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2538 SimutaneousSourcing1


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                                     A   G R E AT E R   M E A S U R E   O F   C O N F I D E N C E    observed include heat-stress re-crystalliza-
                                                                                                     tion, thermal stress, and voltage drops under
                                                                                                     conditions of constant electrical power input
                                                                                                     (Joule heating effects).
                                                                                                         Another area that requires much test-
                                                                                                     ing grows out of new electronics packaging
                                                                                                     technologies. Ever-advancing electronics
                                                                                                     packaging technology drives a need to per-
                                                                                                     form testing of higher and higher density in-
                                                                                                     terconnects. With hundreds of test points in


Speed Up Testing
                                                                                                     a large ball grid array (BGA), it has become
                                                                                                     impractical to test each point sequentially,
                                                                                                     yet accelerated life testing requires indepen-


with Simultaneous
                                                                                                     dent testing of each ball. A concern for BGAs
                                                                                                     is electromigration due to current crowding,
                                                                                                     which requires individual electrical control


Sourcing                                                                                             to maintain constant Joule heating as well as
                                                                                                     measure interconnect resistance. The chal-
                                                                                                     lenge is to do all this testing in a reasonable
                                                                                                     (affordable) length of time, and the solutions
                                                                                                     tend to involve simultaneous sourcing.
Pete Hulbert and Paul Meyer, Keithley Instruments, Inc.
                                                                                                     Simultaneous Testing Strategies




T
                                                                                                        Simultaneous source testing of a large
           ESTING is a vital step in electronic    latest lead-free solder techniques and analy-     number of DUTs requires consideration of
           production, but it takes time and       sis of wear-out mechanisms in modern elec-        the trade-offs among practical parameters,
           money. Anything that can speed up       tronic packaging, particularly in structures      such as cost, rack space, throughput, and
           the process is welcome, and one of      like fine-pitch ball grid arrays (BGAs). We'll    precision. Current test equipment offers a
           the most obvious methods is to use      look at both.                                     wide range of simultaneous testing strate-
simultaneous sourcing--driving several de-             By statute, lead is being phased out of       gies, including:
vices under test (DUTs) at the same time and       electronic equipment of all types. While             Source-Measure channel per DUT--
with the same voltage or current and reading       this may reduce the amount of toxic lead in       This strategy provides independent source
the results for all. Simultaneous sourcing is      the waste stream from discarded electronic        control and measurement for each DUT
used when the test application requires in-        equipment, it presents manufacturers with         (Figure 1). As a result, it is possible to use
dependent source control and/or continuous         significant problems. The characteristics of      measurement feedback to maintain constant
monitoring of multiple DUTs. It becomes            Sn-Pb solders are well understood, but the        source adjustments (for constant Joule heat-
more important for throughput when the test        various alternatives--including high-tem-         ing applications) and high sampling rates to
is lengthy, as is the case for accelerated life    perature (250



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