Service Manuals, User Guides, Schematic Diagrams or docs for : LENOVO Laptop IBM_X201I
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Clock Generator
CK-LNV09
15 www.bufanxiu.com
Mocha-3 Block Diagram
Thermal
Sensor
XDP
Conn.
PCB Layer Stackup
L1:Component
Intel MAX6501
14 L2:GND
Channel A 11
UNBUFFERED
DDR3 SODIMM DDR3 1067/800
Arrandale
K eyboard Light
08270-2 SOVP L3:Signal 1
L4:VCC
Reverse Socket 12 January 27th 2010 L5:Signal 2
L6:Signal 3
204-PIN DDR3 SODIMM DDR3 1067/800MHz 12.1'' WXGA LCD
LVDS L7:GND
Channel B INTEGRATED GRAHPICS 24
UNBUFFERED L8:Signal 4
DDR3 SODIMM DDR3 1067/800 L9:GND
Reverse Socket CRT SELECTION CRT Port
RGB CRT L10:Component
13 25 26
3,4,5,6,7,8,9,10
Display Port AC Coupling Media Slice
27 39
Thermal Sensor
MAX6593 Express Card Solt Battery Charger/Selector
DMI x4 FDI USB 2.0 CH5 Braidwood ONFI Connector BQ24741 50
11 33 34
SMBus INPUTS OUTPUTS
I2C Bus / SM Bus SATA USB 2.0 CH13 Camera (LCD Conn)
SATA Serial ATA I/F DOCK_PWR20_F M-BAT-PWR
Bus Switch IC CONN 24
HDD Port0 Intel System DC/DC
46 37 PCH IBEX PEAK TPS51222 55
PCI Express Mini PCI-E
Serial ATA I/F LVDS VCC5M
Media USB 2.0 CH4 UWB VINT20
Port1 CRT 32 VCC3M
Slice 39
Display Port CPU DC/DC
USB 2.0 (14 ports) PCI Express Mini PCI-E ADP3212 56
LAN Connect I/F (LCI) USB 2.0 CH3 WWAN Card
31 VINT20 VCCCPUCORE
IOSUB Serial ATA 300MB/s
3-in-1 Slot Media Card USB 2.0 GMCH GFX CORE
CH0 Card USB2.0 CH0,1 AC97 2.3/Azalia Interface Media RJ45
Reader PCI Express Mini PCI-E ADP3211 58
Conn. ACPI 2.0 Slice Conn
USB 2.0 CH2 WLAN Card 39 30
LPC I/F 31 VINT20 VCCGFXCORE
USB 3 USB2.0 CH1 Azalia bus PCI Rev 2.3 VCC1R5A
38
PCI Express Intel VT356FCX 59
INT. RTC PCI Express GLAN GBE Switch
RJ 11 Audio VCC5V_OUT VCC1R5A
16,17,18,19,20,21,22,23 HANKSVILLE PI3L500AZFEX
Conn Codec Finger Print 29 VCC0R75B
CH10 28
35 MAX1510 60
IOSUB Card LPC Bus / 33MHz VCC1R5A VCC0R75B
Bluetooth CH11 USB 2.0 SPI
(LCD Conn) 24 VCC1R8B
BD3551HFN 61
SPI-FLASH KBC SUPER I/O LPC Debug TCPA VCC3M VCC1R8B
Thinker-1
USB 1 35 36 2112VBG25HV WINBOND Board Conn ST19NP18-TPM-A
CH8,9
G/A VCC1R05LAN
40,41 WPCN385
44 45 36 46 VT356FCX 62
USB 2 35
CH12
G-Sensor
48 VCC5V_OUT VCC1R05LAN
Int. KB VCC1R05B_VTT
Touch Pad VT357FCX 63
SATA Port 1 I/F USB Hub Track point IV
43 VCC5V_OUT VCC1R05B_VTT
SMSC 42
USB2514
HP OUT MIC IN Display Port CRT RJ45 Wistron Corporation
21F, 88, Sec.1, Hsin Tai W u Rd., Hsichih,
UltraSlimBay Taipei Hsien 221, Taiwan, R.O.C.
Title
HDD, Optical Drives,
Block Diagram
Stereo Speaker x 2 USB x 4 Media Slice DC-IN
Size
A3
Document Number
Mocha-3
Rev
-2
Date: W ednesday, January 27, 2010 Sheet 1 of 70
A B C D E
RESISTOR
Symbol name Value Tolerance Rating
0402=> 1/16W, 25V
Size www.bufanxiu.com
2=>0402, 3=>0603, 5=>0805,
EC HISTORY
(J: 5%, F: 1%, D: 0.5%, B: 0.1 %) 0603 => 1/16W, 75V 6=>1206, 0=>1210
0805 => 1/10W, 100V
Stage Date EC No. Page Note
10KR3 10K Ohm If no letter, it means J: 5% 1/16W, 75V 0603
4 33D3R5 33.3 Ohm If no letter, it means J: 5% 1/10W, 100V 0805 4
1KR3F 1K Ohm F: 1% 1/16W, 75V 0603
The naming rule is value + R + size + tolerance
For the value, it can be read by the number before R. (R means resistor)
For the tolerance, it can be read from the last letter.
