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website:http://biz.LGservice.com
e-mail:http://www.LGEservice.com/techsup.html
LCD TV
SERVICE MANUAL
CHASSIS : LD62A
FACTORY NAME : 32LC2D-SC/37LC2D-SC/42LC2D-SC
MODEL : 32LC2D/37LC2D/42LC2D
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
R
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION ...............................................................13
TROUBLE SHOOTING ............................................................................17
BLOCK DIAGRAM...................................................................................30
EXPLODED VIEW .................................................................................. 32
REPLACEMENT PARTS LIST ............................................................... 38
SVC. SHEET ...............................................................................................
-2-
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Replacement Parts List.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC Do not use a line Isolation Transformer during this check.
power line. Use a transformer of adequate power rating as this Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
protects the technician from accidents resulting in personal injury between a known good earth ground (Water Pipe, Conduit, etc.)
from electrical shocks. and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
It will also protect the receiver and it's components from being with 1000 ohms/volt or more sensitivity.
damaged by accidental shorts of the circuitry that may be Reverse plug the AC cord into the AC outlet and repeat AC voltage
inadvertently introduced during the service operation. measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
If any fuse (or Fusible Resistor) in this TV receiver is blown, 0.5mA.
replace it with the specified. In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
When replacing a high wattage resistor (Oxide Metal Film Resistor, repaired before it is returned to the customer.
over 1W), keep the resistor 10mm away from PCB.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.
AC Volt-meter
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical Good Earth Ground
shock. such as WATER PIPE,
To Instrument's CONDUIT etc.
0.15uF
Leakage Current Cold Check(Antenna Cold Check) exposed
METALLIC PARTS
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC 1.5 Kohm/10W
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1M and 5.2M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
-3-
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it.
other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500 F to 600 F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500 F to 600 F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the
CAUTION: Do not connect the test fixture ground strap to any circuitboard printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500 F to 600 F)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
-4-
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.
Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on IC
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
-5-
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1.General Specification(TV)
No Item Specification Remark
1. Video input applicable system PAL-D/K, B/G, I, NTSC-M, SECAM
NTSC 4.43
2. Receivable Broadcasting System 1) PAL/SECAM BG Nordig
2) PAL/SECAM DK
3) PAL I/I
4) SECAM L/L'
3. RF Input Channel VHF : E2 ~ E12 PAL
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21~ S47
4. Input Voltage AC 100 ~ 240V/50Hz, 60Hz
5. Market Sweden, Finland, German, Spain
6. Picture Size 800.4mm 32inch
940.3mm 37inch
1067.308mm 42inch
7. Tuning System FVS 100 program PAL, 200 PR.(Option)
8. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : 10~90 %
9. Storage Environment 3) Temp : -20 ~ 50 deg
4) Humidity : 10~90 %
10. Display LCD Module LPL
-6-
2. General Specification
No Item Specification Remark
1 Panel 32", 37", 42" TFT WXGA LCD
2 Frequency range H : 31 ~ 61Khz PC Input
V : 56 ~ 75Hz
3 Control Function 1) Contrast/Brightness
2) H-Position / V-Position
3) Tracking : Clock / Phase
4) Auto Configure
5) Reset
4 Component Jack 1:Y Middle east / NTSC Area
3 : Pb
5 : Pr
5 H/V-Sync Video Power consumption LED
Power ON - - 150W(32") Green
190W(37") Green
240W(42")
Stand by 3.0W Red
Power off - - - *
6 LCD Module Type Size 32" 760.0x450.0x48.0(mm) (H)x(V)x(D)
37" 877.0 x 516.8 x 55.5(mm)
42" 1006 x 610 x 56(mm)
Pixel Pitch 32" 0.1702 x 0.5107 x RGB(mm)
37" 0.200 x 0.600 x RGB
42" 0.227 x 0.681 x RGB
Pixel Format 1366 horiz. By 768 vert.
