Service Manuals, User Guides, Schematic Diagrams or docs for : . Various 20071106103524984_04_Schematic_Diagram
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. Sheet 1 Cover
Sheet 2-7 Diagram (Block/Power) & Annotations
Sheet 8 Clock Generator
D Sheet 9 Thermal Sensor & FAN D
Sheet 10-12 Merom-4M CPU
Sheet 13-17 Crestline-GMCH
Sheet 18 DDR II SODIMM A
Sheet 19 DDR II SODIMM B
Sheet 20-24 ICH8-M
SYDNEY Sheet 25
Sheet 26-30
SPI ROM / 80 port
NVIDIA GFX chipset
g l
Sheet 31-32 GDDR3 GRAPHIC MEMORY
Sheet 33 LCD CONNECTOR
Sheet 34 CRT&TVO BUS SWITCH
n a
Sheet 35 CRT CONNECTOR
CPU :Intel Merom-4M (800/667 MHz) Sheet 36-37 CARD BUS CONTROLER
u ti
Sheet 38 4 IN 1 CONNECTOR
C Chip Set :Intel 965PM & ICH8-M Sheet 39 PCMCIA CONNECTOR C
s n
Sheet 40 MINICARD (WLAN, ROBSON)
Remarks : Mobility Platform Sheet 41 AUDIO - ALC262 (Codec1)
Sheet 42 AUDIO - POWER / SPEAKER / Codec2
Sheet 43 AUDIO - INTERNAL MIC
m e
Sheet 44 AUDIO - HEADPHONE & MIC JACK
Sheet 45 AUDIO - POWER
a id
Model Name : SYDNEY Sheet 46 LAN
Sheet 47 LAN CONNECTOR / MODEM CONNECTOR
S f
PBA Name : MAIN Sheet 48-49 ROBSON - DIAMOND LANK / NAND FLASH
Sheet 50 SIO
PCB Code : BA41-0071#A Sheet 51 MICOM
BA41-00717A:GCE
Sheet 52 MICOM RESET / ADAPTER IN / CHARGING LED
Dev. Step : PR BA41-00718A:TPT Sheet 53 POWER - SWITCHED POWER
n
BA41-0071?A:NANYA
B Sheet 54 POWER - P1.5V B
Revision : 1.0 Sheet 55 POWER - P1.25V / P1.05V
Sheet 56 POWER - DDR2 power
T.R. Date :
o
Sheet 57 POWER - CHARGER & POWER MANAGEMENT
Sheet 58 POWER - P3.3V _AUX & P5.0V_AUX
C
Sheet 59 POWER - CPU VRM
Sheet 60 POWER - GFX CORE
Sheet 61 POWER - P2.5V
DRAW CHECK APPROVAL Sheet 62 HDD / ODD CONNECTOR
Sheet 63 CONNECTORS (USB / TPM / MDC / USB subboard)
Sheet 64 CONNECTORS (KBD / ONTOP / TOUCHPAD / HDMI)
Sheet 65 DOCKING CONNECTOR
Sheet 66-68 SUBBOARDS (TPM / USB / HDMI / ONTOP)
Sheet 69 MOUNT HOLES
A A
SAMSUNG
ELECTRONICS
Owner : SEC Mobile R & D Signature : X
4 3 2 1
# Mobile Intel Santa Rosa Platform Design Guide 0.5 (Dec, 2005) # Mobile Intel Crestline Platform Checklist TBD (TBD)
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
FAN CPU
Clocking Mobile Processor CORE Charger Graphic P1.05V P3.3V_AUX
DDR2 Switched
PG 9 GFX_CORE P1.25V P5.0V_AUX Power
CK-505 IMVP-6
D Merom-4M D
PG 8 CPU PG 59 PG 57 PG 60 PG 55 PG 58 PG 56 PG 53
Thermistor (800MHz)
478pin
PG 9
PG 10,11,12
FSB
800 MT/S
PG 67 HDMI Channel A DDR II 667/533 DDR II PG 18
NVIDIA GMCH-M SODIMM 0
g l
Dual channel
PG 35 CRT
965PM DDR II PG 19
Channel B DDR II 667/533
NB8P SODIMM 1
n a
PG 33 LCD LCD/CRT External Graphics
1299 FCBGA
M/S(SD...) PG 38
PG 13 - 17 CARDBUS
u ti
