................... 19
Keys......................................................................................................................... 19
Lights .........................................................................................................................19
Introduction ............................................................................................................. 19
Interfaces ................................................................................................................. 19
Technical Information ............................................................................................. 19
Vibra ..........................................................................................................................20
Introduction ............................................................................................................. 20
Interfaces ................................................................................................................. 20
Audio Hardware ........................................................................................................... 20
Earpiece .....................................................................................................................20
Introduction ............................................................................................................. 20
Microphone ................................................................................................................20
Introduction ............................................................................................................. 20
Buzzer ........................................................................................................................21
Introduction ............................................................................................................. 21
Battery .......................................................................................................................... 21
Phone Battery .............................................................................................................21
Introduction ............................................................................................................. 21
Interface................................................................................................................... 21
Battery Connector ......................................................................................................22
Issue 1 09/2002 Nokia Corporation Confidential Page 3
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System Module CCS Technical Documentation
Accessories Interface ................................................................................................... 23
Charger IF ..................................................................................................................23
Introduction ............................................................................................................. 23
Interface................................................................................................................... 24
Test Interfaces .............................................................................................................. 24
Production Test Pattern ..............................................................................................24
Other Test Points .......................................................................................................24
EMC ............................................................................................................................. 25
General .......................................................................................................................25
BB Component and Control I/O Line Protection ......................................................25
Keyboard Lines ....................................................................................................... 25
C-Cover ................................................................................................................... 25
PWB ........................................................................................................................ 25
LCD......................................................................................................................... 26
Microphone ............................................................................................................. 26
EARP....................................................................................................................... 26
Buzzer...................................................................................................................... 26
Battery Connector Lines.......................................................................................... 26
M-bus F-bus ............................................................................................................ 26
General Information About Testing ...........................................................................27
Phone operating modes ........................................................................................... 27
RF Module ................................................................................................................... 27
Requirements .............................................................................................................27
Temperature Conditions .......................................................................................... 27
Main Technical Characteristics.................................................................................... 28
Environmental Specifications ................................................................................. 28
Normal and extreme voltages.................................................................................. 28
Voltage range: ............................................................................................................28
Temperature conditions: ............................................................................................28
Antenna ......................................................................................................................28
Transmitter .................................................................................................................29
Synthesizer .................................................................................................................31
UHF LO Synthesizer............................................................................................... 31
Receiver .....................................................................................................................33
Page 4 Nokia Corporation Confidential Issue 1 09/2002
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Useful Terms
AMPS (Advanced Mobile Phone Service): The term used by AT&T's Bell Laboratories
(prior to the break-up of the Bell System in 1984) to refer to its cellular technology. The
AMPS standard has been the foundation for the industry in the United States, although it
has been slightly modified in recent years. 'AMPS-compatible' means equipment
designed to work with most cellular telephones.
Analog: The traditional method of modulating radio signals so that they can carry infor-
mation. Analog is a method of representing information such that data points can vary
continuously, rather than only in discrete steps, as with digital modulation. AM (ampli-
tude modulation) and FM (frequency modulation) are the two most common methods of
analog modulation. Though most U.S. cellular systems today carry phone conversations
using analog, some have begun offering digital transmission. See also Digital Modulation.
ANSI (The American National Standards Institute): A nonprofit, privately funded
membership organization that coordinates the development of U.S. voluntary national
standards and is the U.S. representative to non-treaty international standards-setting
entities including the International Organization for Standardization (ISO) and the Inter-
national Electrotechnical Commission.
Antenna: A device for transmitting and/or receiving signals. The size and shape of
antennas are determined, in large part, by the frequency of the signal they are receiving.
Antennas are needed on both the wireless handset and the base station.
Authentication: A process used by the wireless carriers to verify the identity of a mobile
station.
Browser: Software that moves documents on the World Wide Web to your computer,
PDA, or phone. See HDML, HTML, HTTP and WML.
CDG (CDMA Development Group): A consortium of companies that have joined
together to lead the adoption and evolution of CDMA wireless systems around the world.
