Service Manuals, User Guides, Schematic Diagrams or docs for : Samsung n418_n420
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
QingDao_Int
CPU :Intel Penryn
g
n l
u ia
Chip Set :Intel Cantiga & ICH9M
Remarks : Montevina Platform
C
Model Name : QingDao_Int s t
m en
C
a d
PBA Name : MAIN
PCB Code : BA41-01084A NANYA BLOCK DESIGN
BA41-01085A
BA41-01086A
S fi HANNST
GCE
n
Dev. Step : ADV
o
Revision : 1.0
B B
T.R. Date : 2009.02.13
Design
XIAOHONG ZHANG
CHECK
RUJIN ZHENG
C
APPROVAL
BC LEE
A A
Owner : SESC Mobile R & D Signature : X
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
CPU Smart
Charging
FAN Mobile Processor DC/DC Battery DC/DC
Circuit
D Clocking IMVP-6 Module D
CK-505 Penryn-6M
CPU FSB 1067
Thermistor
(TBD)
478pin ON BOARD
g
L2 Cache : 6/3MB
FSB Termination VCCP / DC-DC
667/800 MT/S
n l
Channel A (Standard) DDR II 667/800 DDR II
HDMI SODIMM 0
HDMI MCH-M Dual channel
u ia
DDR II DDR II Power
LCD
Cantiga-GM Channel B (Reverse) DDR II 667/800 SODIMM 1
LCD GM47
s t
1299 FCBGA
CRT
CRT
C C
m en
Direct Media Interface CLINK
x4, 1.5V
USB 0,2,6
a d
USB 0,2,6
Lane 4 8057 RJ45
PCIE x1
S fi
ANT
USB 5
Bluetooth ICH9-M 52P
PCIE x1 Lane 1 ANT
676 BGA USB 3 Mini Card (WLAN)
HDAUDIO USB 8
High Definition Audio Camera
Audio
n
Aud. HD Primary
AMP
ALC272 12P PCIE x1 Lane 3
USB 7 Express Card
o
HD Secondary
RJ11 MDC
B Modem B
C
INT MIC USB 4
SPI
HP SPI ROM
3 IN 1 SD(SDHC)
MIC-IN
LPC
AU6336 MMC
SATA 0
2P 2P
SATA HDD
SATA ODD SATA 1
Touch
SATA 4 MICOM PAD
SPKR R eSATA 3.3V LPC, 33MHz
H8S-2110B
TMKBC (TBD) KBD
SPKR L
A A
80 Port
LED
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
BOARD INFORMATION
D D
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION
Voltage Rails
g
n l Crystal / Oscillator
u ia
TYPE FREQUENCY DEVICE USAGE
Crystal 32.768KHz ICH9-M Real Time Clock
VDC Primary DC system power supply (7 to 21V) Crystal 10MHz MICOM HD64F2169/2160
s t
CPU_CORE Core Voltage for CPU Crystal 14.318MHz CLOCK-Generator CK-505
EGFX_CORE Core Voltage for GPU Crystal 25MHz LAN Intel LAN
P1.05V VTT for CPU, Cantiga & ICH9-M
P1.1 VTT for N10M_GE1
P3.3V_MICOM 3.3V always power rail (for Micom)
P1.5V 1.5V switched power rail (off in S3-S5)
C P1.8V 1.8V switched power rail (off in S3-S5) C
m en
P1.8V_AUX 1.8V power rail for DDR (off in S4-S5)
P0.9V 0.9V power rail for DDR (off in S3-S5)
P3.3V 3.3V switched power rail (off in S3-S5)
P3.3V_AUX 3.3V switched on power rail (off in S4-S5)
a d
P5.0V 5.0V switched power rail (off in S3-S5)
P5.0V_AUX 5.0V switched on power rail (off in S4-S5)
P5.0V_ALW 5.0V always power rail
P12.0V_ALW 12.0V always power rail
S fi 2
I C / SMB Address
Devices
ICH9-M
CPU Thermal Sensor
SODIMM0
Address
Master
0111 101x
1010 000x
Hex
-
7Ah
A0h
Bus
SMBUS Master
Thermal Sensor
-
n
SODIMM1 1010 010x A4h -
Thermal Sensor on SODIMM0 0011 000x 30h -
Thermal Sensor on SODIMM1 0011 010x 34h -
CK-505M (Clock Generator) 1101 0010 D2h Clock, Unused Clock Output Disable
B USB PORT Assign
PORT #
0
1
2
3
4
5
6
7
8
9
10
ASSIGNED TO
SYSTEM PORT 0
Mini PCI Express
SYSTEM PORT 1
NC
3 IN 1
Bluetooth
SYSTEM PORT 2
EXPRESS CARD
Camera
NC
NC
PCI Express Assign
PORT #
1
2
3
4
5
6
NC
LOM
NC
NC
Co
ASSIGNED TO
Mini Card 1 (WLAN)
EXPRESS CARD
B
REVISION HISTORY
LCD Pannel Detect (TBD)
A Devices Resolution PANNEL_DETECT_0(strap0) A
See rev notes for more information.
