Service Manuals, User Guides, Schematic Diagrams or docs for : siemens Mobile Phone SIEMENS AP75, M315 SIEMENS AP75, M315
<< Back | HomeMost service manuals and schematics are PDF files, so You will need Adobre Acrobat Reader to view : Acrobat Download Some of the files are DjVu format. Readers and resources available here : DjVu Resources
For the compressed files, most common are zip and rar. Please, extract files with Your favorite compression software ( WinZip, WinRAR ... ) before viewing. If a document has multiple parts, You should download all, before extracting.
Good luck. Repair on Your own risk. Make sure You know what You are doing.
Image preview - the first page of the document
>> Download SIEMENS AP75, M315 documenatation <<
Text preview - extract from the document
12/2005
Release 1.0
Service Repair Documentation
Level 4 (level 2,5e)
M315 / AP75
Release Date Department Notes to change
R 1.0 12.12.2005 BenQ Mobile (Taipei/KLF) New document
Technical Documentation
TD_Repair_L4 M315/AP75_R1.0.pdf Page 1 of 42
12/2005
Release 1.0
Table of Content
1 Introduction ...............................................................................................................................3
1.1 PURPOSE ...............................................................................................................................3
1.2 SCOPE ...................................................................................................................................3
1.3 TERMS AND ABBREVIATIONS ...................................................................................................3
2 List of available level 4 (level 2,5e) parts ...............................................................................4
3 Required Software for Level 4 (level 2,5e) ..............................................................................5
4 Radio Part ..................................................................................................................................6
4.1 RECEIVER OPERATION ............................................................................................................6
4.2 TRANSMITTER OPERATION ......................................................................................................7
4.3 VCXO OPERATION .................................................................................................................8
4.4 BLUETOOTH OPERATION .........................................................................................................9
5 Logic ( Base-Band ).................................................................................................................10
5.1 CALYPSO-LITE ......................................................................................................................12
5.2 IOTA....................................................................................................................................15
5.3 POWER SUPPLY ...................................................................................................................19
5.3.1 System power on/off Sequence ...................................................................................21
5.4 MEMORY CIRCUIT .................................................................................................................22
5.5 LCD MODULE ( LCDM).........................................................................................................24
6 Interfaces .................................................................................................................................27
6.1 AUDIO CIRCUIT .....................................................................................................................27
6.2 MELODY IC...........................................................................................................................29
6.3 AUDIO CIRCUIT .....................................................................................................................31
6.4 10 PINS I/O CONNECTOR ......................................................................................................33
6.5 KEYPAD LED CIRCUIT ...........................................................................................................35
6.6 VIBRATOR ............................................................................................................................36
6.7 SIM CIRCUIT ........................................................................................................................37
6.8 KEYPAD................................................................................................................................38
6.9 RTC CIRCUIT .......................................................................................................................40
7 Charging circuit .......................................................................................................................41
Technical Documentation
TD_Repair_L4 M315/AP75_R1.0.pdf Page 2 of 42
12/2005
Release 1.0
1 Introduction
1.1 Purpose
This Service Repair Documentation is intended to carry out repairs on BenQ repair level 3-4.
1.2 Scope
This document is the reference document for all BenQ authorised Service Partners which are
released to repair Siemens mobile phones up to level 2.5.
1.3 Terms and Abbreviations
Technical Documentation
TD_Repair_L4 M315/AP75_R1.0.pdf Page 3 of 42
12/2005
Release 1.0
2 List of available level 4 (level 2,5e) parts
(according to Component Matrix V1.xx - check C-market for updates)
Product ID Order Number Description CM
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
M315
Technical Documentation
TD_Repair_L4 M315/AP75_R1.0.pdf Page 4 of 42
12/2005
Release 1.0
Required Equipment for Level 4 (level 2,5e)
GSM-Tester (CMU200 or 4400S incl. Options)
PC-incl. Monitor, Keyboard and Mouse
Adapter cable for Bootadapter (F30032-xx-A1)
Troubleshooting Frame M315_AP75 (F30032-xx-A1)
Power Supply
Spectrum Analyser
Active RF-Probe incl. Power Supply
Oscilloscope incl. Probe
RF-Connector (N<>SMA(f))
Power Supply Cables
Dongle (F30032-xx-A1)
BGA Soldering equipment
Reference: Equipment recommendation V1.6
(downloadable from the technical support page)
3 Required Software for Level 4 (level 2,5e)
Windows XP
XCSD Tools Level 2
GRT Version 3 or higher
Internet unblocking solution (JPICS)
Technical Documentation
TD_Repair_L4 M315/AP75_R1.0.pdf Page 5 of 42
12/2005
Release 1.0
4 Radio Part
M315 / AP75 utilizes TI's chipsets (CALYPSO-Lite and IOTA) as base-band solution. Base-band is
composed with two potions: Logic and Analog/Codec. CALYPSO-Lite is a GSM/GPRS digital base-
band logic solution included microprocessor, DSP, and peripherals. IOTA is a combination of
analog/codec solution and power management which contain base-band codec, voice-band codec,
several voltage regulators and SIM level shifter etc. In addition, 56E22 integrates with other
features such as LED backlight, color LCD display, DSC, vibration, melody tone and charging etc.