CDM: Customer Development Manager. Regional Nokia CDMA personnel for direct cus-
tomer contact with Carriers, formerly known as Field Marketing.
CDMA (Code Division Multiple Access): A spread-spectrum approach to digital
transmission. With CDMA, each conversation is digitized and then tagged with a code.
The mobile phone is then instructed to decipher only a particular code to pluck the right
conversation off the air. The process can be compared in some ways to an English-speak-
ing person picking out in a crowded room of French speakers the only other person who
is speaking English. See also Digital Modulation.
Packet Data: Technology that allows data files to be broken into a number of 'packets'
and sent along idle channels of existing cellular voice networks.
Circuit Switched: A switching technique that establishes a dedicated and uninter-
rupted connection between the sender and the receiver.
Issue 1 09/2002 Nokia Corporation Confidential Page 5
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Encryption: The transformation of data, for the purpose of privacy, into an unreadable
format until reformatted with a decryption key. 'Public key' encryption utilizes the RSA
(which stands for its developers, Rivest, Shamir, and Adleman) encryption key. PGP, or
Pretty Good Privacy, is a cryptography program for computer data, e-mail, and voice con-
versation.
ESN (Electronic Serial Number): The unique number assigned to a wireless phone by
the manufacturer. According to the Federal Communications Commission, the ESN is to
be fixed and unchangeable - a sort of unique fingerprint for each phone. See also MIN.
FCC (Federal Communications Commission): The government agency responsible
for regulating telecommunications in the United States.
GHz (GigaHertz Billions of Hertz): Personal Communications Services operate in the
1.9 GHz band of the electromagnetic spectrum. See also Hertz, KHz, MHz.
GPS (Global Positioning System): A satellite system using 24 satellites orbiting the
earth at 10,900 miles that enables users to pinpoint precise locations using the satellites
as reference points.
Handsfree: A feature that permits a driver to use a wireless car phone without lifting or
holding the handset. An important safety feature.
HDML (Handheld Device Markup Language): A modification of standard HTML,
developed by Unwired Planet, for use on small screens of mobile phones, PDAs, and pag-
ers. HDML is a text-based markup language, which uses HyperText Transfer Protocol
(HTTP) and is compatible with Web servers.
HTML (HyperText Markup Language): An authoring software language used on the
Web. HTML is used to create Web pages and hyperlinks.
HTTP (HyperText Transfer Protocol): The protocol used by the Web server and the
client browser to communicate and move documents around the Internet.
IM (Instant Messaging): A conversational interface across different platforms and sys-
tems via a wireless instant messaging server. Allows the user to send & receive messages
seamlessly.
IMSI (International Mobile Station Identifier): A number assigned to a mobile sta-
tion by the wireless carrier uniquely identifying the mobile station nationally and inter-
nationally. See also MIN, TMSI
Infrared: A band of the electromagnetic spectrum used for airwave communications
and some fiber-optic transmission systems. Infrared is commonly used for short-range
(up to 20 feet) through-the-air data transmission. Many PC devices have infrared ports,
called Infrared Serial Data Link (IRDA), to synchronize with other devices. IRDA supports
speeds up to 1.5 Mbps.
Page 6 Nokia Corporation Confidential Issue 1 09/2002
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IOTA (Internet Over The Air): Specification for Internet based Over The Air handset
configuration management.
MIN (Mobile Identification Number): A number assigned by the wireless carrier to a
customer's phone. The MIN is meant to be changeable, since the phone could change
hands or a customer could move to another city. See also ESN, IMSI, TMSI.
MIME (Multipurpose Internet Mail Extensions): The standard format, developed
and adopted by the Internet Engineering Task Force (IETF), for including non-text infor-
mation in Internet mail, thus supporting the transmission of mixed-media messages
across TCP/IP networks. In addition to covering binary, audio, and video data, MIME is the
standard for transmitting foreign language text, which cannot be represented in ASCII
code.
NAM (Number Assignment Module): The NAM is the electronic memory in the wire-
less phone that stores the telephone number and electronic serial number.
