Service Manuals, User Guides, Schematic Diagrams or docs for : . Various R423
<< Back | HomeMost service manuals and schematics are PDF files, so You will need Adobre Acrobat Reader to view : Acrobat Download Some of the files are DjVu format. Readers and resources available here : DjVu Resources
For the compressed files, most common are zip and rar. Please, extract files with Your favorite compression software ( WinZip, WinRAR ... ) before viewing. If a document has multiple parts, You should download all, before extracting.
Good luck. Repair on Your own risk. Make sure You know what You are doing.
Image preview - the first page of the document
>> Download R423 documenatation <<
Text preview - extract from the document
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
Table of Contents
EXCEPT AS AUTHORIZED BY SAMSUNG.
Page. 1 COVER
Page. 2 OPERATION BLOCK DIAGRAM
Page. 3 BOARD INFORMATION
D Page. 4 POWER DIAGRAM D
Page. 5 POWE RAILS ANALYSIS
Page. 6 TIMING DIAGRAM,POWER ON
Page. 7 CLOCK DISTRIBUTION
SUZHOU-D Page. 8
Page. 9
THERMAL SENSOR&FAN CONTROL
CLOCK GEN.
Page. 10~12 S1g3 CPU
Page. 13~15 RX881M
g l
Page. 16~17 SODIMM DDR2
CPU :AMD Caspin Page. 18~22 SB710
n a
Page. 23 SPI_BIOS_ROM
Chip Set :AMD RX881+SB710 Page. 24~27 PARK-S3
u ti
Page. 28~29 gDDR3
Remarks : Tigris Platform Page. 30 LVDS (LCD CONNECTOR)
Page. 31 CRT CONNECTOR
s n
C C
Page. 32 HDMI CONNECTOR
Page. 33 MICOM
Model Name : Suzhou-D Page. 34 KBD CONN & TOUCHPAD
m e
Page. 35 LED LOGIC
PBA Name : MAIN Page. 36~37 AUDIO
a id
Page. 38 LOM(Marvell 88E8040)
PCB Code : GCE : Page. 39 WLAN
Page. 40 MEMORY CARD (AU6336)
S f
NAN : Page. 41 EXPRESS CARD
Page. 42 HDD & ODD
HAN : Page. 43 MDC CONN. & BLUETOOTH
Page. 44 USB CONNECTOR
n
Dev. Step : PV Page. 45 SUB BOARD_POWER SWITCH
B Page. 46 CHARGER B
o
Revision : 1.0 Page. 47 P3.3V_AUX & P5.0V_AUX & P12V_ALW
Page. 48 DDR2 POWER & P0.9V_AUX
T.R. Date : 2009.11.10 Page. 49 CPU VRM
C
Page. 50~51 CHIPSET POWER(P1.1V & P1.2V)
Page. 52 GFX POWER
Page. 53 gDDR3 POWER & P1.0V
Design CHECK APPROVAL Page. 54 SWITCHED POWER
(P5.0V & P3.3V &P 2.5V & P1.8V & P1.2V_AUX)
Page. 55 POWER DISCHARGER
Page. 56 MOUNT HOLE
XIE BIN GUO LEI BC LEE
Page. 57 TEST POINT
A A
DRAW DATE TITLE
CHECK
XIE BIN
DEV. STEP
08/18/2009
Suzhou-D SAMSUNG
ELECTRONICS
GUO LEI ADV MAIN
APPROVAL REV PART NO.