For the rating, we don't show on the symbol name.
For the size, R2=>0402, R3=>0603, R5=>0805,....
CAPACITOR
3 Symbol name Value Tolerance Rating Size 3
(M: +/-20, K: +/-10, Z: +80/-20) 2=>0402, 3=>0603, 5=>0805,
6=>1206, 0=>1210
SCD1U10V2MX-1 0.1uF M/X5R 10V 0402
SC10U6D3V5MX 10uF M/X5R 6.3V 0805
SC2D2U16V5ZY 2.2uF Z/Y5V 16V 0805
The naming rule is
Capacitor type + value + rating + size + tolerance + material
SCD1U10V2MX-1
SC=> SMT Ceremic, TC=> POS cap or SP cap
D1U => 0.1uF
10V => the voltage rating is 10V
2=> 0402, 3=>0603, 5=>0805
M=>tolerance M, K, Z
X=> X7R/X5R, Y=> Y5V
-1 => symbol version, nonsense to EE characteristic
2 2
PLANAR_ID[3..0]
PCI TABLE
IBEXPEAK-M 39 38 37 36
DEVICE IDSEL IRQ (Default) REQ# / GNT#
Planar ID Version Planar PCB Version
PLANAR_IDn 3 2 1 0
0 0 0 0 Mocha-3 Pre-DV SA
0 0 0 1 Mocha-3 DV SB
USB UHCI AD29 A, C, D
0 0 1 0 Mocha-3 FVT SC
USB 2.0 EHCI AD29 H
0 0 1 1 Mocha-3 SIV SD
DMI-to-PCI/
AC97 Modem/ AD30 B
0 1 0 0 Mocha-3 SIT SE
AC97 Audio B
1 1
0 1 0 1 Mocha-3 SVT -1
LPC Bridge
0 1 1 0 -2
IDE
SATA
AD31
C
C
Wistron Corporation
21F, 88, Sec.1, Hsin Tai W u Rd., Hsichih,
SMBus B Taipei Hsien 221, Taiwan, R.O.C.
0 1 1 1
Title
PCI Express AD28 A, B, C, D Reference
Size Document Number Rev
A3 -2
Mocha-3
Date: W ednesday, January 27, 2010 Sheet 2 of 70
A B C D E
A B C D E
www.bufanxiu.com
U27A 1 OF 10
PEG_ICOMPI B12 PEG_COMP R554 1 2 49D9R2F-GP
18 DMI_RXN[3..0] PEG_ICOMPO A13
4 DMI_RXN0 F7 D12 4
DMI_RXN1 DMI_RX#0 PEG_RCOMPO
J8 DMI_RX#1 PEG_RBIAS B11 PEG_RBIAS R546 1 2 750R2F-GP
DMI_RXN2 K8
DMI_RXN3 DMI_RX#2
18 DMI_RXP[3..0] J4 DMI_RX#3 PEG_RX#0 G40
PEG_RX#1 G38
DMI_RXP0 F9 H34
DMI_RXP1 DMI_RX0 PEG_RX#2
J6 DMI_RX1 PEG_RX#3 P34
DMI
DMI_RXP2 K9 G28
DMI_RXP3 DMI_RX2 PEG_RX#4
J2 DMI_RX3 PEG_RX#5 H25
18 DMI_TXN[3..0] PEG_RX#6 H24
DMI_TXN0 H17 D29
DMI_TXN1 DMI_TX#0 PEG_RX#7
K15 DMI_TX#1 PEG_RX#8 B26
DMI_TXN2 J13 D26
DMI_TXN3 DMI_TX#2 PEG_RX#9
F10 DMI_TX#3 PEG_RX#10 B23
18 DMI_TXP[3..0] PEG_RX#11 D22
DMI_TXP0 G17 A20
DMI_TXP1 DMI_TX0 PEG_RX#12
M15 DMI_TX1 PEG_RX#13 D19 EDP_AUXN 24
DMI_TXP2 G13 A17
DMI_TXP3 DMI_TX2 PEG_RX#14
J11 DMI_TX3 PEG_RX#15 B14
F40 VCC1R05B_VTT
PEG_RX0
18 FDI_TXN[7..0] PEG_RX1 J38
PEG_RX2 G34
FDI_TXN0 L2 FDI_TX#0 PEG_RX3 M34
DY
1
FDI_TXN1 N7 J28
FDI_TXN2 FDI_TX#1 PEG_RX4 R565
M4 FDI_TX#2 PEG_RX5 G25
FDI_TXN3 P1 K24 7K5R2F-1-GP
FDI_TXN4 FDI_TX#3 PEG_RX6
FDI_TXN5
N10 FDI_TX#4 PEG_RX7 B28
DY 0R2J-2-GP
Intel(R) FDI
Intel(R) FDI
R7 A27
2
3 FDI_TXN6 FDI_TX#5 PEG_RX8 R568 3
U7 FDI_TX#6 PEG_RX9 B25 1 2
FDI_TXN7 W8 A24
FDI_TX#7 PEG_RX10