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER DIAGRAM Rev 0.1
KBC3_SUSPWR KBC3_PWRON
D D
(CHP3_S4_STATE*) (CHP3_SLPS3*) KBC3_VRON
AC Adapter PENRYN
g
P1.05V CANTIGA CPU_CORE PENRYN
ICH9-M
n l
Battery DC VDC P1.8V_AUX Cantiga
SODIMM (DDR II)
P1.1V N10M_GE
C u ia
s t
P0.9V DDR II-Termination
P1.8V N10M_GE
GDDR-3 for N10M_GE
C
m en
P0.9V DDR II-Termination
P3.3V_MICOM
a d
ICH9_M
MICOM LED ICH9_M P5V_AUX USB connector THERMAL CRT HDMI
AUDIO
ICH9_M MICOM AUDIO
P5.0V ODD HDD CAMERA
S fi
TOUCH PAD
ICH9-M
EXPRESS CARD EGFX_CORE N10M_GE1
WLAN
P5.0V_ALW P3.3V_AUX LAN
n
MDC
THERMAL
LVDS
LED
o
CK505
CANTIGA
P1.5V ICH9_M
B EXPRESS CARD B
C
P1.2V_LAN
LAN CK505 THERMAL CANTIGA
P12.0V_ALW DDR2 N10M_GE1 CRT
LVDS HDMI ICH9_M
P3.3V SPI WLAN EXPRESS CARD
LAN AUDIO 3 IN 1
P1.8V_LAN HDD BT KBD
P2.5V_LAN LEDS
Power On/Off Table by S-state LAN
Rail
S0 S3 S4 S5
State
+V*A(LWS)
S5-S4 S3 S0
ON ON ON ON
+V*LAN
A +1.8V_AUX A
ON ON
+0.9V
+V*AUX ON ON SAMSUNG
ELECTRONICS
+V ON
+V* (CORE) ON
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER RAILS ANALYSIS
220V
Rev. 0.6 (060920)
D D
5.0V_AUX ( TBD A )
Adapter Battery
3.3V_AUX ( TBD A )
g
MICOM 3V ( TBD A )
1.8V ( TBD A )
n l
1.05V
0.1 A (TBD) ITP
CPU CORE MICOM 3V
u ia
CPU CORE ( TBD A )
1.05V (VCCP)
41 A (TBD) Penryn-6M 3.3V
0.75 A (TBD)
Thermal
3.3V
0.08 A (TBD)
0.08 A (TBD)
KBC
1.05V ( TBD A ) 4.5 A (TBD) Sensor
1.5V ( 35 W )
1.5V ( TBD A ) 0.13 A (TBD)
s t
1.25V ( TBD A )
3.3V ( TBD A ) MICOM 3V
5.0V ( TBD A ) 1.05V (MCH CORE)
0.1 A (TBD) PWR LED
1.8V_AUX ( TBD A ) 1.05V (VCCP) 7.7 A (TBD)
0.9V( TBD A ) 4.48 A (TBD) Cantiga
1.5V 1.8V
0.125 A (TBD)
C 3.3V CLOCK C
1.25V GMCH 3.3V
m en
0.25 A (TBD)
VGA CORE (TBD A)
2.43A (TBD)
VDC INV ( TBD A )
3.3V
0.33 A (TBD)
PEX IO (TBD A)
1.8V_AUX
3.79 A (TBD) (8 - 8.5 W )
RTC_Battery
a d
3.3V 0.2 A (TBD) KeyBoard 3.3V_AUX
0.6 A (TBD) LAN
1.05V
1.5V 1.13 A (TBD)
2.4A (TBD) ICH9-M
S fi
3.3V
0.374 A (TBD)
3.3V 0.01 A (TBD) KBD LED 3.3V_AUX
3.3V_AUX 0.1 A (TBD) SD Card
0.209 A (TBD)
5V
