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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
Table of Contents
HAINAN3_EXT 1. COVER
2-7. DIAGRAM & ANNOTATION
8. CLOCK
g l
9-11. MEROM
12. THERMAL & FAN
CPU : Intel Santarosa Merom
n a
13-17. RS600
18. DDR2 SODIMM
Chip Set : RS600&SB600&M64S
u ti
19 . DDR2 TERMINATION
20-22. GFX
Remarks : Mobility Platform
s n
C 23. GFX MEMORY C
24-27. SB600
28. SB600 TERMINATION
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29. SPI ROM
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30. LCD
Model Name : HAINAN3_EXT 31. CRT
a id
32. 4 IN 1 CARD
PBA Name : MAIN 33. EXPRESS CARD
34. MINICARD/DMB/BT
S f
PCB Code : BA41-00809A GCE 35-37. AUDIO
38. HDD & ODD
BA41-00810A NANYA 39. MICOM
40. LAN
Dev. Step : MP1.1
n
41. LAN & MDC & USB CONN
B 42. KBD & TOUCH-PAD CONN B
Revision : 1.0 43. CHARGE
o
44. P3.3V_AUX & P5.0V_AUX
T.R. Date : 2007.09.08 45. P1.2V & VCCP_CORE
46. GRAPHIC CORE POWER
C
47. DDR2 POWER
48. CPU VRM
49. SWITCH POWER
DRAW CHECK APPROVAL 50. POWER SWITCH AND LED
51. POWER STRAPS
52-53. TP
ELLEN ZHANG ROKY ZHENG KEVIN LEE
A A
DRAW DATE TITLE
CHECK
ELLEN ZHANG
DEV. STEP
9/8/2007
HAINAN3_EXT SAMSUNG
ROKY ZHENG MP1.1
ELECTRONICS
APPROVAL REV PART NO.
KEVIN LEE 1.0 COVER BA41-00809/810A
MODULE CODE LAST EDIT
undefined September 8, 2007 12:02:16 PM PAGE 1 OF 53
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
FAN CPU
D Mobile Processor VRM D
PG 12
IMVP-6
Merom - 4M
CPU Charging
LCD Thermal (667MHz/800) PG 43
Circuit
Sensor
30P
PG 12 L2 Cache : 2 MB PG 39
PG 25 PG 9,10,11 478pin
LVDS PSB
667 MT/S
DDR II Switche PWR
CRT VRM
Ext. PEG
g l
External Graphics PG 44
PEG x16 PG 42
PG 27 CRT
AMD M64S
DDR II PG 18
GMCH-M
n a
SODIMM 0
Single channel DDR II 667/533
RS600M DDR II PG 18
u ti
Video Memory
1021 FCBGA SODIMM 1
ANT
GFx Board Internal Graphics PG 13 ~ 17
s n
C LVDS C
CRT/TV Wireless LAN
Direct Media Interface
x4/x2, 1.5V
Ext. - Int. Option
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Clocking MiniCARD CONN.
PG 30
m e
ICS95461
64 PIN MiniPCIE USB 6
PG 8
USB 5 4 IN 1 CARD
a id
AU6366 SD/xD/MS PG 28
USB 0,1,2
PG 37 USB 0,1,2 PG 28
ANT
S f
AUDIO SB600 USB 7
BT PG 30
Audio 549 BGA PCIE x1 Lane 2 26P
AZALIA AZALIA Primary USB 4 Express Card
AMP PG 29
Codec PG 29
ALC262 12P
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PG 32 PG 31
AZALIA
AZALIA Secondary
B RJ11 MDC PG 20 ~ 23 PCI LAN B
RTL8100CL RJ45
HP Modem
o
PG 37
PG 36-37
MIC-IN PG 37 PG 37
PG 33
SPI SPI
C
2P
MX25L8005
Pri. IDE slave
PG 25
SATA PG 38
SPKR R
PG 34
HDD CD-ROM Touch
PG 32 SATA MICOM PAD
PG 34 3.3V LPC, 33MHz
Hitachi H8S
H8S-2110B KBD
PG 35 PG 38
A A
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
Power Diagram
KBC3_SUSPWRON KBC3_PWRON KBC3_VRON VCCP3_PWRGD
D D
AC Adapter MEROM
P1.05V NB CPU_CORE
P12.0V_ALWS SB
P1.5V (VCCP_CORE) MEROM
VDC P5.0V_ALWS
g l
P1.8V_AUX P1.8V