OTA (Over the Air): Network based features for over the air activation's OTASP (Over
the Air Service Provisioning, OTAPA (Over The Air Parameter Administration) pertinent to
IS-683 (A).
PCS (Personal Communications Services): FCC terminology describing two-way,
personal, digital wireless communications systems. Several traditional cellular companies
now offer PCS services.
PDA (Personal Digital Assistant): Portable computing devices capable of transmitting
data. These devices make possible services such as paging, data messaging, electronic
mail, stock quotations, handwriting recognition, personal computing, facsimile, date
book, and other information-handling capabilities.
PIM (Personal Information Manager): Also known as a 'contact manager,' is a form
of software that logs personal and business information, such as contacts, appointments,
lists, notes, occasions, etc.
PRI (Product Release Instructions): Programmable product parameters for default
customer settings.
PRL (Preferred Roaming List): A list of customer preferred settings supported by IS-
683 capabilities.
Protocol: A specific set of rules for organizing the transmission of data in a network.
RF (Radio Frequency): A frequency well above the range of human hearing.
SMS (Short Message Service): A service to send short alphanumeric messages
between devices.
Spread Spectrum: A modulation technique, also known as frequency hopping, used in
Issue 1 09/2002 Nokia Corporation Confidential Page 7
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System Module CCS Technical Documentation
wireless systems. The data is packetized and spread over a range of bandwidth.
Standby Time: The amount of time a fully charged wireless portable or transportable
phone can be on (though not in a call) before the phone's battery will lose power. See
also Talk Time.
Synchronization: Also known as 'replication,' it is the process of uploading and down-
loading information from two or more databases, so that each is identical.
Talk Time: The length of time one can talk on a portable or transportable wireless
phone without recharging the battery. The battery capacity of a phone is usually
expressed in terms of 'minutes of talk time' or 'hours of standby time.' When one is talk-
ing, the phone draws more power from the battery. See also Standby Time.
TAM: Technical Account Manager. Assigned member of Nokia CDMA Product Accep-
tance group to a particular Carrier or list of Carriers.
Telecommunications Act of 1996: Signed into law by President Clinton on February 8,
1996, it establishes a pro-competitive, deregulatory framework for telecommunications
in the United States.
TIA (Telecommunications Industry Association): The Telecomms standards body.
TMSI (Temporary Mobile Station Identifier): A mobile station identifier (MSID) sent
over the air interface and is assigned dynamically by the network to the mobile station.
See also MIN, IMSI
Vibra: A built-in vibrating device for silent user alert.
Vocoder: A device used to convert speech into digital signals. See also Digital Modula-
tion.
Voice-Activated Dialing: A feature that permits one to dial a phone number by speak-
ing to a wireless phone instead of using a keypad. The feature contributes to convenience
as well as driving safety.
WAP (Wireless Applications Protocol): A proposed protocol for wireless applications.
The protocol is designed to simplify how wireless users access electronic and voice mail,
send and receive faxes, make stock trades, conduct banking transactions and view minia-
ture Web pages on a small screen.
WLL (Wireless Local Loop): A local wireless communications network that bypasses
the local exchange carrier and provides high-speed, fixed data transmission.
WML (Wireless Markup Language): A compact version of the Handheld Device
Markup Language. See HDML.
Page 8 Nokia Corporation Confidential Issue 1 09/2002
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CCS Technical Documentation System Module
Transceiver RH-10
Introduction
The RH-10 is a CDMA DCT 4.0 engine incorporating IS-95B and IS-2000 features with
full 1XRTT data rate capacity. Advanced messaging features include SMS (MO/MT),
Instant Messaging, Nokia `Chat' and Smart Messaging (ring tones, graphics, images, and
animations).
The standard internal battery (BLB-3) provides users with up to four hours of talk time
and 250 hours of standby time.
The transceiver has a full graphic display and the user interface is based on the Jack 3 UI
with two soft keys.
An internal antenna is used. An external RF connector also is used.
