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Programmes After Market Services
TME-3 Series Transceivers
Data Module RL7
Issue 4 12/03 Nokia Corporation.
TME-3 Company Confidential
Data Module RL7 PAMS Technical Documentation
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Page 2 Nokia Corporation. Issue 4 12/03
Company Confidential TME-3
PAMS Technical Documentation Data Module RL7
Table of Contents
Page No
Glossary of Terms .......................................................................................................... 5
Functional Description of TME-3.................................................................................. 7
Circuit Description .......................................................................................................7
GSM Data Module RL7................................................................................................. 7
Baseband Module........................................................................................................... 7
Technical Summary .....................................................................................................7
Technical Summary................................................................................................... 8
Modes of Operation .....................................................................................................9
RS232 mode .............................................................................................................. 9
Application mode .................................................................................................... 10
User Control mode .................................................................................................. 10
Internal operation modes ......................................................................................... 11
Nominal and maximum ratings .................................................................................12
DC Characteristics................................................................................................... 12
External signals and connectors .................................................................................12
M2M system connector ........................................................................................13
DC connector ........................................................................................................14
SIM connector .......................................................................................................15
External antenna connector ...................................................................................15
Functional Description ...............................................................................................16
POWER................................................................................................................... 16
Power Distribution ................................................................................................16
UEM ......................................................................................................................16
User Interface ........................................................................................................16
UPP Processor .......................................................................................................17
M2M system .........................................................................................................17
SIM .......................................................................................................................17
Audio .........................................................................................................................17
Audio Interfaces ...................................................................................................... 18
Earpiece electrical interface .................................................................................... 18
Microphone electrical interface............................................................................... 18
RF Module ................................................................................................................... 19
Normal and extreme voltages for RF block ...............................................................19
DC characteristics ......................................................................................................20
Regulators................................................................................................................ 20
RF characteristics .......................................................................................................22
RF Block Diagram .....................................................................................................23
Frequency synthesizers ........................................................................................... 24
Receiver .....................................................................................................................24
Transmitter .................................................................................................................25
AFC function........................................................................................................... 26
DC-compensation.................................................................................................... 26
Interfaces and Connectors ............................................................................................ 27
Antenna ................................................................................................................... 27
User Interface Features............................................................................................ 27
Start-up Operation:.................................................................................................. 27
Normal Operation:................................................................................................... 28
Issue 4 12/03 Nokia Corporation. Page 3
TME-3 Company Confidential
Data Module RL7 PAMS Technical Documentation
Special Operation: ................................................................................................... 28
Data Module RL7 Parts List ........................................................................................ 29
Table of figures
Page No
Fig 1 Block diagram of RL7 module ...................................................................................8
Fig 2 TME-3 RS-232 mode .................................................................................................9
Fig 3 TME-3 in Application mode ......................................................................................10
Fig 4 Internal operation modes ............................................................................................11
Fig 5 M2M system connector X101 ....................................................................................13
Fig 6 SIM connector X200 .................................................................................................15
Fig 7 External antenna connector X502 ..............................................................................15
Fig 8 TME-3 power distribution. .........................................................................................16
Fig 9 Audio control diagram................................................................................................18
Fig 10 RF frequency plan ....................................................................................................19
Fig 11 Power Distribution....................................................................................................21
Fig 12 Phase Locked Loop, PLL .........................................................................................24
List of Schematics, A3 pages
Page No
Block diagram v.RB5.0 ed.76 1
Block Diagram System v.RB5.0 ed.128 2
Schematic diagram RF-BB v.RB5.0 ed.20 3
Schematic Diagram UPP v.RB5.0 ed.26 4
Schematic Diagram UEM v. RB5.0 ed. 77 5
Schematic diagram M2M, PWR, LED v. RB5.0 ed.132 6
Schematic Diagram Memories v. RB5.0 ed.24 7
Schematic Diagram RF, v. RB5.0 ed. 163 8
Diagram of RF ground points, V. RB5.0 ed.34 9
Parts Placement 1/2 RL7_11 10
Parts Placement 2/2 RL7_11 11
Block diagram v.RB6.0 ed.79 12
Block Diagram System v.RB6.0 ed.131 13
Schematic diagram RF-BB v.RB6.0 ed.22 14
Schematic Diagram UPP v.RB6.0 ed.29 15
Schematic Diagram UEM v. RB6.0 ed. 80 16
Schematic diagram AIF, PWR, LED v. RB6.0 ed.135 17
Schematic Diagram Memories v. RB6.0 ed.32 18
Schematic Diagram R FGround points, v. RB6.0 ed. 168 19
Parts placement diagram, RL7_11a top 21
Parts Placement bottom RL7_11a Bottom 22
Page 4 Nokia Corporation. Issue 4 12/03
Company Confidential TME-3
PAMS Technical Documentation Data Module RL7
Glossary of Terms
ASIC Application Specific Integrated Circuit
BB Baseband
CSP Chip Scale Package
DB Dual band
DCS1800 Digital Cellular system at 1800 MHz
DSP Digital Signal Processor
EMC Electromagnetic compatibility
EMI Electromagnetic Interference
FBUS Asynchronous Full Duplex Serial Bus
GSM Global System for Mobile communications
HSCSD High Speed Circuit Switched Data
LNA Low Noise Amplifier
M2M System Connector
MBUS 1-wire half duplex serial bus
MCU Micro Controller Unit
MDI MCU-DSP Interface
PA Transmit Power Amplifier
PC Personal Computer
PWB Printed Wiring Board
PCM Pulse Code Modulation
PCM SIO Synchronous serial bus for PCM audio transferring
RF Radio Frequency
SIM Subscriber Identity Module
SMART PCMCIA interface ASIC
Issue 4 12/03 Nokia Corporation. Page 5
TME-3 Company Confidential
Data Module RL7 PAMS Technical Documentation
UEM Universal Energy Management
UI User Interface
UPP Universal Phone Processor
VCXO Voltage Controlled Crystal Oscillator
VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator.