PG 26-32 CardBus PG 39
MS+IEEE1394
DMI R5C843 EEPROM PG 36
C C
s n
PG 36, 37
PG 63 USB 0,1,2 USB 0,1,2 PCI 1394 PG 37
6pin
ROBSON
ANT
m e
USB 5 Lane 0 Diamond Nand Flash
PG 64 Bluetooth PCIE x1
Lake 88E8055
USB 7
ICH8-M Nand Flash RJ45 PG 47
a id
PG 63 Fingerprint PCIE x1 Lane 3 PG 46
676 BGA
HDAUDIO
S f
PCIE x1 Lane 1 52P
PG 22 - 25
Aud. Audio HD Primary (USB 4) Mini Card 1
AMP PG 40
ALC262
HD Secondary PCIE x1 Lane 2 94P
PG 41 RJ11 MDC
(USB 3) Express Card
n
Modem PG 39
PG 47
B PG 44 PG 63 B
o
SPDIF. SPI
PCIE x1 Lane 5 120P
HP Line PG 25
SPI ROM USB 8 Dock DVI + USB + VGA + LAN+PCIE
PG 65
MIC-IN
LPC
C
SATA 0
52P Parallel
PG 62 SATA HDD PCIE x1 Lane 4
(USB 6) Mini Card 2
Serial
PG 40
PATA
OPTION
80 Port
Pri. IDE slave
PG 25 Touch
MICOM PAD PG 64
HD64F2111B
PG 51 KBD PG 64
CD-ROM Super I/O
PG 62 LPC47N207
A CD / DVD A
PG 50
LED PG 52
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. BOARD INFORMATION
D
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION D
PCI Devices
Crystal / Oscillator
Devices IDSEL# REQ/GNT# Interrupts
TYPE FREQUENCY DEVICE USAGE
Cardbus AD25 0 A,B,C
Crystal 32.768KHz ICH8-M Real Time Clock
Crystal 10MHz MICOM HD64F2169/2111B
g l
Crystal 14.318MHz CLOCK-Generator CK-505
USB AD29(internal) - USB2.0 #0 (USB0) : A Crystal 24.576MHz Cardbus Controller 1394
USB2.0 #1 (USB1) : D Crystal 25MHz LAN
USB2.0 #2 (USB4) : C
USB2.0 #3 (USB5) : E
n a
USB2.0 #4 (EHCI) : H
Hub to PCI AD30(internal) - -
LPC bridge/IDE/AC97/SMBUS AD31(internal) - B
Internal MAC AD24(internal) - E
u ti
AC Link - - B
C C
Voltage Rails
VDC Primary DC system power supply (7 to 21V) s n
m e
2
I C / SMB Address
a id
CPU_CORE Core Voltage for CPU
P1.05V VCCP for CPU, Crestline & ICH8-M
Devices Address Hex Bus
P0.9V 0.9V switched power rail (off in S3-S5)
P1.25V 1.25V switched power rail (off in S3-S5) ICH8-M Master - SMBUS Master
P1.5V 1.5V switched power rail (off in S3-S5)
S f
SODIMM0 1010 000X A0h -
P1.8V 1.8V switched power rail (off in S3-S5) SODIMM1 1010 001X A4h -
P3.3V 3.3V switched power rail (off in S3-S5) CK-505 1010 001x D2h -
P5.0V 5.0V switched power rail (off in S3-S5)
EGFX_CORE Core Volatge for GPU
P1.2V 1.2V switched power rail (off in S3-S5) MICOM Master - SMBUS Master
P2.5V 2.5V switched power rail (off in S3-S5) EMC2102 0101 101X 7Ah Thermal Sensor
MEM1_VREF 0.9V power rail for DDR (off in S4-S5) BATTERY 0001 011X 16h
n
P1.8V_AUX 1.8V power rail for DDR (off in S4-S5)
P3.3V_AUX 3.3V power rail (off in S4-S5)
B P5.0V_AUX 5.0V power rail (off in S4-S5) B
P3V_MICOM 3.3V always power rail
o
P3.3V_ALW 3.3V always power rail (only AC mode)
P3.3V_LAN 3.3V always power rail (only AC mode)