P1.2V_ALWS
n a
Battery DC
P1.2V
P3.3V_MICOM
C
u ti
s n
P1.2V_ALWS
P0.9V C
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m e
P5.0V_AUX P5.0V
a id
S f
P3.3V_AUX
P2.5V_LAN
P3.3V
B
o n B
C
Rail
State +V*Always +V*AUX +V SUSPWR PWRON VRON
Full On ON ON ON H H H
S3 ON ON OFF H L L
S4 ON ON OFF H L L
S5 ON OFF OFF L L L
S5 / S4 S3 S0
A A
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER SEQUENCE
VDC
ADT3_SEL
D D
P3.3V_MICOM
KBC3_RST*
P5.0V_ALWS
P1.2V_ALWS
PRTC_BAT T1
KBC3_PWRSW*
g l
KBC3_SUSPWRON T2=10mS
P5V_AUX/P3.3V_AUX/P1.8V_AUX/1.2V_AUX
n a
u ti
KBC3_RSMRST*
MEM1_VREF
KBC3_PWRBTN*
T3=40mS
T5=10mS
T14=50mS
s n
C T16=170mS C
CHP3_SLPS5*
T4=120mS
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CHP3_SLPS3* T5=3mS
m e
KBC3_PWRON
T15=30mS
KBC3_CLKPWRGD#
a id
S f
P5.0V
PWRON
P1.8V/P1.5V/P0.9V/P1.2V
KBC3_RUNSCI#
KBC3_VRON
n
T6=100mS
B VCCP_CORE B
o
VCCP3_PWRGD
CPU_CORE
C
VRM3_CPU_PWRGD T8=50mS
KBC3_NBPWRGD T7=15mS T9=110mS
KBC3_SBPWRGD
T10=(47-66)mS
CPU1_PWRGDCPU
CHP3_ALINK_RST* T11=80nS
PCI3_RST* T12=72mS
CPU1_CPURST* T13=73mS
A A
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ELECTRONICS
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4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER RAILS ANALYSIS
ADAPTER
D 220V BATTERY D
MAX1909ETI+T
g l
n a ISL6227CAZ-T
P1.2V
VCCP_CORE
u ti P0.9V
19V
s n
C C
P5.0V_ALWS P1.5V
MIC5219
MAX8632ETI+
P1.8V_AUX P1.8V
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FDS6680A
m e
a id MAX8734AEEI+T
P3.3V_AUX FDS6680A
P3.3V
S f P5.0V_ALWS
P5.0V_AUX SI4435DY
P5.0V
SC452
CPU_CORE
n
MAX8734
B B
o
P3.3V_MICOM
P1.2V_ALWS
C
MIC5258
MIC5219B
A A
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ELECTRONICS
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
CLK0_HCLK0
CLK0_HCLK0* MEROM
CLK0_HCLK1
CLK0_HCLK1#
CLK1_PCIEICH
RS600MF
g l
CLK1_PCIEICH#
CLK1_PCIENB
n a
CLK1_PCIENB#
CLK3_NB14M
C
u ti
s n
CLK1_PCIEGFX
M64S
C
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CLK1_PCIEGFX#
m e
a id
CLOCK GENERATOR CLK1_PCIERCLK
CLK1_PCIERCLK#
CLK3_PCLKLAN
CLK3_DBGLPC
RTL8100
S f
DEBUG CARD
SB600
CLK3_USB48 CLK3_PCLKMICOM 10MHz
MICOM
n
B CLK3_ICH14 25MHz
B
C o CLK1_EXPCARD
CLK1_EXPCARD#
CLK1_MINPCIEB
CLK1_MINPCIEB#
EXP CARD
MINI CARD
14.318 MHz
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION
D D
PCI Devices Crystal / Oscillator
Devices IDSEL# REQ/GNT# Interrupts TYPE FREQUENCY DEVICE USAGE
AD21 1 Crystal 32.768KHz SB600 Real Time Clock
LAN G Crystal 10MHz MICOM HD64F2110B
USB AD30(internal) - - Crystal 14.318MHz CLOCK-Generator ICS95461
- Crystal 12MHz AU6366 4 IN 1 CARD
- Crystal 25MHz LAN LOM
Hub to PCI AD31(internal) - -
g l
LPC bridge/IDE/AC97/SMBUS AD31(internal) - -
Internal MAC AD31(internal) - -
AC Link - - -
CPU Core Voltage Table
n a
IMVP-6
Voltage Rails
Active/Deeper Sleep
u ti
CPU_CORE CPU Active Mode Deeper Sleep/Extended Deeper Sleep
Dual Mode Region
