Service Manuals, User Guides, Schematic Diagrams or docs for : RCA LCD RCA_BD20TF10_F19426_F19436_F20TF10_TVD809_Disassembly_[SM]

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TX_TVD809                                                                                                                    TX_TVD809

DISASSEMBLY PROCEDURES                                                                                                       CHIP COMPONENT REMOVAL
                                                                                                                             Replacement Procedure for Chip Removal                          Note: Do not attempt to lift the component off the board
Back Cover Removal                                              8.   Raise the 2 tabs at the top of the plastic holder and   The following procedures are recommended for the                      until the component is completely disconnected
 1. Remove five screws to release the back cover. 2                  pull the top of the PCB clear of the tabs. Lift the     replacement of the chip components used in this unit.                 from the board by a twisting action. Attempting to
     from each side and a small Phillips screw located               module straight up and out.                             Failure to follow these procedures may lead to damage to              remove the component before it has completely
     among the rear audio jacks.                                                                                             the copper traces and pads on the printed circuit boards.             been disconnected can break the copper foil on
 2. Lift the back rear edge of the back cover and pull                                                                          1.Preparation for replacement                                      the printed circuit board.
     back to remove.                                                                                                               a. Soldering Iron: Use a pencil-type soldering iron
                                                                                                                                        using less than 30 watts.                            3.   Installing a chip component
                                                                                                                                   b. Solder Type: Eutectic Solder, Tin 63%/Lead
                                                                                                                                                                                                  a. Presolder the contact points on the circuit board
                                                                                                                                      37%, is recommended.
                                                                                                                                                                                                       (Fig. 2-4).
                                                                                                                                   c. Soldering Time: Do not apply heat for more than
                                                                                                                                       4 seconds.
                                                                                                                                   d. Preheating: Chip capacitors must be preheated
                                                                                                                                       before installation. (130 degrees - 150 degrees
                                                                                                                             Note: Chip component must not be reused after removal.
                                                                                                                                    Excessive mechanical stress and rubbing of the
                                                                                                                                    component electrode must be avoided.

                                                                                                                                2. Removing the chip component (Fig. 2-3):                               Fig.2-4, Chip Component Presolder
                                                                                                                                    Grasp the chip component body with tweezers and               b. Hold the component in position with tweezers and
                                                            Main Chassis PCB Removal                                                alternately apply heat to both electrodes.                    solder the electrodes as shown (Fig.2-3).
                                                             9. Disconnect the AC power cable.
Gemstar Module Removal                                       10. Remove the back cover.
 1. Remove the back cover.                                   11. Discharge the anode lead to the picture tube ground
 2. Remove the small screw at the lower back edge of             strap and remove the anode lead before
    the plastic support.                                         disconnecting other cables.
 3. Disconnect the 2 ribbon cables (BG403 & BG 404)          12. Disconnect cable assemblies P1402, P3101, P3203,
    from the top of the Gemstar PCB.                             P3401 and P4010 from the Main PCB.
                                                                                                                                                                                                      Fig. 2-3 - Chip Component Installation
 4. Lift the Gemstar module straight up and out.
                                                                                                                                                                                             Note: Do not glue the replacement chip component to the
                                                                                                                                                                                                   circuit board.

                                                                                                                                        Figure 2-3, Removing Chip Components
                                                                                                                                   When the solder on both electrodes has melted,
                                                                                                                                   remove the chip component with a twisting motion.

E/W Correction Module Removal
 5. Remove the back cover.                                      13. Push out on the plastic Tabs on either side of the
                                                                    tray and slide the chassis back and out until clear of
 6. Remove the small screw at the top center back of
    the PCB.
 7. Disconnect the 2 cables (BL108 & BL103) from the
    E/W Correction PCB.

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