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2508 ChargePumping


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                                    A   G R E AT E R     M E A S U R E   O F   C O N F I D E N C E




                                                                                                                              A



How to get accurate                                                                                    Figure 1: Schematic for charge pumping mea-
                                                                                                       surement; source and drain of the transistor are


trap density
                                                                                                       connected to ground; gate is pulsed with fixed
                                                                                                       frequency and amplitude while body current is
                                                                                                       measured.



measurements using                                                                                     applying voltage pulses of fixed amplitude,
                                                                                                       rise time, fall time, and frequency to the gate



charge pumping
                                                                                                       of the transistor, with the source, drain, and
                                                                                                       body tied to ground. Figure 1 shows the con-
                                                                                                       nections. The two most common ways to do
                                                                                                       charge-pumping measurements are a fixed
                                                                                                       amplitude, voltage base sweep (Figure 2a)
                                                                                                       or a fixed base, variable amplitude sweep
Yuegang Zhao, Keithley Instruments, Inc.                                                               (Figure 2b). For high  gate stack structures,
                                                                                                       the CP technique can quantify the trapped




T
                                                                                                       charge (Nit) as:
           HE two most common methods                [3]. Recently great attention has been paid
                                                                                                                Icp
           used to characterize interface            to the use of high dielectric constant (high )       Nit = ___
                                                                                                                qfA
           trap state densities in MOSFET            materials, such as hafnium oxide (HfO2), zir-
           devices are charge pumping (CP)           conium oxide (ZrO2), alumina (Al2O3) and          (where Icp is the measured charge-pump-
           and simultaneous C-V (the combi-          their silicates [4], as replacements for SiO2     ing current, q is the fundamental electronic
nation of high frequency and quasi-static C-         as gate dielectrics. Due to the high dielec-      charge, f is the frequency, and A is the area)
V) measurement, which is typically done on           tric constants of these materials, high  gates    since trapped charge beyond the silicon sub-
MOS capacitors. As the size of the transistor        can be made much thicker than SiO2 while          strate/interfacial layer can be sensed [5].
scales down, thinner gate oxide is used to           maintaining the same gate capacitance. The            In a voltage base sweep, the amplitude
maintain proper gate control of the channel.         result is lower leakage current--sometimes        and period (width) of the pulse are fixed
This results in higher gate leakage current          several orders of magnitude lower. Usually        while sweeping the pulse base voltage. At
due to quantum tunneling of carriers through         a very thin silicate layer forms between high     each base voltage, body current can be meas-
the thin gate. The higher gate leakage makes          film and Si substrate. The effect of this        ured and plotted against base voltage. The
characterization of interface traps more and         silicate layer on interface properties, as well   interface trap density (Dit) can be extracted
more difficult. Quasi-static C-V becomes im-         as the charge trapping phenomena inside the       as a function of band-bending, based on this
practical for oxide thicknesses less than 3



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