Service Manuals, User Guides, Schematic Diagrams or docs for : Intel Legacy Package_databook_1999 ch_13

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Pinned Packaging                                                                                                    13

13.1          Introduction
              As Intel microprocessors become faster, more complex and more powerful, the demand on
              package performance increases. Improvements in microprocessor speed and functionality drive
              package design improvements in electrical, thermal and mechanical performance. Package
              electrical and thermal characteristics become attributes of component performance along with the
              mechanical protection offered by the package.

              To meet these requirements, Intel has introduced a variety of innovative package designs. The
              development of the plastic pin grid array (PPGA) package, PPGA2, and Flip Chip Pin Grid Array
              (FC-PGA) have provided an improvement path for enhanced power distribution and improved
              thermal and electrical performance. While each consists of organic package materials, the primary
              differences within the package is that PPGA utilizes wirebond interconnect technology while the
              FC-PGA utilizes Flip Chip Interconnect. Externally, the PPGA thermal interface will be made to
              an integral package heat slug while the FC-PGA thermal interface will be made directly to the die
              backside. PPGA and FC-PGA are both socket compatible.Table 13-1 summarizes the key
              attributes of the PPGA package. The following sections detail the physical structure, electrical
              modeling and performance attributes of the PPGA package.

   Table 13-1. PPGA Package Attributes
                                                            PPGA Attributes

               Physical
                  Appearance                                          Circuit board, exposed pins
                  Package Body Material                               BT laminate, Ni plated Cu heat slug, epoxy
                                                                      encapsulant, Au bond wires
                  Body Thickness                                       3.0 mm (overall, includes heat slug)
                  Weight                                              18 grams
                  Package Trace Metal                                 Copper
                  External Heat Slug                                  Yes
                  External Capacitors                                 Yes
               Performance
                  Thermal (jc) with Heat Sink                         0.30 - 0.50 

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