Operational Modes
There are several different operational modes: Modes have different states controlled by
the cellular SW. Some examples are: Idle State (on ACCH), Camping (on DCCH), Scanning,
Conversation, No Service Power Save (NSPS) previously OOR = Out of Range.
In the power-off mode, only the circuits needed for power-up are supplied.
In the idle mode, circuits are powered down and only the sleep clock is running.
In the active mode, all the circuits are supplied with power, although some parts might
be in idle state part of the time.
The charge mode is effective in parallel with all previous modes. The charge mode itself
consists of two different states, i.e. the fast charge and the maintenance mode.
The local mode is used for alignment and testing.
Issue 1 09/2002 Nokia Corporation Confidential Page 9
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Figure 1: Interconnecting Diagram
Page 10 Nokia Corporation Confidential Issue 1 09/2002
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CCS Technical Documentation System Module
Baseband Module
The core part of the RH-10 baseband module consists of two ASICs--UEM and UPP--and
flash memory. The following sections describe these parts.
PA supply
RF Supplies
BATTERY
SAFARI
UEM
RFCLK RF RX/TX
RFIC CTRL
19.44MHz
PURX
IR
RF RX/TX
UPP SLEEPCLOCK
32kHz
EAR
CBUS/DBUS MIC
AUDIO
BUZZER
BB Supplies
VIBRA
KLIGHT/DLIGHT
MEMADDA
PWR ON
MEMCONT
EXTERNAL AUDIO
FLASH BASEBAND CHARGER CONNECTION
DCT4 System Connector
UI
UEM
UEM Introduction
UEM is the Universal Energy Management IC for DCT4 digital handportable phones. In
addition to energy management, it performs all the baseband mixed-signal functions.
Most of UEM pins have 2kV ESD protection. Those signals that are considered to be
exposed more easily to ESD have 8kV protection inside UEM. Such signals are all audio
signals, headset signals, BSI, Btemp, Fbus, and Mbus signals.
Regulators
UEM has six regulators for baseband power supplies and seven regulators for RF power
supplies. VR1 regulator has two outputs VR1a and VR1b. RH-10 has a DC/DC connector
to provide power to the UPP VCORE.
Bypass capacitor (1uF) is required for each regulator output to ensure stability.
Reference voltages for regulators require external 1uF capacitors. Vref25RF is reference
voltage for VR2 regulator; Vref25BB is reference voltage for VANA, VFLASH1, VFLASH2,
Issue 1 09/2002 Nokia Corporation Confidential Page 11
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VR1 regulators; Vref278 is reference voltage for VR3, VR4, VR5, VR6, VR7 regulators;
VrefRF01 is reference voltage for VIO, VCORE, VSIM regulators, and for RF.
BB RF
VANA: 2.78Vtyp 80mAmax VR1a: 4.75V 12mAmax
VR1b: 4.75V 12mAmax
Vflash1: 2.78Vtyp 70mAmax
Vflash2: 2.78Vtyp VR2: 2.78V 100mAmax
40mAmax
VSim: 1.8/3.0V 25mAmax VR3: 2.78V 20mA
VIO: 1.8Vtyp VR4: 2.78V 50mAmax
150mAmax
Vcore: 1.0-1.8V VR5: 2.78V 50mAmax
200mAmax
VR6: 2.78V 50mAmax
VR7: 2.78V 45mAmax
VANA regulator supplies internal and external analog circuitry of BB. It's disabled in
sleep mode.
Vflash1 regulator supplies LCD, IR-module, and digital parts of UEM ASIC. It's enabled
during startup and goes to low Iq-mode in sleep mode.
Vflash2 regulator supplies data cable (DLR-3). It's enabled/disenabled through writing
register and default is off.
VIO regulator supplies both external and internal logic circuitries. It's used by LCD, flash,
Robin, Batman, Bluetooth, and UPP. Regulator goes in to low Iq-mode in sleep mode.
VCORE DC/DC regulator supplies DSP and Core part of UPP. Voltage is programmable and
the startup default is 1.5V. Regulator goes to low Iq-mode in sleep mode.
