Service Manuals, User Guides, Schematic Diagrams or docs for : Philips Monitor Monitor CD 2001[1].part02 Monitor CD 2001 E-MANUALS Philips crt 107p pdf p33

<< Back | Home

Most service manuals and schematics are PDF files, so You will need Adobre Acrobat Reader to view : Acrobat Download Some of the files are DjVu format. Readers and resources available here : DjVu Resources
For the compressed files, most common are zip and rar. Please, extract files with Your favorite compression software ( WinZip, WinRAR ... ) before viewing. If a document has multiple parts, You should download all, before extracting.
Good luck. Repair on Your own risk. Make sure You know what You are doing.

Image preview - the first page of the document

Preview not available!
Sorry, no preview image available for this document.
Possible reasons are : this is not a PDF document, it is password protected or the file is partially corrupted.
We are working to fix the issue.
You can still download the full file from the link below and it will be viewable.

>> Download p33 documenatation <<

Text preview - extract from the document

Repair Tips 107P CM25 GSIII 33
26
9 Go to cover page
0. Warning preferably be equipped with a thermal control (soldering
temperature: 225 to 250 oC).
All ICs and many other semi-conductors are susceptible to - The chip, once removed, must never be reused.
electrostatic discharges (ESD). Careless handling during
repair can reduce life drastically. When repairing, make sure 1.4 Attachment of SMDs
that you are connected with the same potential as the mass - Locate the SMD on the solder lands by means of tweezers
of the unit via a wrist wrap with resistance. Keep components and solder the component on one side. Ensure that the
and tools also at the same potential ! component is positioned correctly on the solder lands (see
Fig.2A).
- Next complete the soldering of the terminals of the
1. Servicing of SMDs (Surface Mounted Devices) component (see Fiq. 2B).

1.1 General cautions on handling and storage Fig. 2 MOUNTING
- Oxidation on the terminals of SMDs results in poor e.g. A PAIR OF TWEEZERS
soldering. Do not handle SMDs with bare hands.
- Avoid using storage places that are sensitive to oxidation
such as places with sulphur or chlorine gas, direct sunlight, A
high temperatures or a high degree of humidity. The
SOLDER
capacitance or resistance value of the SMDs may be 0.5 - 0.8 mm
PRESURE
affected by this. SOLDERING

- Rough handling of circuit boards containing SMDs may IRON

cause damage to the components as well as the circuit
boards. Circuit boards containing SMDs should never be
bent or flexed. Different circuit board materials expand and SOLDERING TIME
< 3 sec/side
SOLDER
0.5 - 0.8 mm B
contract at different rates when heated or cooled and the PRESURE
SOLDERING
components and/or solder connections may be damaged IRON

due to the stress. Never rub or scrape chip components as
this may cause the value of the component to change.
Similarly, do not slide the circuit board across any surface.
2. Caution when attaching SMDs
1.2 Removal of SMDs - When soldering the SMD terminals, do not touch them
- Heat the solder (for 2-3 seconds) at each terminal of the directly with the soldering iron. The soldering should be
chip. By means of litz wire and a slight horizontal force, done as quickly as possible, care must be taken to avoid
small components can be removed with the soldering iron. damage to the terminals of the SMDs themselves.
They can also be removed with a solder sucker (see Fig. - Keep the SMD's body in contact with the printed board when
1A) soldering.
Fig. 1 DISMOUNTING
- The soldering iron to be used (approx. 30 W ) should
SOLDERING
VACUUM PISTON
4822 395 10159
preferably be equipped with a thermal control (soldering
temperature: 225 to 250 C).
o
IRON

e.g. WELLER - Soldering should not be done outside the solder land.
SOLDER TIP PT -H7
A - Soldering flux (of rosin) may be used, but should not be
acidic.
SOLDERING
IRON - After soldering, let the SMD cool down gradually at room
SOLDER WICK temperature.
4822 321 40042
- The quantity of solder must be proportional to the size of the
e.g. A PAIR OF TWEEZERS
solder land. If the quantity is too great, the SMD might
HEATING HEATING crack or the solder lands might be torn loose from the
B printed board (see Fig. 3).

SOLDERING Fig. 3 Examples
IRON
C
SOLDER WICK

- While holding the SMD with a pair of tweezers, take it off RIGHT
gently using the soldering iron's heat applied to each
terminal (see Fig. 1 B).
- Remove the excess solder on the solder lands by means of
litz wire or a solder sucker (see Fig. 1C).

1.3 Caution on removal
- When handling the soldering.iron. use suitable pressure and SOLDERING
IRON
be careful.
- When removing the chip, do not use undue force with the
pair of tweezers.
- The soldering iron to be used (approx. 30 W) should

3Back Forward4

◦ Jabse Service Manual Search 2026 ◦ Jabse Pravopis ◦ onTap.bg ◦ Other service manual resources online : Fixya ◦ eServiceinfo