B21 Q62
18 FDI_TXP[7..0] PEG_RX11 -EDP_HPD_R
PEG_RX12 B19 C
FDI_TXP0 K1 B18 R1 B
FDI_TX0 PEG_RX13 EDP_AUXP 24 EDP_HPD 24
FDI_TXP1 N5 B16 E
FDI_TXP2 FDI_TX1 PEG_RX14 R2
N2 FDI_TX2 PEG_RX15 D15
1
FDI_TXP3 R2 PDTC115EE-1-GP
FDI_TXP4 FDI_TX3 R563
FDI_TXP5
N9
R8
FDI_TX4 PEG_TX#0 N40
L38
DY 110KR2F-GP
FDI_TX5 PEG_TX#1
PCI EXPRESS -- GRAPHICS
FDI_TXP6 U6 M32
FDI_TXP7 FDI_TX6 PEG_TX#2
W10 D40
DY
2
FDI_TX7 PEG_TX#3
PEG_TX#4 A38
18 FDI_FSYNC0 AC7 FDI_FSYNC0 PEG_TX#5 G32
18 FDI_FSYNC1 AC9 FDI_FSYNC1 PEG_TX#6 B33
PEG_TX#7 B35
18 FDI_INT AB5 FDI_INT PEG_TX#8 L30
PEG_TX#9 A31
18 FDI_LSYNC0 AA1 FDI_LSYNC0 PEG_TX#10 B32
18 FDI_LSYNC1 AB2 FDI_LSYNC1 PEG_TX#11 L28
PEG_TX#12 N26
PEG_TX#13 M24
PEG_TX#14 G21 EDP_TXN1 24
PEG_TX#15 J20 EDP_TXN0 24
PEG_TX0 L40
PEG_TX1 N38
PEG_TX2 N32
PEG_TX3 B39
2 2
PEG_TX4 B37
PEG_TX5 H32
PEG_TX6 A34
PEG_TX7 D36
PEG_TX8 J30
PEG_TX9 B30
PEG_TX10 D33
PEG_TX11 N28
PEG_TX12 M25
PEG_TX13 N24
PEG_TX14 F21 EDP_TXP1 24
PEG_TX15 L20 EDP_TXP0 24
AUBURNDALE-1-GP-U2-NF
CFG[4] should be pulled low to enable eDP.
Use CPU Arrandale
1 1
Wistron Corporation
21F, 88, Sec.1, Hsin Tai W u Rd., Hsichih,
Taipei Hsien 221, Taiwan, R.O.C.
Title
Arrandale CPU(1/8): DMI /PEG/FDI
Size Document Number Rev
A3
Mocha-3 -2
Date: W ednesday, January 27, 2010 Sheet 3 of 70
A B C D E
A B C D E
www.bufanxiu.com
COMP0/1/2/3 : TRACE Length <0.5"
4 4
COMP0/1/2/3 : 10mil width traces, 20mil spacing
VCC1R05B_VTT U27B 2 OF 10
R615 1 2 20R2F-GP COMP3 AD71 COMP3
BCLK AK7 CPU_CLK_133M 22
R617 1 2 20R2F-GP COMP2
Misc
Misc
AC70 COMP2 BCLK# AK8 -CPU_CLK_133M 22
R616 1 2 49D9R2F-GP COMP1
Clocks
AD69 COMP1 BCLK_ITP K71 XDP_CLK_133M_CPU 14
1
BCLK_ITP# J70 -XDP_CLK_133M_CPU 14
1
R619 R614 1 2 49D9R2F-GP COMP0 AE66 VCC1R05B_VTT
R618 COMP0
PEG_CLK L21 PEG_CLK_100M 17
68R2-GP 49D9R2F-GP J21
PEG_CLK# -PEG_CLK_100M 17
TP58 1 PROC_DETECT M71
2
TPAD14-GP PROC_DETECT
Y2 EDP_CLK_120M 17
2
DPLL_REF_SSCLK
DPLL_REF_SSCLK# W4 -EDP_CLK_120M 17
-CATERR N61 CATERR#
1
1
R611 R610
Thermal
Thermal
BJ12 10KR2J-3-GP 10KR2J-3-GP
SM_DRAMRST#
22 PECI N19 PECI
BV33 R582 1 2 100R2F-L1-GP-U
2
2
SM_RCOMP0 R586 1
SM_RCOMP1 BP39 2 24D9R2F-L-GP
BV40 R589 1 2 130R2F-1-GP
SM_RCOMP2
56 -PROCHOT N67 PROCHOT#
DDR3
Misc
PM_EXT_TS#0 AV66 -MEM_TS0 12
PM_EXT_TS#1 AV64 -MEM_TS1 13
3 3
VCC1R5_VDDQ N17
22 -THERMTRIP THERMTRIP#
1
TP76
TPAD40-GP U71
PRDY# -XDP_PRDY 14
1
R911 PREQ# U69 -XDP_PREQ 14
R132
1 2 1K1R2F-GP N70 T67
60 DRAMPW RG_R 14 -CPURST RESET_OBS# TCK XDP_TCK 14
TMS N65 XDP_TMS 14
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