USB PORT Assign
PORT #
0
1
2
3
4
5
6
7
8
9
ASSIGNED TO
SYSTEM PORT 0
SYSTEM PORT 1
SYSTEM PORT 2
(Express Card)
(Mini Card 1)
Bluetooth
(Mini Card 2)
Fingerprint
DOCKING
-
PCI Express Assign
PORT #
0
1
2
3
4
5
ASSIGNED TO
ROBSON
Mini Card 1
Express Card
GLAN
Mini Card 2
DOCKING
C
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER DIAGRAM
KBC3_SUSPWR KBC3_PWRON
D KBC3_VRON D
AC Adapter P1.05V_AUX MEROM MEROM
P1.05V CRESTLINE
ICH8-M CPU_CORE
(VCCP)
P1.5V_AUX
DOCK DC VDC ICH8-M
g l
NB8P
GDDR-3
P1.8V_AUX SODIMM (DDR II) P1.8V
CRESTLINE
n a
Battery DC DDR II-Termination
P0.9V
C
P3V_MICOM
u ti
s n
LED
MICOM
P5.0V_AUX
USB
P5.0V
P1.5V
ICH8-M
CRT
MICOM
R5C843
CRESTLINE
PCMCIA
HDD
VCCA MEROM
C
m e
ICH8-M ICH8-M
ROBSON P1.5V
a id
NB8P
P1.2V
KBC3_ALWS_ON
S f
NB8P
P3.3V_ALW P3.3V_AUX EGFX_CORE
KBC3_LANPWRON# ICH8-M CRESTLINE SODIMM M_PCI
TPM ICH8-M PCMCIA LCD
MDC P3.3V SUPER I/O LEDs
n
BT NB8P MICOM
P3.3V_LAN EMC2102
B B
NB8P
P2.5V
o
LAN
CRESTLINE
ICH8-M
C
P1.25V
S5-S4 S3 S0
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER RAILS ANALYSIS Rev. 0.8
D 5.0V_AUX ( TBD A )
220V This sheet should be updated !!! D
Adapter Battery
3.3V_AUX ( TBD A )
MICOM 3V ( TBD A )
1.8V ( TBD A )
g l
1.05V
0.1 A (TBD) ITP
CPU CORE MICOM 3V
n a
CPU CORE ( TBD A )
1.05V (VCCP)
41 A (TBD) Merom-4M 3.3V
0.75 A (TBD)
Thermal
3.3V
0.08 A (TBD) KBC
1.05V ( TBD A ) 4.5 A (TBD) Sensor 0.08 A (TBD)
1.5V ( 34 W )
1.5V ( TBD A ) 0.13 A (TBD)
1.25V ( TBD A )
u ti
3.3V ( TBD A ) MICOM 3V
5.0V ( TBD A )
0.1 A (TBD) PWR LED
1.05V (MCH CORE)
1.8V_AUX ( TBD A ) 7.7 A (TBD)
1.05V (VCCP)
C 4.48 A (TBD) Crestline C
s n
0.9V( TBD A )
1.5V 1.8V
0.125 A (TBD) 3.3V 0.14 A (TBD)
1.25V GMCH 0.25 A (TBD) CLOCK 3.3V
VGA CORE (TBD A)
2.43A (TBD) 0.2 A (TBD) R5C843
VDC INV ( TBD A )
3.3V
0.33 A (TBD)
PEX IO (TBD A)
1.8V_AUX 3.79 A (TBD) (8 - 8.5 W )
RTC_Battery
3.3V KeyBoard
m e
0.2 A (TBD) 3.3V_AUX
0.6 A (TBD) LAN
1.05V
1.5V 1.13 A (TBD)
2.4A (TBD) ICH8-M
a id
3.3V
0.374 A (TBD)
3.3V 0.01 A (TBD) KBD LED 3.3V_AUX
3.3V_AUX 0.1 A (TBD) SD Card
0.209 A (TBD)
5V
5V_AUX 0.001 A (TBD)
0.001 A (TBD) ( ~ 2.0 W )
S f
RTC_Battery 3.3V 0.015 A (TBD) SPI 3.3V
0.006 A (TBD) 1.2 A (TBD)
5V
1 A (TBD)
Card Bus
1.0V-1.1V (EGFX CORE) 3.3V
17.75 A (TBD) 0.06 A (TBD) HD Audio 3.3V
5V 0.07 A (TBD) 1.5 A (TBD)
1.8V 3.3V_AUX
6.53 A (TBD) PEG 1.5V
0.5 A (TBD) Mini Card X 2
0.75A (TBD)
n
1.2V (PEX IO)
1.75 A (TBD) 5V
3.3V 0.67 A (TBD)
1.5 A (TBD) ODD PATA
B B
3.3V_AUX
0.5 A (TBD) MDC
o
1.8V_AUX
0.9V
3.1 A (TBD) DDR-2 5V
0.22 A (TBD) SATA HDD
1 A (TBD) (Dual slots)
( ~ 5.0 W )
C
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