Service Manuals, User Guides, Schematic Diagrams or docs for : Agilent 5991-3686EN Mapping the Mechanical Properties of SAC 305 Solder with Express Test - Application Note c20140828 [4]

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Keysight Technologies
Mapping the Mechanical Properties
of SAC 305 Solder with Express Test


                                                        Application Note




             Abstract
             Electronic packaging reliability depends largely on the me-
             chanical integrity of soldered interconnects. Thus, the purpose
             of this work was to use a new nano-indentation technique,
             Express Test, to map the hardness of a SAC 305 solder joint
             with gold plating. In this study after extended aging, the solder
             joint comprised three constituents: a tin-rich matrix, a bulk
             intermetallic AuSn4, and an interfacial intermetallic (Cu, Ni,
             Au)6Sn51. The softest material was the tin-rich matrix, which
             had a hardness of 0.51

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