VR1 regulator uses two LDOs and a charge pump. This regulator is used by Robin RF ASIC
(VR1B) and synthesizer circuits (VR1A).
VR2 is a linear regulator used to supply Robin RF ASIC and the detector circuitry.
VR3 is a linear regulator used by Robin RF ASIC and VCTCXO circuitry.
VR4 is a linear regulator used by the PLL and UHF VCO circuitry.
VR5 is a linear regulator used by the Batman RFIC and the Alfred RF ASIC.
VR6 is a linear regulator used by Robin RF ASIC and TX LO buffer.
Page 12 Nokia Corporation Confidential Issue 1 09/2002
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VR7 is a linear regulator used by Batman RF ASIC.
IPA1 and IPA2 are programmable current generators. The 27kW/1%/100ppm external
resistor is used to improve the accuracy of output current. IPA1 is used by lower band PA
and IPA2 is used by higher band PA.
Charging Control
The CHACON block of UEM asics controls charging. Needed functions for charging con-
trols are pwm-controlled battery charging switch, charger-monitoring circuitry, battery
voltage monitoring circuitry and RTC supply circuitry for backup battery charging. In
addition, external components are needed for EMC protection of the charger input to the
baseband module. The DCT4 baseband is designed to electrically support both DCT3 and
DCT4 chargers.
Digital Interface
Data transmission between the UEM and the UPP is implemented using two serial con-
nections, DBUS (9.6 MHz) for DSP and CBUS (1.2 MHz in CDMA) for MCU. UEM is a dual-
voltage circuit: the digital parts are running from 1.8V and the analog parts are running
from 2.78V. Vbat (3,6V) voltage regulators inputs also are used.
Audio Codec
The baseband supports two external microphone inputs and one external earphone out-
put. The inputs can be taken from an internal microphone, from a headset microphone,
or from an external microphone signal source through a headset connector. The output
for the internal earpiece is a dual-ended type output, and the differential output is capa-
ble of driving 4Vpp to the earpiece with a 60 dB minimum signal to total distortion ratio.
Input and output signal source selection and gain control is performed inside the UEM
ASIC according to control messages from the UPP. Both a buzzer and an external vibra
alert control signals are generated by the UEM with separate PWM outputs.
UI Drivers
There is a single output driver for buzzer, vibra, display, keyboard LEDs, and IR inside
UEM. These generate PWM square wave to devices.
IR Interface
The IR interface is designed into the UEM. The low frequency mode of IR module covers
speeds up to 1.152 mbit/s. The device (Vishay) tranceivers integrate a sensitive receiver
and a built-in power driver. The combination of thin, long resistive and inductive wiring
should be avoided. The inputs (Txd, SD/Mode) and the output (Rxd) should be directly
coupled to I/O circuit. VBAT gives power supply to transmit LED and serial resistor limits
current. Receiving infrared data to IR LED, it goes straight to UPP by RXD line. Vflash1 is
the power supply of the IR module transmit. The IR module has one control pin to control
shutdown.
AD Converters
There is an 11-channel analog to digital converter in UEM. The AD converters are cali-
brated in the production line.
Issue 1 09/2002 Nokia Corporation Confidential Page 13
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System Module CCS Technical Documentation
BB-RF Interface Connections
All the signal descriptions and properties in the following tables are valid only for active
signals.
