Service Manuals, User Guides, Schematic Diagrams or docs for : Keithley 2001 ds BAV99LT1-D
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BAV99LT1G,
SBAV99LT1G,
BAV99LT3G,
SBAV99LT3G
Dual Series
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Switching Diode
Features
AEC-Q101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements CASE 318
These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS SOT-23
STYLE 11
Compliant*
MAXIMUM RATINGS (Each Diode) ANODE CATHODE
1 2
Rating Symbol Value Unit
3
Reverse Voltage VR 70 Vdc
CATHODE/ANODE
Forward Current IF 215 mAdc
Peak Forward Surge Current IFM(surge) 500 mAdc MARKING DIAGRAM
Repetitive Peak Reverse Voltage VRRM 70 V
Average Rectified Forward Current (Note 1) IF(AV) 715 mA A7 MG
(averaged over any 20 ms period) G
Repetitive Peak Forward Current IFRM 450 mA 1
Non-Repetitive Peak Forward Current IFSM A
t = 1.0 ms 2.0 A7 = Device Code
t = 1.0 ms 1.0 M = Date Code*
t = 1.0 s 0.5 G = Pb-Free Package
Stresses exceeding Maximum Ratings may damage the device. Maximum (Note: Microdot may be in either location)
Ratings are stress ratings only. Functional operation above the Recommended *Date Code orientation and/or overbar may
Operating Conditions is not implied. Extended exposure to stresses above the vary depending upon manufacturing location.
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
ORDERING INFORMATION
Characteristic Symbol Max Unit
Device Package Shipping
Total Device Dissipation PD 225 mW
FR-5 Board (Note 1) TA = 25C BAV99LT1G SOT-23 3,000 / Tape & Reel
Derate above 25C 1.8 mW/C (Pb-Free)
Thermal Resistance, Junction-to-Ambient RqJA 556 C/W SBAV99LT1G SOT-23 3,000 / Tape & Reel
(Pb-Free)
Total Device Dissipation PD 300 mW
Alumina Substrate (Note 2) BAV99LT3G SOT-23 10,000 / Tape & Reel
TA = 25C (Pb-Free)
Derate above 25C 2.4 mW/C SBAV99LT3G SOT-23 10,000 / Tape & Reel
Thermal Resistance, Junction-to-Ambient RqJA 417 C/W (Pb-Free)
Junction and Storage TJ, Tstg -65 to C For information on tape and reel specifications,
Temperature Range +150 including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
1. FR-5 = 1.0 0.75 0.062 in. Brochure, BRD8011/D.
2. Alumina = 0.4 0.3 0.024 in 99.5% alumina.
*For additional information on our Pb-Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011 1 Publication Order Number:
November, 2011 - Rev. 8 BAV99LT1/D
BAV99LT1G, SBAV99LT1G, BAV99LT3G, SBAV99LT3G
OFF CHARACTERISTICS (TA = 25C unless otherwise noted) (Each Diode)
Characteristic Symbol Min Max Unit
Reverse Breakdown Voltage, V(BR) Vdc
(I(BR) = 100 mA) 70 -
Reverse Voltage Leakage Current, IR mAdc
(VR = 70 Vdc) - 2.5
(VR = 25 Vdc, TJ = 150C) - 30
(VR = 70 Vdc, TJ = 150C) - 50
Diode Capacitance, CD pF
(VR = 0, f = 1.0 MHz) - 1.5
Forward Voltage, VF mVdc
(IF = 1.0 mAdc) - 715
(IF = 10 mAdc) - 855
(IF = 50 mAdc) - 1000
(IF = 150 mAdc) - 1250
Reverse Recovery Time, trr ns
(IF = IR = 10 mAdc, iR(REC) = 1.0 mAdc) RL = 100 W - 6.0
Forward Recovery Voltage, VFR V
(IF = 10 mA, tr = 20 ns) - 1.75
CURVES APPLICABLE TO EACH DIODE
1000 100
TA = 150C
IF, FORWARD CURRENT (mA)
IR, REVERSE CURRENT (mA)
10
100 TA = 150C TA = 125C
TA = 125C
1.0
TA = 85C TA = 85C
10
TA = 55C 0.1 TA = 55C
TA = 25C
1
TA = -40C 0.01 TA = 25C
TA = -55C
0.1 0.001
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0 10 20 30 40 50 60 70
VF, FORWARD VOLTAGE (V) VR, REVERSE VOLTAGE (V)
Figure 1. Forward Voltage Figure 2. Leakage Current
0.61
0.59
Cd, DIODE CAPACITANCE (pF)
0.57
0.55
0.53
0.51
0.49
0.47
0.45
0 1 2 3 4 5 6 7 8
VR, REVERSE VOLTAGE (V)
Figure 3. Capacitance
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BAV99LT1G, SBAV99LT1G, BAV99LT3G, SBAV99LT3G
PACKAGE DIMENSIONS
SOT-23 (TO-236)
CASE 318-08
ISSUE AP
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
D 1982.
2. CONTROLLING DIMENSION: INCH.
SEE VIEW C 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
3 THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
HE PROTRUSIONS, OR GATE BURRS.
E
MILLIMETERS INCHES
c DIM MIN NOM MAX MIN NOM MAX
1 2 A 0.89 1.00 1.11 0.035 0.040 0.044
A1 0.01 0.06 0.10 0.001 0.002 0.004
b b 0.37 0.44 0.50 0.015 0.018 0.020
e 0.25
c 0.09 0.13 0.18 0.003 0.005 0.007
D 2.80 2.90 3.04 0.110 0.114 0.120
q E 1.20 1.30 1.40 0.047 0.051 0.055
e 1.78 1.90 2.04 0.070 0.075 0.081
L 0.10 0.20 0.30 0.004 0.008 0.012
A L1 0.35 0.54 0.69 0.014 0.021 0.029
HE 2.10 2.40 2.64 0.083 0.094 0.104
L q 0 --- 10 0 --- 10
A1
L1 STYLE 11:
VIEW C PIN 1. ANODE
2. CATHODE
3. CATHODE-ANODE
SOLDERING FOOTPRINT
0.95
0.95 0.037
0.037
2.0
0.079
0.9
0.035
mm
SCALE 10:1
inches
0.8
0.031
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
"Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free ON Semiconductor Website: www.onsemi.com
Literature Distribution Center for ON Semiconductor USA/Canada
P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Phone: 421 33 790 2910
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local
Email: [email protected] Phone: 81-3-5817-1050 Sales Representative
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