COVER
Owner : SEC Mobile R & D Signature : X MODULE CODE
BC LEE
LAST EDIT
0.1 BA41-xxxxxxA
July 15, 2009 19:25:13 PM PAGE 1 OF 58
4 3 2 1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
CPU Charging Smart P1.8V_AUX
VRM Circuit Battery P0.9V_AUX
FAN
D Mobile Processor PG 49 PG 46 Module PG 53 D
P5V_AUX PG 8
P3.3V_AUX P1.1V / P1.2V Clocking
AMD Caspian CPU
PG 9
PG 47 PG 50~51
CPU
(s1g3 socket) Channel A (Reverse) DDR II 667/800 DDR II PG 16
Thermistor 636pin SODIMM 0
Dual channel DDR II Power
PG 8 PG 10~12 L2 Cache : 2M/1M/512K DDR II PG 17
PG 48
Channel B (Reverse) DDR II 667/800 SODIMM 1
HyperTansport Gen3
GFX CORE
g l
PG 52
PG 32 HDMI PCIE x1 Lane 2
8040 RJ45 PG 38
North Bridge PG 38
n a
52P
HDMI RX881 PCIE x1 Lane 0
ANT
Ext. PEG Mini Card 1 (WLAN)
LCD
u ti
PG 30 PG 30 PEG x16 External Graphics
LCD PARK-S3 PG 39
528 FCBGA
PG 18~21
CRT PG 13~15
s n
C PG 31
C
CRT
PCIE x1 Lane 1
Express Card
PG 41
m e
PCIEXPRESS
X4
High Definition Audio
HDAUDIO
Audio
ALC269
a id
S f
eSATA
Camera
12P
HD Primary
SATA4
USB 8
SB710
528 BGA
PG 24 - 28
USB 4
USB 0,1,6
USB 0,1,6 PG 44,45
n
HD Secondary USB 5
B PG 36 RJ11 MDC Bluetooth ANT PG 43 B
Modem
o
PG 43
INT MIC 3 IN 1
PG 37 USB 4
HP SPI
C
PG 29 SPI ROM AU6336
MIC-IN PG 40
LPC
SATA 0
2P 2P PG 42 SATA HDD
PG 36 SATA 1
PG 42 SATA ODD
Touch
MICOM PAD
3.3V LPC, 33MHz
SPKR R PG 34
MEC1308-NU
PG 33 TMKBC (TBD) KBD
A A
SPKR L
DRAW DATE TITLE
80 Port
LED PG 35
CHECK
XIE BIN
DEV. STEP
08/18/2009
Suzhou-D SAMSUNG
ELECTRONICS
GUO LEI ADV MAIN
APPROVAL REV PART NO.
PG 29 BC LEE 0.1 BLOCK DIAGRAM BA41-xxxxxxA
MODULE CODE LAST EDIT
July 15, 2009 19:25:13 PM PAGE 2 OF 58
4 3 2 1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
BOARD INFORMATION
D D
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION
g l
Voltage Rails Crystal / Oscillator
TYPE FREQUENCY DEVICE USAGE
n a
Crystal 32.768KHz SB710 Real Time Clock
VDC Primary DC system power supply (7 to 21V) Crystal 10MHz MICOM MEC1308-NU
CPU_CORE0 Core Voltage for CPU Crystal 14.318MHz CLOCK-Generator CK-505
CPU_CORE1 Core Voltage for CPU Crystal 25MHz LAN 88E8040
u ti
EGFX_CORE Core Voltage for GPU Crystal 25MHz SATA SB710
P1.1V VTT for M92,RX881
P1.2V Core Voltage for SB710
P3.3V_MICOM 3.3V always power rail (for Micom)
P1.5V 1.5V switched power rail (off in S3-S5)
s n
C P1.8V 1.8V switched power rail (off in S3-S5)
C
P1.8V_AUX 1.8V power rail for DDR (off in S4-S5)
P0.9V_AUX 0.9V power rail for DDR (off in S3-S5)
P3.3V 3.3V switched power rail (off in S3-S5)
P3.3V_AUX 3.3V switched on power rail (off in S4-S5)
P5.0V 5.0V switched power rail (off in S3-S5)
m e
P5.0V_AUX 5.0V switched on power rail (off in S4-S5)
P5.0V_STB 5.0V always power rail
P12.0V_ALW 12.0V always power rail
a id
2
I C / SMB Address
S f
Devices Address Hex Bus
SB710 Master - SMBUS Master
CPU Thermal Sensor 0111 101x 7Ah Thermal Sensor
SODIMM0 1010 000x A0h -
SODIMM1 1010 010x A4h -
Thermal Sensor on SODIMM0 0011 000x 30h -
Thermal Sensor on SODIMM1 0011 010x 34h -
CK-505M (Clock Generator) 1101 0010 D2h Clock, Unused Clock Output Disable
n
B USB PORT Assign PCI Express Assign B
o
PORT # ASSIGNED TO PORT # ASSIGNED TO
0 SYSTEM PORT 0
1 SYSTEM PORT 1
2 NC 0 Mini Card (WLAN)
3 NC 1 EXPRESS CARD
4 3 IN 1 2 LOM
C
5 Bluetooth 3 NC
6 SYSTEM PORT 2 4 NC
7 NC 5 NC
8 Camera
9 NC
10 EXPRESS CARD
REVISION HISTORY
LCD Pannel Detect (TBD)
Devices Resolution PANNEL_DETECT_0(strap0)
A See rev notes for more information. A
DRAW DATE TITLE
CHECK
XIE BIN
DEV. STEP
08/18/2009
Suzhou-D SAMSUNG
ELECTRONICS
GUO LEI ADV MAIN
APPROVAL REV PART NO.