Table 1: PDM Interface
Signal name From To Parameter Min Typ Max Unit Function
RX_IF_AGC UPP Batman Voltage Min 0.0 0.1 V Controls gain of VGA r
GenIO 9 Max 1.75 1.8 1.86 in receiver
---------------- -------- ------ ------- --------
Clk Rate (1) 9.6 19.2 MHz
TX_IF_AGC UPP Robin Voltage Min 0.0 0.1 V Controls gain of VGA
GenIO 7 Max 1.75 1.8 1.86 in IF VGA in Robin
---------------- ------- ------- -------- --------
Clk Rate (1) 9.6 19.2 MHz
TX_RF_AGC UPP Robin Voltage Min 0.0 0.1 V Controls gain of TX
GenIO 26 Max 1.75 1.8 1.86 driver in Robin
---------------- -------- -------- -------- --------
Clk Rate (3) 9.6 19.2 MHz
PA_GAIN UPP Robin Voltage Min 0.0 0.1 V Controls gain of PA
GenIO 19 Max 1.75 1.8 1.86
---------------- -------- -------- -------- --------
Clk Rate (3) 9.6 19.2 MHz
Table 2: General I/O Interface
Signal From To Parameter Input characteristics Function
name
TX_Gate UPP Robin "1" Transmitter Off 1.38 1.88 V Punctures the PA's and
Gen IO 8 "0" Transmitter On 0 0.4 V the Robin ASIC
pullup Timing Accuracy 4 chips, and can be up
to a total of 255 chips Digital Into RF
PA_Boost UPP Snapper "1" boost mode 1.38 1.88 V Sets PA current for
Gen IO 28 Shark "0" data mode 0 0.4 V desired linearity
pullup Timing Accuracy 4 chips, and can be up
to a total of 255 chips Digital Into RF
Table 3: VCTCXO Interface
Signal name From To Parameter Min Typ Max Unit Function
CLK192M_UPP VCTCXO Upp Frequency 19.2 MHz High stability clock
Batman ------------------------ ------- ------- ------- ------- signal for logic cir-
Robin Signal amplitude 0.5 1.0 1.5 - cuits, AC coupled
UHF PLL Vpp sinewave.
Analog Out of RF
Page 14 Nokia Corporation Confidential Issue 1 09/2002
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Table 3: VCTCXO Interface
Signal name From To Parameter Min Typ Max Unit Function
AFC UEM VCTCXO Voltage Min 0.0 0.1 V Automatic fre-
Max 2.4 2.55 quency control
------------------------- ------- ------- ------- ------- signal for VCTCXO
Settling time (4) 0.2 ms Digital Into RF
Table 4: Regulated Supplies from UEM to RF
Signal From To Parameter Min Typ Max Unit Function
name
VBAT Battery PA & UEM, Voltage 3.2 3.5 5.1 V Battery supply.
external driver ---------------- ----- ------ ------ ------ Lower limit is to
amps Current 0 2A guarantee regula-
peak tor PSRR
VR1A UEM UHF Synth Voltage 4.6 4.75 4.9 V Charge pump + lin-
---------------- ------ ------ ------ ------ ear regulator.
Current 0 4 5 mA
VR1B UEM PA Iref current Voltage 4.6 4.75 4.9 V Charge pump + lin-
sources in ---------------- ------ ------ ------ ------ ear regulator
Robin Current 0 4 5 mA
VR2 UEM Robin driver Voltage 2.70 2.78 2.86 V Linear regulator
amps ---------------- ------ ------ ------ ------
Current 100 mA
VR3 UEM VCTCXO Robin Voltage 2.70 2.78 2.8 V Low noise linear
VHF synthe- ---------------- ------ ------ ------ ------ regulator for
sizer Current 20 mA VCTCXO
VR4 UEM UHF VCO, syn- Voltage 2.70 2.78 V Low lq linear regu-
thesizer ---------------- ------ ------ ------ lator
Current mA
VR5 UEM Batman IF, BB, Voltage 2.70 2.78 V Low lq linear regu-
LNA, mixer ---------------- ------ ------ ------ lator
Current mA
VR6 UEM Robin IF, BB, Voltage 2.70 2.78 V Low lq linear regu-
mixers ---------------- ------ ------ ------ lator
Current mA
VR7 UEM Batman VHF Voltage 2.70 2.78 V Low noise linear
synthesizer ---------------- ------ ------ ------ regulator for syn-
Current mA thesizer
VREFRF01 UEM Batman Vref Voltage 1.334 1.35 1.366 V Voltage Reference
for RF-IC 1.2%
accuracy
VREFRF02 UEM Robin Vref Voltage 1.334 1.35 1.366 V Voltage Reference
for RF-IC 1.2%
accuracy
VIO UEM Digital IO + PLL Voltage 1.70 1.8 1.88 V Supply for RF-BB
digital ---------------- ------ ------ ------ digital interface
Current 50 mA and some digital
parts of RF.