VCCP_CORE CPU RS600 SB600 Dual Mode Region
P1.2V RS600 SB600
VID(6:0) Voltage VID(6:0) Voltage VID(6:0) Voltage
s n
C C
P1.5V CPU EXPCARD 0 0 0 0 0 0 0 1.5000 V 0 1 0 1 0 0 0 1.0000 V 1 0 1 0 0 0 1 0.4875 V
P1.8V RS600 0 0 0 0 0 0 1 1.4875 V 0 1 0 1 0 0 1 0.9875 V 1 0 1 0 0 1 0 0.4750 V
P0.9V DDR2 0 0 0 0 0 1 0 1.4750 V 0 1 0 1 0 1 0 0.9750 V 1 0 1 0 0 1 1 0.4625 V
P5.0V FAN THERMAL CRT SB600 AU6366 MINIPCI ALC262 HDD ODD MICOM USB TOUCH-PAD CPU_CORE 0 0 1
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0 0 0 0 1 1 1.4625 V 1 0 1 0 1 1 0.9625 V 0 1 0 1 0 0 0.4500 V
P3.3V SYSTEM POWER 0 0 0 0 1 0 0 1.4500 V 0 1 0 1 1 0 0 0.9500 V 1 0 1 0 1 0 1 0.4375 V
P2.5V_LAN RTL8100 0 0 0 0 1 0 1 1.4375 V 0 1 0 1 1 0 1 0.9375 V 1 0 1 0 1 1 0 0.4250 V
m e
0 0 0 0 1 1 0 1.4250 V 0 1 0 1 1 1 0 0.9250 V 1 0 1 0 1 1 1 0.4125 V
0 0 0 0 1 1 1 1.4125 V 0 1 0 1 1 1 1 0.9125 V 1 0 1 1 0 0 0 0.4000 V
P1.8V_AUX DDR2 P1.8V RS600 0 0 0 1 0 0 0 1.4000 V 0 1 1 0 0 0 0 0.9000 V 1 0 1 1 0 0 1 0.3875 V
P5.0V_AUX THERMAL LCD P1.2V P5.0V 0 0 0 1 0 0 1 1.3875 V 0 1 1 0 0 0 1 0.8875 V 1 0 1 1 0 1 0 0.3750 V
a id
0 0 0 1 0 1 0 1.3750 V 0 1 1 0 0 1 0 0.8750 V 1 0 1 1 0 1 1 0.3625 V
P3.3V_AUX MDC MICOM MINIPCI EXP-CARD SB600 THERMAL 0 0 0 1 0 1 1 1.3625 V 0 1 1 0 0 1 1 0.8625 V 1 0 1 1 1 0 0 0.3500 V
0 0 0 1 1 0 0 1.3500 V 0 1 1 0 1 0 0 0.8500 V 1 0 1 1 1 0 1 0.3375 V
P12.0V_ALWS P1.5V P3.3V P1,8V 0 0 1
0 0 1 1 0 1 1.3375 V 1 1 0 1 0 1 0.8375 V 0 1 1 1 1 0 0.3250 V
P5.0V_ALWS P3.3V DDR2-PWR 0 0 0 1 1 1 0 1.3250 V 0 1 1 0 1 1 0 0.8250 V 1 0 1 1 1 1 1 0.3125 V
P3.3V_MICOM THERMAL SB600 MICOM LED P1.8V_ALWS
S f
0 0 0 1 1 1 1 1.3125 V 0 1 1 0 1 1 1 0.8125 V 1 1 0 0 0 0 0 0.3000 V
P1.2V_ALWS SB600,P1.2V 0 0 1 0 0 0 0 1.3000 V 0 1 1 1 0 0 0 0.8000 V 1 1 0 0 0 0 1 0.2875 V
0 0 1 0 0 0 1 1.2875 V 0 1 1 1 0 0 1 0.7875 V 1 1 0 0 0 1 0 0.2750 V
0 0 1 0 0 1 0 1.2750 V 0 1 1 1 0 1 0 0.7750 V 1 1 0 0 0 1 1 0.2625 V
VDC Primary DC system power supply (7 to 21V) 0 0 1 0 0 1 1 1.2625 V 0 1 1 1 0 1 1 0.7625 V 1 1 0 0 1 0 0 0.2500 V
0 0 1 0 1 0 0 1.2500 V 0 1 1 1 1 0 0 0.7500 V 1 1 0 0 1 0 1 0.2375 V
2 0 0 1 0 1 0 1 1.2375 V 0 1 1 1 1 0 1 0.7375 V 1 1 0 0 1 1 0 0.2250 V
0 0 1 0 1 1 0 1.2250 V 0 1 1 1 1 1 0 0.7250 V 1 1 0 0 1 1 1 0.2125 V
I C / SMB Address 0
0
0 1
1
0 1 1 1 1.2125 V 0
1
1 1
0
1 1 1 1 0.7125 V 1
1
1 0
0
1 0 0 1
0 0.2000 V
0 1 0 0 0 1.2000 V 0 0 0 0 0 0.7000 V 1 1 0 0 1 0.1875 V
n
Devices Address Hex Bus 0 0 1 1 0 0 1 1.1875 V 1 0 0 0 0 0 1 0.6875 V 1 1 0 1 0 1 0 0.1750 V
0 0 1 1 0 1 0 1.1750 V 1 0 0 0 0 1 0 0.6750 V 1 1 0 1 0 1 1 0.1625 V
SB600 Master - SMBUS Master 0 0 1 1 0 1 1 1.1625 V 1 0 0 0 0 1 1 0.6625 V 1 1 0 1 1 0 0 0.1500 V
B EMC6N300(CPU Thermal Sensor) 1001 110X 9Ch Thermal Sensor 0 1 1 0 1 0
B
0 1 1 0 0 1.1500 V 0 0 1 0 0 0.6500 V 1 1 1 0 1 0.1375 V
SODIMM0 1010 0000 A0h - 0 1 1 0 1 0
o
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