The following sections will present the operation theory with circuitry and descriptions respectively.
4.1 Receiver Operation
IRxP
GSM LNA
RX GSM: 925~960 MHz
IRxN
0 0 GSM:
90 90 1850~1920 MHz
Shift(1/2)
DCS: DCS LNA
1805~1880 MHz ADC/DAC & Control Logic for DC Offset Cancellation
T/R
Switch
DCS:
1805~1880 MHz
0 0 PCS:
90 90 1930~1990 MHz
Shift(1/2)
QRxP
PCS: QRxN
1930~1990 MHz PCS LNA
RFVCO
RF
PCS:3860~3980 MHz
DCS:3610~3760 MHz
2 Synth
GSM:3700~3840 MHz
The Receiver structure in HD155155NP is a zero-IF solution. That means RF signal is directly down-
converted to the baseband signal. And by the way, all of the DC-offset canceling processes
are done within chip. We do not have to care about that.
The LNA amplifies the RF signal after passing the T/R switch and RF SAW filter and before it enters
the down-converter section. The RF signal is mixed with a local oscillator (LO) signal to generate the
baseband signal.
Three LPFs are used in the baseband signal processing for reducing blocking signals. The first LPF
employs two external capacitors, and we can check whether the front-end (LNA + Mixer) is
functionally well or not by probing these two capacitors to see if there is any baseband
signal(<200kHz).
After three stages of DC-offset cancelling, the signal (I+/I-/Q+/Q-) then output to the baseband IC for
further processing.
Technical Documentation
TD_Repair_L4 M315/AP75_R1.0.pdf Page 6 of 42
12/2005
Release 1.0
4.2 Transmitter Operation
PCS:3860~3980 MHz
RFVCO DCS:3580~3730 MHz
GSM:3840~3980 MHz
IFVCO 640/656 MHz
RF IF
2 Synth
DCS/ Synth
PCS
2 2
GSM PCS:1930~1990 MHz
DCS:1790~1865 MHz
GSM: 960~995 MHz
2
Shift(1/2) 0
90
Quad-Band PA
ITxP
ITxN
T/R Charge
Pump
PFD I&Q Mod
Switch QTxP
80/82 MHz QTxN
Loop Filter
TX GSM: 880~ 915 MHz
DCS:1710~1785 MHz
PCS:1850~1910 MHz
The transmitter chain converts differential IQ baseband signals to a suitable format for
transmission by a power amplifier.
The common mode voltage range of the modulator inputs is 1.05 V to 1.45 V and they have 2.0 Vpp
differential swing. The modulator circuit uses double-balanced mixers for the I and Q paths. The
Local signals are generated by dividing the IFLO signals by 8 in GSM band and by 4 in DCS band,
and then passed to the modulator through a phase splitter / shifter. The IF signals generated are
then summed to produce a single modulated IF signal which is amplified and fed into the offset PLL
block.
Within the offset PLL block there are a down converter, a phase comparator and a VCO driver. The
down converter mixes the first local signal and the TXVCO signal to create a reference local signal
for use in the offset PLL circuit. The phase comparator and the VCO driver generate an error
current, which is proportional to the phase differential between the reference IF and the modulated
IF signals. This current is
used in a third order loop filter to generate a voltage, which in turn modulates the TXVCO.
The RF signal is then amplified by PA and power control loop to the assigned power level within the
burst ramping mask. After passing the LPF of the T/R switch, the signal is then radiated through the
antenna.
Technical Documentation
TD_Repair_L4 M315/AP75_R1.0.pdf Page 7 of 42
12/2005
Release 1.0
4.3 VCXO Operation
-R +R
HD155155NP provides a VCXO function. With that function, we can build a reference clock
generation circuits as shown in the above graph. This means that the VCTCXO module is not
necessary for clock application, and only one crystal with 8ppm tolerance and one variocap are
enough.
The transistor in HD155155NP and two internal capacitors (C1, C2) provide a negative
resistance, and the crystal (X1) combined with some other passive components (including
variocap r : D1) to provide a positive resistance. When these two resistance values equal to each
other at some frequency, the oscillation will happen at that frequency. In our design target, the
oscillation frequency should be within 26MHz +/-15 ppm.
Technical Documentation
TD_Repair_L4 M315/AP75_R1.0.pdf Page 8 of 42
12/2005
Release 1.0
4.4 Bluetooth Operation
26MHz
B5E-VCXO
VBAT LDO
2.8V CLK_SEL OR
Gate TCXOEN
2402~2480 MHz IRDA
UART
BC3-Handphone G2-lite
MCSI
SPI Interface INTERRUPT
The Bluetooth main chip ◦ Jabse Service Manual Search 2024 ◦ Jabse Pravopis ◦ onTap.bg ◦ Other service manual resources online : Fixya ◦ eServiceinfo