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AMD GeodeTM DBSC1200
and SP4SC31 Development Boards
Feature Differences
1.0 Scope
This document describes the major feature differences products based on the AMD Geode SC1200 processor. Its
between the AMD GeodeTM DBSC1200 development predecessor, the SP4SC31 is still available as of this publi-
board and the SP4SC31 system platform. cation date, but in limited quantities and no more builds are
planned.
Table 2-1 provides a summary of the feature differences
2.0 Discussion between the DBSC1200 and SP4SC31. This summary is
The DBSC1200 is the latest tool to help simplify the design not exhaustive; only major differences are noted.
and development of embedded or industrial computing
Table 2-1. AMD GeodeTM DBSC1200 and SP4SC31 Feature Differences
Feature SP4SC31 DBSC1200 (OPN: DB4SC10)
Cost USD 2,550 (resale) USD 900 (resale)
Form Factor ATX, 9.6x12 inches ETX CPU module,
ATX Base board, 7x12 inches
CPU Support (*Denotes SC1200UFH*, SC1201UFH, SC1200UFH*
processor shipped with kit) SC2200UFH, SC3200UFH
CPU Module Board On interposer to facilitate Soldered directly to board
changing CPU (ETX form factor)
PCI Slots 2 4
ISA Slots 1 (Sub-ISA) 3 (DMA not supported)
PS/2 On LPC SIO card On board
COM On LPC SIO card On board
Floppy On LPC SIO card On board
LPT On LPC SIO card On board
USB 3 4
LAN 10/100 PCI Ethernet RTL8100C on board
Audio Codec LM4549 ALC203
IDE Connectors 2 1
Memory 64 MB SDR SODIMM 128 MB SDR SODIMM
BIOS Insyde Software General Software - on board,
Insyde Software - image on CD
DiskOnChip Yes No
Panel Support Parallel TFT, Parallel TFT,
LVDS TFT, LVDS TFT,
DSTN via CS9211
LPC Slot Yes, for LPC SIO board Header only
Ability to easily instrument for Yes No
current measurements
33006A - February 2005 - Confidential 1
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