5V_AUX 0.001 A (TBD)
RTC_Battery
0.001 A (TBD) ( ~ 2.0 W ) 3.3V 0.015 A (TBD) SPI 3.3V
0.006 A (TBD)
5V
1.0V-1.1V (EGFX CORE) 3.3V
17.75 A (TBD) 0.06 A (TBD) HD Audio 3.3V
5V
n
0.07 A (TBD)
1.8V 0.8A (TBD) Mini Card X 2
6.53 A (TBD) PEG
1.2V (PEX IO)
1.75 A (TBD) 5V 1.5 A (TBD) ODD SATA
o
3.3V
0.67 A (TBD)
3.3V_AUX
B 1.8V_AUX
0.5 A (TBD) MDC B
0.9V
3.1 A (TBD) DDR-2 5V
0.22 A (TBD) SATA HDD
1 A (TBD) (Dual slots)
C
( ~ 5.0 W )
1.8V GDDR 5V FAN
3.1 A (TBD) 0.16 A (TBD)
3.3V (LCD 3V)
0.67 A (TBD) 5V Audio AMP
19V (VDC INV) 0.5 A (TBD)
LCD 1.5 A (TBD)
P3.3V_AUX 5V
P1.2V_LAN
0.08 A (TBD) 2 A (TBD) USB (x 3)
0.29 A (TBD) LAN (88E8057)
P1.8V/2.5V_LAN 0.15 A (TBD)
5V 0.2 A (TBD) Touch Pad
A
1.0 A (TBD) TP LED A
Value by Datasheet/Application notes (Value by measurement) SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS Host Boot / ME Off
SAMSUNG ELECTRONICS CO'S PROPERTY.
1
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
(SLPS4* = S4_STATE*) > (SLPM* = SLPS3*)
M-1) KBC3_DDR_PWRON (TBD) = 8) KBC3_SUSPWR
RTC
Battery
PRTC_BAT
CHP3_RTCRST#
POWER SEQUENCE Rev. 0.7
6) P3.3V_AUX
M-2) KBC3_ME_PWRON = 15) KBC3_PWRON CHP3_ME_RTCRST#
Host / ME Boot
(SLPS4* = S4_STATE*) > SLPM* > SLPS3*
15) VRM3_CPU_PWRGD
D PRTC PRTC
16 15 D
Host S5 / ME Boot
POWER 8
(SLPS4* = SLPM*) > S4_STATE* > SLPS3*
16) CLK3_PWRGD CK-505 16-1) Clock Running
LAN100_SLP
INTVRMEN
10-1) P1.05V
S/W 8) CHP3_SLPS5#/4#/3#
g
11) VCCP3_PWRGD (GM-model)
7 7) KBC3_RSMRST# 7) P1.05V_AUX
CPU
4) KBC3_PWRSW#
n l
7) P1.5V_AUX 12)GCORE3_PWRGD (PM-model)
4 KBC 15)VRM3_CPU_PWRGD 13) KBC3_VRON (Back-up)
VRM
VRMPWRGD
u ia
17) KBC3_PWRGD
17 17) KBC3_PWRGD 18 (Test Option)
PWROK
110ms Delay 18) CPU1_PWRGDCPU 14) CPU_CORE
s t
15)VRM3_CPU_PWRGD
5) KBC3_SUSPWR ICH9-M 19) PLT3_RST*
CPU 14
5 9) KBC3_PWRON 17) KBC3_PWRGD
19 10-1) P1.5V
C 9 C
m en
CL_PWROK
13) KBC3_VRON 10-1) P1.05V 20
13
a d
3 10) P5.0V DDR2 POWER 6) P1.8V_AUX 20) CPU1_CPURST*
8) KBC3_SUSPWR
P3.3V_MICOM
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