BC LEE 0.1 BOARD INFORMATION BA41-xxxxxxA
MODULE CODE LAST EDIT
July 15, 2009 19:25:13 PM PAGE 3 OF 58
4 3 2 1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER DIAGRAM Rev 0.1
D D
KBC3_SUSPWR KBC3_PWRON KBC3_VRON
(CHP3_S4_STATE*) (CHP3_SLPS3*)
AC Adapter
RX881
PARK
g l
P1.8V CPU_CORE0,1 S1G3
Battery DC VDC P1.8V_AUX AMD S1G3
SODIMM (DDR II)
gDDR-3 for PARK
eSATA Reapter
AU6336
n a
u ti
P5V_AUX USB connector
P5.0V
THERMAL CRT
SB710
ODD
TOUCH PAD
MICOM
HDD
HDMI
AUDIO
CAMERA
P1.2V
S1G3
RX881
SB710
s n
C C
RX881
P1.1V PARK
P3.3V_MICOM P0.9V_AUX EGFX_CORE
m e
DDR II-Termination PARK
MICOM LED SB710
a id
S f
P5.0V_STB
P1.2V_AUX
P3.3V_AUX
SB710
SB710
EXPRESS CARD
WLAN
LAN
MDC
THERMAL
P1.0V PARK
CK505
n
LVDS
USB N Charger LED P1.5V WLAN
EXPRESS CARD
B B
Power On/Off Table by S-state
State
Rail
S0 S3 S4 S5
Co
P12.0V_ALW
P1.2V_LAN
LAN
P2.5V
P3.3V
S1G3
CK505
DDR2
LVDS
SPI
LAN
THERMAL
PARK
HDMI
WLAN
AUDIO
RX881
CRT
SB710
LEDS
EXPRESS CARD
HDD BT AU6336
+V*A(LWS)
ON ON ON ON
+V*LAN
+1.8V_AUX
ON ON
S5-S4 S3 S0
A +0.9V_AUX A
+V*AUX ON ON DRAW DATE TITLE
+V ON CHECK
XIE BIN
DEV. STEP
08/18/2009
Suzhou-D SAMSUNG
ELECTRONICS
GUO LEI ADV MAIN
+V* (CORE) ON APPROVAL REV PART NO.
BC LEE 0.1 POWER DIAGRAM BA41-xxxxxxA
MODULE CODE LAST EDIT
July 15, 2009 19:25:13 PM PAGE 4 OF 58
4 3 2 1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER RAILS ANALYSIS
220V
Rev. 0.6 (060920)
D D
1.2V_AUX ( TBD A )
Adapter Battery
3.3V_AUX ( TBD A )
MICOM 3V ( TBD A )
1.8V ( TBD A )
g l
CPU CORE MICOM 3V
CPU CORE ( TBD A )
1.8V_AUX
41 A (TBD) S1G3 3.3V
0.75 A (TBD)
Thermal
3.3V
0.08 A (TBD)
0.08 A (TBD)
KBC
1.8V_AUX ( TBD A ) 4.5 A (TBD) Sensor
( 35 W )
n a
1.5V ( TBD A ) 0.13 A (TBD)
1.1V ( TBD A )
3.3V ( TBD A ) MICOM 3V
5.0V ( TBD A ) 0.1 A (TBD) PWR LED
1.2V
u ti
1.2V ( TBD A ) 7.7 A (TBD)
1.1V
0.9V_AUX( TBD A ) 4.48 A (TBD) RX881 1.8V
◦ Jabse Service Manual Search 2024 ◦ Jabse Pravopis ◦ onTap.bg ◦ Other service manual resources online : Fixya ◦ eServiceinfo