Service Manuals, User Guides, Schematic Diagrams or docs for : NOKIA Mobile Phone Nokia_8210 NSM3-013

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NSM3-013


>> Download NSM3-013 documenatation <<

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                                                     CONFIDENTIAL                    1 (1)




Nokia Mobile Phones                                  Service Bulletin No. SB-013/15.02.00
Technical Support, Europe & Africa

                                                     NSM-3


HARDWARE CHANGES

               HW version changed from HW1120 to HW1210

               New PCB version RM7L_12 has been released for NSM-3, this improves the
               fitting of PCB to phone mechanics.


               HW version changed from HW1210 to HW1220

               -     C132 is changed from ceramic to tantalum type (reduces the possibility of
                     noise caused by mechanical vibration of ceramic capacitor)
               -     C861 is added and L505 is changed to improve GSM1800 band TX
                     quality

                             CODE       ITEM    DESCRIPTION
                   Deleted   2310793    C132    CHIPCAP X5R 2U2 K 10V 0805
                   Added     2611741    C132    CHIPTCAP 4U7 M 10V 2.0X1.3X1.2
                   Added     2320621    C861    CHIPCAP NPO 0P5 C 50V 0402
                   Added     3646051    L505    CHIP COIL 3N9+-0N3 Q28/800M 0402
                   Deleted   3646053    L505    CHIP COIL 4N7+-0N3 Q28/800M 0402


               Note: No changes are needed for phones coming to service.




NSM-3 SB-013



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