Pixels RGB strip arrangement
Coating Hard coating(3H), Anti-glare
reatment of the front polarizer,
Back Light 32" 18EEFL
37" 20EEFL
42" 20CCFL
-7-
3.Optical Feature(LCD Module)
No Item Specification Min. Typ. Max. Remark
1 Viewing Angle 10> R/L, U/D 178, 178
2 Luminance Luminance(cd/m2) 400 500 32"/37"/42"
Variation 1.3 MAX/MIN
3 Contrast Ratio CR(32", 37") 600 800 All White/All Black
CR(42") 400 550 All White/All Black
CRD(32", 37") 1200 1600 All White/All Black
CRD(42") 800 1100
4 CIE Color Coordinates White Wx Typ 0.285 Typ LPL(32")
Wy -0.03 0.293 +0.03
Red Xr 0.640
Yr 0.343
Green Xg 0.280
Yg 0.605
Blue Xb 0.145
Yb 0.065
White Wx Typ 0.285 Typ LPL(37")
Wy -0.03 0.293 +0.03
Red Xr 0.640
Yr 0.341
Green Xg 0.287
Yg 0.610
Blue Xb 0.146
Yb 0.069
White Wx Typ 0.281 Typ LPL(42")
Wy -0.03 0.293 +0.03
Red Xr 0.639
Yr 0.340
Green Xg 0.284
Yg 0.604
Blue Xb 0.145
Yb 0.064
4.Component Video Input (Y, PB, PR)
Specification
No Proposed
Resolution H-freq(kHz) V-freq(Hz)
1. 720x480 15.73 60 SDTV, DVD 480i
2. 720x480 15.63 59.94 SDTV, DVD 480i
3. 720x480 31.47 59.94 480p
4. 720x576 15.625 50.00 SDTV, DVD 625 Line
5. 720x576 31.25 50.00 HDTV 576p
6. 1280x720 45.00 60.00 HDTV 720p
7. 1280x720 44.96 59.94 HDTV 720p
8. 1920x1080 31.25 50.00 HDTV 1080i
9. 1920x1080 33.75 60.00 HDTV 1080i
10. 1920x1080 33.72 59.94 HDTV 1080i
-8-
5. RGB PC INPUT Mode Table
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
Analog RGB, Digital RGB
1 720x400 31.468 70.8 28.321
2 640x480 31.469 59.94 25.17 VESA
37.684 75.00 31.5 VESA
3 800x600 37.879 60.31 40.00 VESA
46.875 75 49.5 VESA
4 832x624 49.725 74.55 57.283
5 1024x768 48.363 60.00 65.00 VESA(XGA)
56.47 70.00 75.00 VESA(XGA)
60.123 75.029 78.75 VESA(XGA)
6 1280x768 47.776 59.870 79.50 VESA(WXGA)
7 1360x768 47.720 59.799 84.75 VESA(WXGA)
8 1366x768 47.720 59.799 84.75 Supported
6. RGB DTV INPUT Mode Table
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
1 720x576 31.25 50.00 SDTV 576p 50Hz
2 720x480 31.47 59.94 SDTV 480p 60Hz
3 1280x720 45.00 50.00 HDTV 720p 50Hz HDCP
4 1280x720 44.96 59.94 HDTV 720p 60Hz HDCP
5 1920x1080 28.13 50.00 HDTV 1080i 50Hz HDCP
6 1920x1080 33.72 59.94 HDTV 1080i 60Hz HDCP
* RGB-PC EDID DATA
0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F
0x00 00 FF FF FF FF FF FF 00 1E 6D Product code Serial No
0x01 Month/Year 01 03 01 46 27 78 EA D9 B0 A3 57 49 9C 25
0x02 11 49 4B A5 6E 80 31 40 01 01 01 01 45 40 01 01
0x03 61 40 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88
0x04 35 00 BC 88 21 00 00 1C 4E 1F 00 80 51 00 1E 30
0x05 40 80 37 00 BC 88 21 00 00 18 00 00 00 FD 00 38
0x06 4B 1F 3D 09 00 0A 20 20 20 20 20 20 00 00 00 FC
0x07 00 Model Name 0A 20 20 20 00 C/S
* Product code
Product Code
Model Name Product Code EDID Table
32LC2D 30066 7572
37LC2D 30068 7574
42LC2D 40028 9C5C
* Serial No. : Controlled on production line
* Month, Year : Controlled on production line : ex) Montly : '03' => '03', Year. '2005' => '0F'
* Model Name(Hex) :
Model Name Model Name(Hex)
32LC2D-SC 33324C4332442D4543
37LC2D-SC 33374C4332442D4543
42LC2D-SC 34324C4332442D4543
* Checksum : Changeable by total EDID data
-9-
7. HDMI INPUT Mode Table
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
Analog RGB, Digital RGB
1 720x400 31.468 70.8 28.321
2 640x480 31.469 59.94 25.17 VESA
37.684 75.00 31.5 VESA
3 800x600 37.879 60.31 40.00 VESA
46.875 75 49.5 VESA
4 832x624 49.725 74.55 57.283
5 1024x768 48.363 60.00 65.00 VESA(XGA)
56.47 70.00 75.00 VESA(XGA)
60.123 75.029 78.75 VESA(XGA)
6 1280x768 47.776 59.870 79.50 VESA(WXGA)
7 1360x768 47.720 59.799 84.75 VESA(WXGA)
8 1366x768 47.720 59.799 84.75 Supported
8. HDMI DTV Mode Table
