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PT - 200
CHASSIS
PT 200 Chassis Service Manual
CONTENTS
PAGE
Recommendation for service repairs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Euro Scart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Component description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Technical Data Sheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Service Menu and Basic Adjustments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Description of integrated circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
STV3500
Integrated Up-Converter with 32-bit CPU Core with Enhancers and
Bitmap On-Screen Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
STV2310
Multisandart TV/VCR Digital Video Decoder and Output Scaler . . . . . . . . . . . . . . . . .22
STV82x6
Multistandard TV Audio Processor and Digital Sound Demodulator . . . . . . . . . . . . . .29
STV9379A
Vertical Deflection Booster . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
SDA948x, SDA958x
Application Note IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
SDRAM 64Mb H-die (x4, x8, x16)
4M x 4Bit x 4 / 2M x 8Bit x 4 / 1M x 16Bit x 4 Banks SDRAM . . . . . . . . . . . . . . . . . .43
M29KW016E
16 Mbit (1Mb x16, Uniform Block) 3V Supply Light Flash Memory . . . . . . . . . . . . . . .47
TDA9885/V3; TDA9886/V3
I2C-bus controlled single/multistandard alignment-free IF-PLL . . . . . . . . . . . . . . . . . .50
TEA6415
Audio - Video . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
TDA933xH series
I2C-bus Controlled TV Display Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
TDA7480
10W Mono Class-D Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
ICE1QS01
Controller for Switch Mode Power Supplies
Supporting Low Power Standby and Power Factor Correction (PFC) . . . . . . . . . . . . .64
P15V330
Low ON-Resistance Wideband/Video Quad 2-Channel MUX/DEMUX . . . . . . . . . . . .67
2
PT 200 Chassis Service Manual
HCF4052B
Different 4-Channel Analog Multiplexer/Demultiplexer . . . . . . . . . . . . . . . . . . . . . . . .71
PT2259
Volume Controller IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
CTF5510A
World Standard FST Tuner Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76
LM1086 -LD1086
1.5A Low Dropout Positive Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
LM358
Dual Operational Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81
M24C64
64/32 Kbit Serial I2C Bus EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
MC34164; MC33164
Micropower Undervoltage Sensing Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85
MCR22-6; MCR22-8
Sensitive Gate Silicon Controlled Rectifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
MOC3031M; MOC3032M; MOC3033M; MOC3041M
MOC 3042M; MOC 3043M
6-Pin Dip Zero-Cross Optoisolators Triac Driver Output . . . . . . . . . . . . . . . . . . . . . . .93
74AHC1G08; 74AHCT1G08
2-input AND gate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95
BU4525AX
Silicon Diffused Power Transistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .98
BTA/BTB06 series
6A Triacs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .102
2 3
PT 200 Chassis Service Manual
RECOMMENDATION FOR SERVICE REPAIRS
1- Use only original spare parts. Only use compo- perature components.
nents with the same specifications for replace- 9- When replacing a wattage resistor in circuit board,
ment. keep the resistor 10 mm away from circuit board.
2- Original fuse value only should be used. 10) Discharging of the picture tube is effected only by
3- Main leads and connecting leads should be chec- the connection point of the aquadaq coating the
ked for external damage before connection. picture tube.
Check the insulation. 11) When carrying out repairing process at control unit
4- Parts contributing to the safety of the product must do not approach too near to the picture tube in
not be damaged or obviously unsuitable. order to avoid any charge transfer.
This is valid especially for insulators and insulating 12) Measurements within the primary circuit of the
parts. switched mode power supply are allowed to be
5- Thermally loaded solder pads are to be sucked off carried out only when using potential-free measur-
and re-soldered. ing equipment. Voltages indicated for this circuit
6- Ensure that the ventilation slots are not obstruc- are based on mains voltage reference level.
ted. 13) The defined local radiation dosage according to
7- Potentials as high as 31 KV are present when this the x-ray radiation regulation is given by the spe-
receiver is operating. Operation of the receiver cific type of the picture tube and the maximum per-
outside the cabinet or with back cover removed in- missible EHT voltage. The EHT voltage must not
volve a shock hazard from the receiver. exceed the maximum value of 31kv.
Servicing should not be attempted by anyone who 14) When the repair process is carried out 12 V line
is not thoroughly familiar with the precautions ne- voltage should not be interrupted because video
cessary when working on high voltage equipment. output stage is endangered by the interruption of
Perfectly discharge the high potential of the pictu- 12 V line voltage.
re tube before handling the tube. The picture tube
is highly evacuated and if broken.
Glass fragments will be violently expelled.
Always discharge the picture tube anode to the re-
ceiver chassis to keep of the shock hazard before
removing the anode cap.
8- Keep wire away from the high voltage or high tem-
HANDLING OF MOS CHIP COMPONENTS
MOS circuit requires special attention with regard to stored in styropor materials or plastic magazines.
static charges. Static charges may occur with any 2- Persons have to rid themselves of electrostatic
highly insulating plastics and can be transferred to charges by touching MOS components.
persons wearing clothes and shoes made of synthetic 3- Hold the component by the body touching the ter-
materials. Protective circuits on the inputs and outputs minals.
of mos circuits give protection to a limited extend only 4- Use only grounded instruments for testing and pro-
due to time of reaction. cessing purposes.
Please observe the following instructions to protect 5- Remove or connect MOS ICs when operating vol-
the components against damage from static charges. tage is disconnected.
1- Keep mos components in conductive package until
they are used. Most components must never be
4
PT 200 Chassis Service Manual
X-RAY RADIATION PRECAUTION
1- Excessive high voltage can be produce potentially portant to use an accurate and reliable high voltage
hazardous X-RAY radiation. To avoid such hazard, meter.
the high voltage must not be above the specified li-
mit. The value of the high voltage of this receiver is 2- The primary source of X-RAY radiation in this TV
30KV at zero beam current (minimum brightness) receiver is the picture tube. For continued X-RAY
under 220V AC power source. The high voltage radiation protection, the replacement tube must be
must not under any circumstance, exceed 31.5KV. exactly the same type tube as specified in the part
It is recommended the reading of the high voltage list.
be recorded as a part of the service record. It is im-
SOLDERING PROCESS
1) SMD Components (Surface Mounted 2)PLCC Components
Device) Desoldering:
Heat up the terminals of PLCC component for 3 or 5
Desoldering: seconds by means of SMD soldering iron and PLCC
Heat up the component from its terminals for 2 or 3 desoldering pair (angle 900C, Leg: 24mm). Take out
seconds with a soldering iron and afterwards take out PLCC component carefully by slightly turning of desol-
the component carefully by means of the tweezers. dering tweezers.
Remove superfluous solder at the solder surfaces of
the components place at pcb by means of desoldering Soldering:
strand or suction de-solder equipment. Never force Remove superfluous solder at the solder surfaces of
the component for removing without heating the termi- the components placed on pcb by means of de-solde-
nals sufficiently. Unsoldered components should not ring iron or suction de-solder equipment. Apply flux
be used for once more. with low grease content. Place PLCC device on the
soldering surface and take care for its correct place-
ment. Secure diagonally by means of two soldering
Soldering: joints. Apply soldering paste along PLCC pins. Short
Place the component properly to its position by means
circuits which may occure during soldering process
of tweezers and solder one side of the component.
have to be removed immediately with a soldering iron.
Then check out the position of the component and be
sure if it is soldered to the right place and then solder
other side of the component. Terminals of the SMD
components must not contact directly to the soldering
iron.
5
PT 200 Chassis Service Manual
EURO SCART
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