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Table 5: Slow A/D Converters
Signal name From To Parameter Min Typ Max Unit Function
PA_TEMP Thermistor UEM Input voltage 0 2.741 V PA temperature sen-
range sor output voltage
---------------- ------- ------ -------- ------ Analog Out of RF
Input clock freq 2.5 MHz
PWROUT Robin UEM Input voltage 0 2.741 V Buffered output of TX
range output detector and
---------------- ------- ------ -------- ------ TX power supply
Input clock freq 2.5 MHz Analog Out of RF
FALSE_DET Robin UEM Input voltage 0 2.741 V protection circuit
range that is independent
---------------- ------- ------ -------- ------ of main transmitter
Input clock freq 2.5 MHz on-off control circuit
and minimizes the
possibility of false
transmission caused
by component failure
Table 6: RF-BB Analog Signals
Signal name From To Parameter Min Typ Max Unit Function
RX_IP_RF Batman UEM Differential volt- 1.35 1.4 1.45 Vpp Differential in-phase
RX_IN_RF age swing (static) and quadrature RX
RX_QP_RF -------------------------- -------- ------- -------- ------- baseband signal
RX_QN_RF DC level 1.3 1.35 1.4 V
-------------------------- -------- ------- -------- -------
Input Bandwidth 615 kHz Analog Out of RF
TX_IP_RF UEM Robin Differential volt- 0.9 1.0 Vpp Differential quadra-
TX_IN_RF age swing (static) ture phase TX base-
TX_QP_RF --------------------------- -------- ------- ------- ------- band signal for RF
TX_QN_RF DC level 1.65 1.7 1.75 V modulator
--------------------------- -------- ------- -------- -------
-3 dB Bandwidth 650 1950 kHz Analog into RF
Page 16 Nokia Corporation Confidential Issue 1 09/2002
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Table 7: RFIC Control
Signal name From To Parameter Min Typ Max Unit Function
RF_BUS_CLK UPP Robin/Batman/ High-level input 1.2 1.3 2.35 V Serial Clock =
RF_BUS_DATA PLL voltage, VIH Digital Into RF
RF_BUS_EN1X
Low-level input 0.5 V Bidirectional
voltage, VIL Serial Date =
Digital I/O
High-level output 1.3 1.4 2.45 V
voltage, VOH Latch enable
for Batman and
Low-level output 0.4 V Robin = Digital
voltage, VOL Into RF
Clock 9.72 MHz
SYNTH_LE UPP PLL Voltage 0 1.8 V Synthesizer
latch enable
Timing resolution 10 us
Table 8: RFIC Control
Signal From To Parameter Min Typ Max Unit Function
name
PURX UEM Robin/Batman Voltage Level 0 1.8 V Power Up Reset
------------------------- -------- ------- -------- ------ for Batman and
Timing resolution 10 us Robin
UPP
UPP Introduction
RH-10 uses UPP8Mv2.2 ASIC. The RAM size is 4M. The UPP ASIC is designed to operate in
a DCT4 engine, and is designed as part of the DCT4 common baseband task force. The
DCT4 processor architecture consists of both DSP and MCU processors.
Blocks
UPP is internally partitioned into two main parts: the Brain and the Body.
The Brain consists of the Processor and Memory System (i.e., Processor cores, Mega-cells,
internal memories, peripherals and external memory interface). The following blocks are
included: the DSP Subsystem (DSPSS), the MCU Subsystem (MCUSS), the emulation con-
trol EMUCtl, the program/data RAM PDRAM, and the Brain Peripherals◦ Jabse Service Manual Search 2024 ◦ Jabse Pravopis ◦ onTap.bg ◦ Other service manual resources online : Fixya ◦ eServiceinfo