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
1 720x576 31.25 50.00 SDTV 576p 50Hz
2 640x480 31.5 59.94/60 SDTV 480p 60Hz
3 720x480 31.47 59.94/60 SDTV 480p 60Hz
4 1280x720 45.00 50.00 HDTV 720p 50Hz HDCP
5 1280x720 44.96 59.94/60 HDTV 720p 60Hz HDCP
6 1920x1080 28.13 50.00 HDTV 1080i 50Hz HDCP
7 1920x1080 33.72 59.94/60 HDTV 1080i 60Hz HDCP
* HDMI EDID DATA
0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F
0x00 00 FF FF FF FF FF FF 00 1E 6D Product code Serial No
0x01 Month/Year 01 03 80 46 27 78 EA D9 B0 A3 57 49 9C 25
0x02 11 49 4B A5 6E 80 31 40 01 01 01 01 45 40 01 01
0x03 61 40 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88
0x04 35 00 BC 88 21 00 00 1C 4E 1F 00 80 51 00 1E 30
0x05 40 80 37 00 BC 88 21 00 00 18 00 00 00 FC 00
0x06 Model Name 0A 20 20 00 00 00 00 FD
0x07 00 38 4B 1F 3D 09 00 0A 20 20 20 20 20 20 01 C/S
0x00 02 03 24 F1 49 85 04 02 01 03 11 12 13 14 23 09
0x01 07 07 23 09 07 07 23 09 07 07 83 01 00 00 65 03
0x02 0C 00 10 00 01 1D 00 80 51 D0 1C 20 40 80 35 00
0x03 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E\
0x04 96 00 13 8E 21 00 00 18 2A 12 00 10 41 43 17 20
0x05 28 60 35 00 00 00 32 00 00 1C 01 1D 80 18 71 1C
0x06 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00 00
0x07 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 6B
- 10 -
7. Mechanical specification
<32LC2D>
No, Item Content Remark
1 Product Dimenson Width(W)(32"/37"/42") Length(D)(32"/37"/42") Height(H)(32"/37"/42")
Before Packing 811 944 1054 235 286 302 630 726 813.5 With Stand
After Packing 896 1052 1166 300 383 402 720 855 950
2 Product Weight Only SET 22Kg(32")/31Kg(37")/37.0Kg(42") With Stand
With Box 25.5Kg(32")/33.3Kg(37")/42.3Kg(42")
8. Mechanical specification
Scart Arrangement 1.(Full Scart)
Pin Signal Signal Level Impedance
1 Audio Output B (right) 0.5 Vrms <1
2 Audio Input B (right) 0.5 Vrms > 10
3 Audio Output A (left) 0.5 Vrms <1
4 Ground (audio) - -
5 Ground (blue) - -
6 Audio input A (left) 0.5 Vrms > 10
7 Blue input 0.7 V 75
8 Function Select (AV control) High (9.5 - 12V) - AV Mode
Mid (5 - 8V) - Wide Screen > 10
Low (0 - 2V) - TV Mode
9 Ground (Green) - -
10 Comms Data 2
11 Green input 0.7 V 75
12 Comms Data 1
13 Ground (Red) - -
14 Ground (Blanking) - -
15 Red input 0.7 V 75
16 RGB Switching Control High (1 - 3V) - RGB
Low (0 - 0.4V) - Composite 75
17 Ground (Video input & Output) - -
18 Ground (RGB Switching Control) - -
19 Video input (Composite) 1V including sync(0.85 Scart Arrangement 2.(Half Scart)
Pin Signal Signal Level Impedance
1 Audio Output B (right) 0.5 Vrms <1
2 Audio Input B (right) 0.5 Vrms > 10
3 Audio Output A (left) 0.5 Vrms <1
4 Ground (audio) - -
5 Ground (blue) - -
6 Audio input A (left) 0.5 Vrms > 10
7 - - -
8 Function Select (AV control) High (9.5 - 12V) - AV Mode
Mid (5 - 8V) - Wide Screen > 10
Low (0 - 2V) - TV Mode
9 Ground (Green) - -
10 Comms Data 2
11 - - -
12 Comms Data 1
13 Ground (Red) - -
14 Ground (Blanking) - -
15 Red input
16 - - -
17 Ground (Video input & Output) - -
18 - - -
19 Video output (Composite) 1V including sync (0.85 [Write Batch].
This spec. sheet is applied to all of the LD62A chassis Next, select proper binary file(*.bin) including the CH
manufactured at LG TV Plant all over the world. information for each model at
[Channel Download] => [NVRAM File].
2. Specification.
2.1 Because this is not a hot chassis, it is not necessary to
use an isolation transformer.
However, the use of isolation transformer will help to
protect test instruments
2.2 Adjustment must be done in the correct sequence.
2.3 The adjustment must be performed at 25
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