Service Manuals, User Guides, Schematic Diagrams or docs for : Intel Legacy Package_databook_1999 ch_16

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Cartridge Packaging                                                                                        16

16.1          Introduction
              Intel has introduced a variety of innovative package designs over the years: surface mount, small
              out-line, very thin package, multilayer molded plastic quad flatpacks (PQFP), and the Tape Carrier
              Package (TCP) format. Recent configurations for optimum microprocessor performance are the
              Single Edge Contact (S.E.C.) cartridge and the Mobile Mini-Cartridge.

              The S.E.C. cartridge typically combines an area array packaged processor core, L2 cache, other
              components, and a thermal solution attach point. The entry of the S.E.C. cartridge technology
              continues the commitment to provide packaging solutions which meet Intel's rigorous criteria for
              quality and performance.

              The mobile mini-cartridge is a packaging technology aimed at the notebook PC market, where
              minimum form factor is required. It is designed to protect the electronic components of the product
              and enables a controlled thermal interface between the processor and the thermal solution in the
              notebook system (see Figure 1). The mini-cartridge provides a socketable microprocessor
              solution, i.e. it enables the OEM to mount the processor via a motherboard-mounted connector,
              rather than by soldering it, and mechanically securing it with screws in a manner similar to other
              notebook components such as hard disk drives.

              Several times throughout this chapter you will be referred to Intel's website. The URL for the Intel
              website is http://www.intel.com. Intel's developers website can also be accessed through this site.


16.2          Single Edge Contact Cartridge Technology
              The S.E.C. cartridge has the following standard features: a plastic enclosure and a substrate with an
              edge finger connection. The plastic enclosure protects the surface mount components and provides
              features for mechanical stability when the processor is mounted in a retention mechanism on a
              motherboard. The edge finger connection maintains socketability for system configuration. There
              are two edge finger connectors: SC 242 for the Pentium II

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