Page 6 Nokia Corporation. Issue 4 12/03
Company Confidential TME-3
PAMS Technical Documentation Data Module RL7
Functional Description of TME-3
Circuit Description
The Data module baseband blocks provide the MCU, DSP, external memory interface and
digital control functions in the UPP ASIC . Power supply circuitry, charging, audio pro-
cessing and RF control hard ware are in the UEM ASIC.
The purpose of the RF block is to receive and demodulate the radio frequency signal from
the base station and to transmit a modulated RF signal to the base station.
GSM Data Module RL7
The description of the RL7 data module is divided into Baseband and RF sections.
Baseband Module
TME-3 baseband supports a power saving function called "sleep mode". As the M2M sys-
tem protocol link must be active at all time, only so called "light sleep" is activated inter-
mittently. In this mode the MCU has been shut down but peripherals are active.
TME-3 powered externally and does not have battery and thus there is no need for
charger functions. The power supply is synchronous step down switching type.
Technical Summary
Main functionality of the baseband is implemented into two ASICs: UPP and UEM.
Issue 4 12/03 Nokia Corporation. Page 7
TME-3 Company Confidential
Data Module RL7 PAMS Technical Documentation
Block Diagram
Figure 1: Block diagram of RL7 module
Production R&D test
Ostrich test pattern structures
TEST
Internal
VBATRF RF- antenna
BB
SIM I
P
N
O
Voltage UI T External
input W
E antenna
E connector
VBAT R
R UEM RF
F F
L A
UPP A C
S E
H
AIF_3V3 VCCAM VBB
AIF
GENIO- FBUS MBUS ANALOG/ I/O
UART DIGITAL
AUDIO
UPP ASIC provides the MCU, DSP, external memory interface and digital control func-
tions. UEM ASIC contains power supply circuitry, charging, audio processing and RF con-
trol hardware.
Technical Summary
Baseband is running from power rails 2.8V analog voltage and 1.8V I/O voltage. UPP core
voltage Vcore can be lowered down to 1.0V, 1.3V and 1.5V. UEM includes 6 linear LDO
(low drop-out) regulators for baseband and 7 regulators for RF. It also includes 4 current
sources for biasing purposes and internal usage. UEM also includes SIM interface which
supports 3V SIM cards. TME-3 does not currently support 1.8 V SIMs.
The interface between the baseband and the RF section is handled by a UEM ASIC. The
UEM provides A/D and D/A conversion of the in-phase and quadrature receive and trans-
mit signal paths and also A/D and D/A conversions of received and transmitted audio sig-
nals to and from the user interface. The UEM supplies the analog TXC and AFC signals to
RF section according to the UPP DSP digital control.
Data transmission between the UEM and the UPP is implemented using two serial bus-
ses, DBUS for DSP and CBUS for MCU. There are also separate signals for PDM coded
audio. Digital speech processing is handled by the DSP inside UPP ASIC. UEM is a dual
voltage circuit, the digital parts are running from the baseband supply 1.8V and the ana-
log parts are running from the analog supply 2.78V. UEM uses also VBAT directly
Page 8 Nokia Corporation. Issue 4 12/03
Company Confidential TME-3
PAMS Technical Documentation Data Module RL7
The baseband supports external microphone inputs and speaker outputs. Input and out-
put signal source selection and gain control is performed by the UEM according to con-
trol messages from the UPP. Analog and digital PCM audio are routed to M2M system
connector.
EMC shielding for baseband is implemented using metal lids. On the other side the mod-
ule is shielded with PWB grounding. Heat generated by the circuitry is conducted out via
the PWB ground planes.
Modes of Operation
The TME-3 has three modes of operation:
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