Service Manuals, User Guides, Schematic Diagrams or docs for : Intel Legacy Package_databook_1999 ch_05

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Physical Constants of IC Package
Materials                                                                                                                                  5
              Table 5-1 through Table 5-9 list typical values for selected properties of materials used in IC
              packages.

   Table 5-1. Case Material Characteristics
                                                      Alumina                           Molding            Sealing      Cu-W
                                                                                                                                      Cu
                     Properties            Units       (92%)              Kovar        Compound             Glass       (90%)

               Density                     kg/m3         3600-            8400            1790-1850         4700        17000        8900
                                           (g/cc)        3700             (8.4)           (1.79-1.85)       (4.7)        (17)        (8.9)
                                                       (3.6-3.7)
               Modulus of Elasticity        GPa              55            138              E1 = 11.7        5.7         255         125
                                                                                            E2 = 0.1
               Tensile Strength             MPa            157             627               19.98                                   270
               Thermal Conductivity        W/mK              18            17.5            0.58 -0.67        0.6       180 - 200
               (20

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